Rohm Semiconductor 的 VQFN20 Taping Spec 规格书

TSZDZZO1-M2FN20—1-2
Package Information : VQFN20
　　　　
　　　　　 　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　
1.　Package Information
　　　　　　　　　　　　　　　　　　　　
　　Package Name VQFN20
　　 　　Type 　　　QFN
　　 　　Pin Count 　　　20
　　 　　Outline Dimension
Drowing No. 　　　EX347-5001-2
　　 　　Package Weight [g] 　　　0.04
　　 　　Lead Finish 　　　Pure Tin
　　 　　MSL Level 　　　Level3
　 　 　 　 　 　 　 　 　 　
　 　
　 　
　　　
　　　 　　　　　　　　　　　　　　　　　　
　 　 　　 　 　 　 　 　 　 　 　 　
　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　
　　 　　　　　　　　　　　　 　　　　　　　　　
2.　Package Structure
　　　　 　　　　　　　　　　 　　　　　　　　　
　 　 　
　　　　
　　　　
　　　　
　　　　
　　　　
　 　
　
　　　
　 　
　　　
　 　 　 　
　　　　　
　　　
　 　
　 　
　　 　　　　　　　
　　 　　　　　　　
　 　 　　 　 　　　　　　　
　　 　　 　　　　　　　
　　 　　 　　　　　　　
　　 　　 　　　　　　　
　　 　　 　　　　　　　　　　　　　　　　　　
　　 　　 　　　　　　　　　　　　　　　　　　
　　 　　 　　　　　　　　　　　　　　　　　　
　　　　　　　　　　　　　　　　　　　　　　　　　 　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Not Recommended for
New Designs
Package Information Pocket Quadrants Reel FIgJ Quadrant ASSIgnments for PIN 1 Onenlanon In E2 ’ PIN1 rs placed to the top left corner TR . PIN1 Is op "gm comer TL , PIN1 rs placed to (he rower Ien. E1 PIN1 a me lower "gm. 9 box pec'rfication No com are200 mm or 3.4 Trailer sp ificatio an ponent pockets are re. 3.5 P Ifienglh tape peelback strength is 0.2 Peelback 165 to 180“ 3001’ I Dmm/min (S TSZDZZO1-M3FN20-1-2
VQFN20 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.　Packing Specification
3.1 Packing form, Quantity, PIN1 Orientation
Packing Form Tape&Reel
Packing Quantity [pcs] 2,500
PIN 1 Orientation E2
3.2 Use material
　Item Material
Embossed carrier tape PS
Cover tape PET+PE
Reel PS
Desiccant Silicagel
Envelope Aluminum-laminated
Unit box Cardboard
　Shipping box Cardboard
3.3 Leader specification
No component pockets are200 mm or more.
3.4 Trailer specification
No component pockets are 80 mm or more. Tape is free from reel.
3.5 Peelback strength
Cover tape peelback strength is 0.2 N to 0.7 N.
Fig. 2 Test method
3.6 Missing Ics
(1) No consecutive dropouts.
(2) A maximun 0.1 % of specified number of products in each packing may be missing.
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Not Recommended for
New Designs
Package lnfon'nation 1.75 5.50 1.60 a 12.0 .1l-0 10.1 30.1 10.05 :01 10.1 30.05 10.05 TSZDZZO1-M2FN20—1-2
VQFN20 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.7 Tape and Reel Specification
3.7.1 Tape Dimension
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Not Recommended for
New Designs
TSZDZZO1-M2FN20—1-2
VQFN20 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.7.2 Reel Dimension
(unit:mm)
　　　　　 Reel Dimension 　　　　　 Reel Tolerance 　　　
　A　330 　　　　　 -　　　
B 50 MIN
C 13 ±0.2
D 20.2 MIN
E 1.5 MIN
W1 13.4 ±1.0
　W2 　17.4 　　　　　 ±1.0 　　　
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Not Recommended for
New Designs
Label Unil box (Unitmm) Reel desiccant . " ° ‘ _ 3 ‘ umlnum—lamlnaled envelope La el 3.10 Label Specific 0 wroduct No. 0 0m going inspemion stamp BX1 2 -XX {IIII IIIIIIIIIIIIIIIII 2,000pcs D124 A5110F BX1234XXX—XX MNU 124 023 W3 4 MNU 124 024 PCS & MADE 1N PMUPPMS _ Internal product code Marking lot number Pb Free Mafk uantity Lot number
VQFN20 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.8 Packing Method
1reel(s) or less per unit box
3.9 Packing Style
5unit boxes or less per shipping box
(unit:mm)
Shipping Box Dimension
X 347
Y 353
　Z　　287
3.10 Label Specification
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Not Recommended for
New Designs
Package Information TSZDZZO1-M3FN20-1-2
VQFN20 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
4.　Footprint dimensions
(unit:mm)
In actual design, please optimize in accordance with the situation of your board design and soldering
condition.
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Not Recommended for
New Designs
Package lnfon'nation |— Production Ioi number Production week code Producfion year 00x0 torage period until soldering 9‘ Min. . Lmit - hour is a time from moistu I il th ess e follow ceptabie time" where it is necsfis Case 1 : in exc Case 2 ' Peeiba TSZDZZO1-WFN20—1-2
VQFN20 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
5.　Marking Specification
6.　Storage conditions
6.1 Storage environment
Recommended storage conditions
　　　　　　　　　 Min. 　Max. 　 　 Unit
　Temperature 5 30 °C
　Humidity 40 　70 　 　 % RH
6.2 Storage period
　　　　　　　　　Min. 　Max. 　 　 Unit
　Storage period - 　1　 　 year
6.3 Specified storage period until soldering
　　　　　　　　　 Min. 　Max. 　 　 Unit
　Acceptable time - 　168 　 　 hour
The above value is a time from opening the moisture-proof packaging until the soldering.
Cases where it is necessary to perform the drying process is the following.
Case 1 : in excess of the above-mentioned "Acceptable time"
Case 2 : it has passed more than a year not open
Recommended the dry process conditions
　　　　　　　　　　　　　　　　 Temperature [°C] 　 　 Time [hour] 　
Reel(Note1) 60 　72
Other Heat-proof container 　125 　　　 24 　
(Note1) When carrying out the dry process in a "Reel" state, the peelback strength will change.
Please refer to the following values:
　　　　　　　　　　　　 Min. Max. 　　　 Unit
　Peelback strength 0.2 0.9 　　　 N
The drying process is the impact on the solderability because the oxidation of the terminal portion
will occur. Therefore, specify the maximum times of the dry processing as follows:
Recommended execution count of the dry process
　　　　　　　　　 Min. 　 　 Max. 　Unit
　Execution count - 　 　 2　times
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Not Recommended for
New Designs
Package sur'ace temperature Soldering temperature 1~4" C/sec Preheafing (empelalule \ 260. CMAX 255' C \ \. Preheatina ‘emperatule , 130“c~190“c Preheamng zone . 120m MAX Solderinu temperature nub-23W Soldering zone , sasec MAX (Noucep Maxllmum 2-llmec ”mung 0 Time 10secMAX Preheanng zone Sol ’9 9 allowed or it mold crack and 9‘51. 0
VQFN20 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
7.　Soldering conditions
7.1 Recommended temperature profile for reflow
7.2 For wave soldering
The wave soldering method is not supported.
7.3 For solder iron
Rework by soldering iron is not allowed or it may cause mold crack and terminal open.
　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Not Recommended for
New Designs
Package lnfon'nation < not="" recommended=""> |:> Flexible film luck of direction is 0 usage is recom me outer lead direction board bendin 0° e4: 0 0’5 TSZDZZO1-M2FN20—1-2
VQFN20 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
7.4 Caution for solder mounting
7.4.1 For mounting on flexible film
Mounting on flexible film, film bend may occur lack of lead from package,
usage of support board and under fill is recommended.
7.4.2 For Mounting long and narrow board
Mounting on long and narrow board, bending stress may occur a luck of
lead from package, bending board direction and outer lead direction is
recommended as drawing (vertically layout) and under fill usage is recommended.
　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Not Recommended for
New Designs
emicanr take saiety redundant nd M snaii ha p the rating specii torniation contain the Products. T ass production. rein are helal oi and or implicitly‘ or any other in oi the use of to show the typ' s not gra on. or other rights ii ever ior any disp ' iectmnic equip 0A devices com ent sets) as s applications indi% ment are not design adiation toierant. ' degree at reiiabili piiiied emalive : trans ort ment (Le. t, traflic iights. 1““ n. safety power transmissiong ch as aero in applications requi ' i have no respo ham non ended usage c in. HM has used ie the intornia nient. However o prmation is snail have no resp iniormation. 12) ots in accordance Directive. For mo oiogies conta d prp tion the us SEMIcoNuUcTcR
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© 201 ROHM Co., Ltd. All rights reserved.
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Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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Not Recommended for
New Designs