Panasonic Electronic Components 的 EFO 3 Array Series 规格书

Panasonic EDDDD‘ IDDDD DDDDDDDKIDD f
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC166 –
E F O 4004
Product Code
Ceramic
Resonators
EFO
Nominal Oscillation
Frequency
4004
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
Type
Built-In Capacitors
Type with 3-terminals
SS
SM
BM
JM
4to13MHz
4to13MHz
12 to 20 MHz
16 to 20 MHz
30 to 50 MHz
4.00 MHz
16.93 MHz
20.00 MHz
40.00 MHz
(Example)
123456789101112
1695
2005
4005
E F O 3584
Product Code
Ceramic
Resonators
EFO
Nominal Oscillation
Frequency
3584
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
Type
Built-In Capacitors
Type with 3-terminals
S
B
2to13MHz
13.1 to 20 MHz
3.58 MHz
(Example)
123456789101112
1695 16.93 MHz
Ceramic Res o na tors, Chip Type
(3 Array Type)
Type: EFOS
Type: EFOB
Type: EFOSS
Type: EFOSM
Type: EFOBM
Type: EFOJM
Features
Encased in a ceramic package
High reliability against soldering heat and mechanical
stress
Moisture-proof sealing
1.2 mm maximum (SS/SM/BM/JM),
Designed for refl ow soldering
Flat-bottom plate for better mountings
Simplifi es oscillation circuits by reducing the number
of circuit parts
RoHS compliant
Handling Precautions (See Page 175 to 176)
Recommended Applications
Clock generator for microprocessors
Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
Explanation of Part Numbers
Part Number Frequency range
(MHz)
Frequency Temperature Characteristics
(–20 to +80 °C)
Built-in Capacitors
(Reference)
EFOS 2.00 to 8.39 ±0.2 % 33 pF
8.40 to 13.0 ±1.0 %
EFOB 13.1 to 20.0 ±0.5 % 33 pF
EFOSS 4.00 to 8.39 ±0.2 % 21 pF
8.40 to 13.0 ±0.3 %
EFOSM 4.00 to 8.39 ±0.2 % 33 pF
8.40 to 13.0 ±1.0 %
EFOBM 12.0 to 20.0 ±0.3 % 18 pF
EFOJM 16.0 to 20.0 ±0.5 % 10 pF
30.0 to 50.0 ±0.2 %
Packaging Specifi cations
See Page 169 to 177
01 Feb. 2009
Panasonic / E:fl::’* %+a /EJ§ ’ III* \ x x x 34
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC167 –
Oscillating Frequency
3–(1.00)
(7.30) (2.70)
7.80
1.20 max.
+0.50
–0.20
2.50±0.20 2.50±0.20
+0.30
–0.20
3.20
Serial No.
Te r minal
Electrodes
6–R(0.20)
(0.15)
6–(0.60)
4.50±0.20
1.20 max.
(1.60)
2.00±0.30
3–(0.55)
2–1.50±0.20
Serial No.
Oscillating Frequency
Te r minal
Electrodes
Oscillating Frequency
Serial No.
(7.30)
7.80+0.50
–0.20
1.60±0.20
(2.70)
3.20+0.30
–0.20
6-(1.30)
6–R(0.20)
2.50±0.20
6-(1.00)
2.50±0.20
Terminal
Electrodes
(5.00)
6–R(0.20)
6–(1.20)
6–(1.20)
(2.70)
5.50+0.50
–0.20 3.20+0.25
–0.15
1.90±0.20
1.60±0.20
1.90±0.20
Serial No.
Oscillating Frequency
Te r minal
Electrodes
3-0.9 to 1.2
4.2
2.5 2.5
3-0.8
2.6
1.51.5
1.6
3-0.55
3-1.2
4.2
1.9 1.9
[Type EFOS, EFOSM]
[Type EFOSS]
[Type EFOB]
Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFOS]·····2.0 to 13.0 MHz
[Type EFOSM]·····4.0 to 13.0 MHz
[Type EFOSS]·····4.0 to 13.0 MHz
[Type EFOB]·····13.1 to 20.0 MHz
01 Feb. 2009
Panasonic ‘ \ ‘ 7 r—-\ v r—-\ m ‘51::an TEENMUED (4‘ ‘ ‘ ‘ , , 6470 2a ‘ ‘ ‘ 340 an _ 370 a ‘ ‘ ‘24 351020 Em :_ [A —[A 3707mm
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC168 –
(3.90) (3.10)
3–(0.80)
1.20 max.
2–1.60±0.20
6–R(0.20)
+0.30
–0.20
3.60
+0.50
–0.20
4.40
Serial No.
Oscillating Frequency
Te r minal
Electrodes
4.10±0.20
1.20 max.
(2.40)
6–R(0.20)
(3.70)
2.90±0.30
3–(0.80)
2–1.35±0.20
Serial No.
Oscillating Frequency
Te r minal
Electrodes
3-0.8
3.9
1.351.35
3-0.7 to 1.0
4.6
1.6 1.6
Ceramic Resonator
+5V
14 13 11 9
7
5
2
For Oscillation Circuit
Frequency Counter
1M
3
1
IC
4
Ceramic Resonator
+5V
14 13 11 9
7
5
2
For Loop Gain
1M
1
IN 0.01
G=20 log (V0/V1)
V0
V1
OUT
FET probe
10 Mmin.
2pFmax.
T.G.
Output
=–20dBm
IC
4
3
[Type EFOJM]
[Type EFOBM]
[Type EFOJM]·····16.0 to 20.0, 30.0 to 50.0 MHz
Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFOBM]·····12.0 to 20.0 MHz
Test Circuits Diagram
Frequency IC
2.00 to 8.39 MHz
µPD4069UBC,
TC4069UBP
or similar
8.40 to 50.0 MHz
µPD74HCU,
TC74 HCU04AP
or similar
01 Feb. 2009
Panasonic
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC169 –
Type
EFOSM
Type
EFOJM
Type
EFOBM
–0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080
Temperature (°C)
Oscillation Frequency Drift
(%)
–0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080
Temperature (°C)
Oscillation Frequency Drift
(%)
–0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080
Temperature (°C)
Oscillation Frequency Drift
(%)
30 to 50 MHz
16 to 20 MHz
2.0 to 8.39 MHz
8.4 to 13 MHz
T
C
E
D
r
φB
Wt
φA
–0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080
Temperature (°C)
Oscillation Frequency Drift
(%)
2.0 to 8.39 MHz
8.4 to13MHz
–0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080
Temperature (°C)
Oscillation Frequency Drift
(%)
–0.8
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–20 020406080
Temperature (°C)
Oscillation Frequency Drift
(%)
Type EFOBType EFOS Type EFOSS
8.4 to 13 MHz
4.0 to 8.39 MHz
Typical Characteristics ····· Temperature Char ac ter is tics
Packaging Specifi cations
Standard Packing Quantity
Dimensions for Reel in mm (not to scale)
Type Embossed Taping Bulk
EFOS, EFOSM 2500 pcs./reel
500 pcs./bagEFOSS 2000 pcs./reel
EFOB , EFOBM, EFOJM
1000 pcs./reel
[Type EFOSS, EFOB, EFOBM, EFOJM]
[Type EFOS, EFOSM]
Dim.
(mm)
φAφBC D E
330±5 80 min. 13.0±0.5 21.0±0.8 2.0±0.5
Dim.
(mm)
WT t r
16.4+2.0 22.4 max. 3 max. 1.0
0
Dim.
(mm)
φAφBC D E
180±5 60 min. 13.0±0.5 21.0±0.8 2.0±0.5
Dim.
(mm)
WT t r
12.4+2.0 18.4 max. 3 max. 1.0
0
01 Feb. 2009
Panasonic
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC170 –
Feeding hole Chip pocket
Chip Componen
Tape running
direction
t
1
t
2
P
2
P
0
P
1
A
F
B
E
W
φD
0
3.20
7.80
FE
W
t
1
t
2
P
1
A
φD
0
2.00
4.50
P
0
P
2
B
Feeding hole
Chip pocket
Chip Component Tape running direction
Feeding hole
Chip pocket
Chip Component Tape running direction
F
B
E
W
t1
t2P2
P0
P1A
φD0
Type EFOJM
(Example)
3.60
4.40
[Type EFOS, EFOSM] [Type EFOSS]
Dim.
(mm)
ABWFEP
1
2.6±0.2 5.1±0.2 12.0±0.3 5.5±0.1
1.75±0.10
4.0±0.1
Dim.
(mm)
P2P0φD0t1t2
2.0±0.14.0±0.1 1.5
+0.1 0.6 max. 3.0 max.
0
Dim.
(mm)
ABWFEP
1
3.7±0.2 8.3±0.2 16.0±0.3 7.5±0.1
1.75±0.10
8.0±0.1
Dim.
(mm)
P2P0φD0t1t2
2.0±0.14.0±0.1 1.5
+0.1 0.3 3.5 max.
0
[Type EFOB, EFOBM, EFOJM]
Dim.
(mm)
ABWFEP
1
12
12.0±0.3 5.5±0.1
1.75±0.10
8.0±0.1
Dim.
(mm)
P2P0φD0t1t2
2.0±0.14.0±0.1 1.5
+0.1 0.6 max. 3.0 max.
0
Dim. (mm) A B
12
Type EFOB 3.0.2 6.0±0.2
Type EFOBM 3.4±0.2 4.6±0.2
Type EFOJM 4.1±0.2 4.9±0.2
01 Feb. 2009