Rohm Semiconductor 的 HTSOP-J8 Package Information 规格书

ROHm Bonding Wire Molding Resm Die Die Altach Die Pad
Package Information : HTSOP-J8
　　　　
　　　　　 　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　
1.　Package Information
　　　　　　　　　　　　　　　　　　　　
　　Package Name HTSOP-J8
　　 　　Type 　　　SOP
　　 　　Pin Count 　　　8
　　 　　Outline Dimension
Drowing No. 　　　EX169-5001
　　 　　Package Weight [g] 　　　0.048
　　 　　Lead Finish 　　　Pure Tin
　　 　　MSL Level 　　　Level1
　 　 　 　 　 　 　 　 　 　
　 　
　 　
　　　
　　　 　　　　　　　　　　　　　　　　　　
　 　 　　 　 　 　 　 　 　 　 　 　
　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　
　　 　　　　　　　　　　　　 　　　　　　　　　
2.　Package Structure
　　　　 　　　　　　　　　　 　　　　　　　　　
　 　 　
　　　　
　　　　
　　　　
　　　　
　　　　
　 　
　
　　　
　 　
　　　
　 　 　　
　　　　　
　　　
　 　
　 　
　　 　　　　　　　
　　 　　　　　　　
　 　 　　　 　　　　　　　
　　 　　 　　　　　　　
　　 　　 　　　　　　　
　　 　　 　　　　　　　
　　 　　 　　　　　　　　　　　　　　　　　　
　　 　　 　　　　　　　　　　　　　　　　　　
　　 　　 　　　　　　　　　　　　　　　　　　
　　　　　　　　　　　　　　　　　　　　　　　　　 　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/14 - Rev. 001
Package Information Direction 0! feed Pocket Quadranls —> Reel Hg 1 DuadramAssvgnmentsVor PW 1 Onentanan m Tape E2 PIN1 ‘5 placed «a the top lefl corner TR PW! Is p‘aced to the lap "gm corner TL PW! vs placed wme \owerlefl E1 PM ‘5 p‘aced tome lower ngm Pee‘back 16510 180’ Pee‘back speed 300i10mm/mvn 3L 35 TSZDZZO1-I-FI'SOP—J8—1-2
HTSOP-J8 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.　Packing Specification
3.1 Packing form, Quantity, PIN1 Orientation
Packing Form Tape&Reel
Packing Quantity [pcs] 2,500
PIN 1 Orientation E2
3.2 Use material
　Item Material
　Embossed carrier tape PS
Cover tape PET+PE
Reel PS
Air cap PE
Unit box Cardboard
　Shipping box Cardboard
3.3 Leader specification
No component pockets are320 mm or more.
3.4 Trailer specification
No component pockets are 80 mm or more. Tape is free from reel.
3.5 Peelback strength
Cover tape peelback strength is 0.2 N to 0.7 N.
Fig. 2 Test method
3.6 Missing Ics
(1) No consecutive dropouts.
(2) A maximun 0.1 % of specified number of products in each packing may be missing.
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/14 - Rev. 001
Package Information A0 A1 BO B1 D0 D1 K0 K1 P0 P1 P2 _. A0 Tape Dimension 6.45 6 3 4.00 5.30 5.20 2.50 (111 5 (421.5 1 75 5.50 1.55 1 15 4.00 B 00 2.00 0.30 12.0 (unit mm) Tape Tolerance $0.1 $0.1 $0.2 10.1 $0 1 10.2 ”11/43 +0 1/-0 $0.1 $0 05 $0.1 $0.1 $0.1 $0.1 $0 05 $0.05 $02 TSZDZZO1-1-FI'SOP—JB-1-2
HTSOP-J8 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.7 Tape and Reel Specification
3.7.1 Tape Dimension
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/14 - Rev. 001
TSZDZZO1-I-FI'SOP—J8-1-2
HTSOP-J8 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.7.2 Reel Dimension
(unit:mm)
　　　　　 Reel Dimension 　　　　　 Reel Tolerance 　　　
　A　330 　　　　　 ±2.0 　　　
B 80 ±1.0
C 13 ±0.2
D 21 ±0.8
E 2 ±0.5
W1 13.5 ±1.0
　W2 　17.5 　　　　　 ±1.0 　　　
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/14 - Rev. 001
Package Information Unit box (Unitzmm) X Labe‘ Product No. Oul going inspeclion stamp Bx1234xxx-xx ( Quam"y\‘lllllllflllfl MIIIIIWIW 2000pcs 0124 A5110F Willllllllllllm mm; BX1234XXX xx W ( ) Lol number MNo «24 oz: 925 MND 12} D24 pas %v PH‘LIPP MES Imemal produd code Markmg lot number Pb Free Mark TSZDZZO1-H'I'SOP—J8—1-2
HTSOP-J8 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.8 Packing Method
1reel(s) or less per unit box
3.9 Packing Style
5unit boxes or less per shipping box
(unit:mm)
Shipping Box Dimension
X 372
Y 368
　Z　　305
3.10 Label Specification
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/14 - Rev. 001
3.90 1.20 (190.30 . 1.27 . 5—)! 0.75 <—> ' 1.20 ' 4.90 1.35 3.20
HTSOP-J8 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
4.　Footprint dimensions
(unit:mm)
In actual design, please optimize in accordance with the situation of your board design and soldering
condition.
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/14 - Rev. 001
Package Information \—. Production lot number Production week code Producxion year code TSZOZZO1-I-FI'SOP—J8-1-2
HTSOP-J8 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
5.　Marking Specification
6.　Storage conditions
6.1 Storage environment
Recommended storage conditions
　　　　　　　　　 Min. 　Max. 　 　 Unit
　Temperature 5 30 °C
　Humidity 40 　70 　 　 % RH
6.2 Storage period
　　　　　　　　　Min. 　Max. 　 　 Unit
　Storage period - 　1　 　 year
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/14 - Rev. 001
Package surface temperature 26° CMAX Pvehealmglempevamle 130‘c~190”c Preheaung zone 12059:: MAX Soldenng ‘emperzlme 22m ~ 230% Soldenng Empemm Solderlng zone 50sec MAX 1~4“ C/sec iNonce) \. Maxumum 2rumes somenng Preneaung tempevalule \ Time 10secMAX Preheahng Zone Soldenng Zone
HTSOP-J8 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
7.　Soldering conditions
7.1 Recommended temperature profile for reflow
7.2 Recommended condition for wave soldering
Preheating temperature : 120 °C to 150 °C
Preheating time : 60 sec MAX
Soldering temperature : 260 °C ±3 °C
Soldering time : 12 sec MAX
Notes for wave soldering
(1)Soldering time is provided for total soldering time in case of dual wave soldering.
(2) Do not use other soldering methods with wave soldering.
(3) Recommend to clean the board to eliminate flux, solder waste,
and other impurities for reliability, after soldering.
(4) Optimize soldering condition to prevent solder bridging.
(5) The heatsink may not be connected using wave soldering methods.
7.3 Recommended condition for solder iron
Solder iron temperature : 380 °C or less
Mounting time : 4 sec or less
Notes for solder iron
(1)The heatsink may not be connected using solder iron.
　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　
www.rohm.com 8/8 TSZ02201-HTSOP-J8-1-2
©2016 ROHM Co., Ltd. All rights reserved 2016/09/14 - Rev. 001
ROHm SEMICONDUCTOR
R1102
A
www.rohm.com
© 201 ROHM Co., Ltd. All rights reserved.
Notice
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Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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