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TPS6040x Unregulated 60-mA Charge Pump Voltage Inverter

1 Features

• Inverts Input Supply Voltage

• Up to 60-mA Output Current

• Only Three Small 1-µF Ceramic Capacitors

Needed

• Input Voltage Range From 1.6 V to 5.5 V

• PowerSave-Mode for Improved Efficiency at Low-

Output Currents (TPS60400)

• Device Quiescent Current Typical 65 µA

• Integrated Active Schottky-Diode for Start-up Into

Load

• Small 5-Pin SOT-23 Package

• Evaluation Module Available TPS60400EVM-178

2 Applications

• LCD Bias

• GaAs Bias for RF Power Amps

• Sensor Supply in Portable Instruments

• Bipolar Amplifier Supply

• Medical Instruments

• Battery-Operated Equipment

3 Description

The TPS6040x family of devices generates an

unregulated negative output voltage from an input

voltage ranging from 1.6 V to 5.5 V. The devices are

typically supplied by a preregulated supply rail of 5 V

or 3.3 V. Due to its wide input voltage range, two or

three NiCd, NiMH, or alkaline battery cells, as well as

one Li-Ion cell can also power them.

Only three external 1-µF capacitors are required to

build a complete DC-DC charge pump inverter.

Assembled in a 5-pin SOT-23 package, the complete

converter can be built on a 50-mm2 board area.

Additional board area and component count reduction

is achieved by replacing the Schottky diode that is

typically needed for start-up into load by integrated

circuitry.

The TPS6040x can deliver a maximum output current

of 60 mA with a typical conversion efficiency of

greater than 90% over a wide output current range.

Three device options with 20-kHz, 50-kHz, and 250-

kHz fixed-frequency operation are available.

TPS60400 comes with a variable switching frequency

to reduce operating current in applications with a wide

load range and enables the design with low-value

capacitors.

Device Information

PART NUMBER PACKAGE (1) BODY SIZE (NOM)

TPS6040x SOT-23 (5) 2.90 mm x 1.60 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

TPS60400

CFLY- CFLY+

3 5

OUTIN

GND

1 µF

Output

-1.6 V to -5.5 V,

Max 60 mA

Input

1.6 V to 5.5 V

C(fly) 1 µF

Typical Application

- 5

- 4

- 3

- 2

- 1

0 1 2 3 4 5

IO= 60 mA

IO= 30 mA

IO= 1 mA

TA= 25°C

VI- Input Voltage - V

- Output Voltage - V

Output Voltage vs Input Voltage

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TPS60400, TPS60401, TPS60402, TPS60403

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TPS60400, TPS60401, TPS60402, TPS60403

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

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Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................3

7 Specifications.................................................................. 4

7.1 Absolute Maximum Ratings........................................ 4

7.2 Handling Ratings.........................................................4

7.3 Recommended Operating Conditions.........................4

7.4 Thermal Information....................................................4

7.5 Electrical Characteristics.............................................5

7.6 Typical Characteristics................................................ 5

8 Detailed Description......................................................10

8.1 Overview................................................................... 10

8.2 Functional Block Diagram......................................... 10

8.3 Feature Description...................................................11

8.4 Device Functional Modes..........................................12

9 Application and Implementation.................................. 13

9.1 Application Information............................................. 13

9.2 Typical Application.................................................... 13

9.3 System Examples..................................................... 16

10 Power Supply Recommendations..............................20

11 Layout........................................................................... 21

11.1 Layout Guidelines................................................... 21

11.2 Layout Example...................................................... 21

12 Device and Documentation Support..........................22

12.1 Device Support....................................................... 22

12.2 Related Links.......................................................... 22

12.3 Trademarks............................................................. 22

12.4 Electrostatic Discharge Caution..............................22

12.5 Glossary..................................................................22

13 Mechanical, Packaging, and Orderable

Information.................................................................... 22

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (April 2015) to Revision C (October 2020) Page

• Updated the numbering format for tables, figures and cross-references throughout the document...................1

Changes from Revision A (November 2004) to Revision B (April 2015) Page

• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and

Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1

TPS60400, TPS60401, TPS60402, TPS60403

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5 Device Comparison Table

PART NUMBER(1) MARKING DBV

PACKAGE

TYPICAL FLYING CAPACITOR

[µF] FEATURE

TPS60400DBV PFKI 1 Variable switching frequency 50 kHz-250 kHz

TPS60401DBV PFLI 10 Fixed frequency 20 kHz

TPS60402DBV PFMI 3.3 Fixed frequency 50 kHz

TPS60403DBV PFNI 1 Fixed frequency 250 kHz

(1) The DBV package is available taped and reeled. Add R suffix to device type (for example, TPS60400DBVR) to order quantities of 3000

devices per reel. Add T suffix to device type (for example, TPS60400DBVT) to order quantities of 250 devices per reel.

6 Pin Configuration and Functions

OUT

CFLY–

CFLY+

GND

Figure 6-1. DBV Package 5 Pins Top View

Table 6-1. Pin Functions

PIN I/O DESCRIPTION

NAME NO.

CFLY+ 5 Positive terminal of the flying capacitor C(fly)

CFLY- 3 Negative terminal of the flying capacitor C(fly)

GND 4 Ground

IN 2 I Supply input. Connect to an input supply in the 1.6-V to 5.5-V range. Bypass IN to GND with a capacitor

that has the same value as the flying capacitor.

OUT 1 O Power output with VO = -VI Bypass OUT to GND with the output filter capacitor CO.

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

Voltage

range

IN to GND -0.3 5.5 V

OUT to GND -5.5 0.3 V

CFLY- to GND 0.3 VO - 0.3 V

CFLY+ to GND -0.3 V VI + 0.3 V

Continuous power dissipation See Section 9.2.1.2.5

Continuous output current 80 mA

Maximum junction temperature, TJ150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN MAX UNIT

Tstg Storage temperature range -55°C 150°C °C

V(ESD) Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

pins(1)

-1000 1000

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

-500 500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN NOM MAX UNIT

Input voltage range, VI1.8 5.25 V

Output current range at OUT, IO60 mA

Input capacitor, CI0 C(fly) µF

Flying capacitor, C(fly) 1 µF

Output capacitor, CO1 100 µF

Operating junction temperature, TJ-40 125 °C

7.4 Thermal Information

THERMAL METRIC(1)

TPS6040x

UNITDBV

5 PINS

RθJA Junction-to-ambient thermal resistance 221.2

°C/W

RθJC(top) Junction-to-case (top) thermal resistance 81.9

RθJB Junction-to-board thermal resistance 39.8

ψJT Junction-to-top characterization parameter 3.3

ψJB Junction-to-board characterization parameter 38.9

RθJC(bot) Junction-to-case (bottom) thermal resistance n/a

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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7.5 Electrical Characteristics

CI = C(fly) = CO (according to Table 1), TC = -40°C to 85°C, VI = 5 V over recommended operating free-air

temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VISupply voltage range At TC = -40°C to 85°C, RL = 5 kΩ 1.8 5.25 V

At TC≥ 0°C, RL= 5 kΩ 1.6

IOMaximum output current at VO60 mA

VOOutput voltage -VIV

VP-P Output voltage ripple

TPS60400

IO = 5 mA

C(fly) = 1 µF, CO = 2.2 µF 35

mVP-P

TPS60401 C(fly) = CO = 10 µF 20

TPS60402 C(fly) = CO = 3.3 µF 20

TPS60403 C(fly) = CO = 1 µF 15

Quiescent current (no-load input

current)

TPS60400

At VI = 5 V

125 270

µA

TPS60401 65 190

TPS60402 120 270

TPS60403 425 700

TPS60400

At T ≤ 60°C, VI = 5 V

210

µA

TPS60401 135

TPS60402 210

TPS60403 640

fOSC Internal switching frequency

TPS60400 VCO version 30 50-250 350

kHz

TPS60401 13 20 28

TPS60402 30 50 70

TPS60403 150 250 300

Impedance at 25°C, VI = 5 V

TPS60400 CI = C(fly) = CO = 1 µF 12 15

Ω

TPS60401 CI = C(fly) = CO = 10 µF 12 15

TPS60402 CI = C(fly) = CO = 3.3 µF 12 15

TPS60403 CI = C(fly) = CO = 1 µF 12 15

7.6 Typical Characteristics

Table 7-1. Table of Graphs

FIGURE

η Efficiency vs Output current at 3.3 V, 5 V

TPS60400, TPS60401, TPS60402, TPS60403

Figure 7-1,

Figure 7-2

IIInput current vs Output current

TPS60400, TPS60401, TPS60402, TPS60403

Figure 7-3,

Figure 7-4

ISSupply current vs Input voltage

TPS60400, TPS60401, TPS60402, TPS60403

Figure 7-5,

Figure 7-6

Output resistance vs Input voltage at -40°C, 0°C, 25°C, 85°C

TPS60400, CI = C(fly) = CO = 1 µF

TPS60401, CI = C(fly) = CO = 10 µF

TPS60402 , CI = C(fly) = CO = 3.3 µF

TPS60403, CI = C(fly) = CO = 1 µF

Figure 7-7,

Figure 7-8,

Figure 7-9,

Figure 7-10

VOOutput voltage vs Output current at 25°C, VIN=1.8 V, 2.5 V, 3.3 V, 5 V

TPS60400, CI = C(fly) = CO = 1 µF

TPS60401, CI = C(fly) = CO = 10 µF

TPS60402 , CI = C(fly) = CO = 3.3 µF

TPS60403, CI = C(fly) = CO = 1 µF

Figure 7-11,

Figure 7-12,

Figure 7-13,

Figure 7-14

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Table 7-1. Table of Graphs (continued)

FIGURE

fOSC Oscillator frequency vs Temperature at VI = 1.8 V, 2.5 V, 3.3 V, 5 V

TPS60400, TPS60401, TPS60402, TPS60403

Figure 7-15,

Figure 7-16,

Figure 7-17,

Figure 7-18

fOSC Oscillator frequency vs Output current

TPS60400 at 2 V, 3.3 V, 5.0 V

Figure 7-19

100

0 10 20 30 40 50 60 70 80 90 100

TPS60400

VI= 5 V TPS60401

VI= 5 V

TPS60400

VI= 3.3 V

TPS60401

VI= 3.3 V

TA= 25°C

Efficiency – %

IO– Output Current – mA

Figure 7-1. Efficiency vs Output Current

100

0 10 20 30 40 50 60 70 80 90 100

TPS60403

VI= 5 V

TPS60402

VI= 5 V

TPS60402

VI= 3.3 V

TPS60403

VI= 3.3 V

TA= 25°C

Efficiency – %

IO– Output Current – mA

Figure 7-2. Efficiency vs Output Current

0.1

100

0.1 1 10 100

TPS60400

VI= 5 V

TPS60401

VI= 5 V TPS60401

VI= 2 V

TPS60400

VI= 2 V

TA= 25°C

– Input Current – mA

IO– Output Current – mA

Figure 7-3. Input Current vs Output Current

0.1

100

0.1 1 10 100

TPS60403

VI= 5 V

TPS60403

VI= 2 V

TPS60402

VI= 5 V

TPS60402

VI= 2 V

TA= 25°C

– Input Current – mA

IO– Output Current – mA

Figure 7-4. Input Current vs Output Current

0.2

0.4

0.6

0 1 2 3 4 5

IO= 0 mA

TA= 25°C

– Supply Current – mA

VI– Input Voltage – V

IDD

TPS60401

TPS60400

Figure 7-5. Supply Current vs Input Voltage

0.2

0.4

0.6

0 1 2 3 4 5

IO= 0 mA

TA= 25°C

– Supply Current – mA

VI– Input Voltage – V

IDD

TPS60402

TPS60403

Figure 7-6. Supply Current vs Input Voltage

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1 2 3 4 5 6

TA= 85°C

TA= 25°C

TA= –40°C

– Output Resistance – W

VI– Input Voltage – V

IO= 30 mA

CI= C(fly) = CO= 1 µF

Figure 7-7. Output Resistance vs Input Voltage

1 2 3 4 5 6

TA= 85°C

TA= 25°C

TA= –40°C

VI– Input Voltage – V

IO= 30 mA

CI= C(fly) = CO= 10 µF

– Output Resistance – W

Figure 7-8. Output Resistance vs Input Voltage

1 2 3 4 5 6

TA= 85°C

TA= 25°C

TA= –40°C

VI– Input Voltage – V

IO= 30 mA

CI= C(fly) = CO= 3.3 µF

– Output Resistance – W

Figure 7-9. Output Resistance vs Input Voltage

1 2 3 4 5 6

TA= 85°C

TA= 25°C

TA= –40°C

VI– Input Voltage – V

IO= 30 mA

CI= C(fly) = CO= 1 µF

– Output Resistance – W

Figure 7-10. Output Resistance vs Input Voltage

–6

–5

–4

–3

–2

–1

0 10 20 30 40 50 60

VI= 1.8 V

VI= 2.5 V

VI= 3.3 V

VI= 5 V

– Output Voltage – V

IO– Output Current – mA

TA= 25°C

Figure 7-11. Output Voltage vs Output Current

–6

–5

–4

–3

–2

–1

0 10 20 30 40 50 60

VI= 1.8 V

VI= 2.5 V

VI= 3.3 V

VI= 5 V

– Output Voltage – V

IO– Output Current – mA

TA= 25°C

Figure 7-12. Output Voltage vs Output Current

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–6

–5

–4

–3

–2

–1

0 10 20 30 40 50 60

VI= 1.8 V

VI= 2.5 V

VI= 3.3 V

VI= 5 V

– Output Voltage – V

IO– Output Current – mA

TA= 25°C

Figure 7-13. Output Voltage vs Output Current

–6

–5

–4

–3

–2

–1

0 10 20 30 40 50 60

VI= 1.8 V

VI= 2.5 V

VI= 3.3 V

VI= 5 V

– Output Voltage – V

IO– Output Current – mA

TA= 25°C

Figure 7-14. Output Voltage vs Output Current

100

150

200

250

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90

VI= 1.8 V

VI= 2.5 V

VI= 3.3 V

VI= 5 V

IO= 10 mA

– Oscillator Frequency – kHz

TA– Free-Air Temperature – °C

fosc

Figure 7-15. Oscillator Frequency vs Free-Air

Temperature

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90

– Oscillator Frequency – kHz

TA– Free-Air Temperature – °C

fosc

22.2

22.4

22.6

22.8

23.2

23.4

23.6

23.8

IO= 10 mA

VI= 5 V

VI= 3.3 V

VI= 2.5 V

VI= 1.8 V

Figure 7-16. Oscillator Frequency vs Free-Air

Temperature

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90

– Oscillator Frequency – kHz

TA– Free-Air Temperature – °C

fosc

IO= 10 mA

VI= 5 V

VI= 3.3 V

VI= 2.5 V

VI= 1.8 V

Figure 7-17. Oscillator Frequency vs Free-Air

Temperature

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90

– Oscillator Frequency – kHz

TA– Free-Air Temperature – °C

fosc

IO= 10 mA

VI= 5 V

VI= 3.3 V

VI= 2.5 V

VI= 1.8 V

150

160

170

180

190

200

210

220

230

240

250

Figure 7-18. Oscillator Frequency vs Free-Air

Temperature

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100

150

200

250

300

0 10 20 30 40 50 60 70 80 90 100

– Oscillator Frequency – kHz

IO– Output Current – mA

fosc

TA= 25°C

VI= 5 V

VI= 3.3 V

VI= 1.8 V

Figure 7-19. Oscillator Frequency vs Output Current

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8 Detailed Description

8.1 Overview

The TPS60400, TPS60401 charge pumps invert the voltage applied to their input. For the highest performance,

use low equivalent series resistance (ESR) capacitors (for example, ceramic). During the first half-cycle,

switches S2 and S4 open, switches S1 and S3 close, and capacitor (C(fly)) charges to the voltage at VI. During

the second half-cycle, S1 and S3 open, S2 and S4 close. This connects the positive terminal of C(fly) to GND and

the negative to VO. By connecting C(fly) in parallel, CO is charged negative. The actual voltage at the output is

more positive than -VI, since switches S1-S4 have resistance and the load drains charge from CO.

C(fly)

1 µF

VO (–VI)

GND

Figure 8-1. Operating Principle

8.2 Functional Block Diagram

Start

VI – VCFLY+ < 0.5 V

MEAS VI < 1 V

VO > Vbe

MEAS

OSC

CHG

50 kHz

VO > –1 V

VI / VO

MEAS

VIVO

VCO_CONT

VO < –VI – Vbe

Phase

Generator

DC_ Startup

C(fly)

GND

DC_ Startup

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8.3 Feature Description

8.3.1 Charge-Pump Output Resistance

The TPS6040x devices are not voltage regulators. The charge pump's output source resistance is approximately

15 Ω at room temperature (with VI = 5 V), and VO approaches -5 V when lightly loaded. VO droops toward GND

as load current increases.

VO = –(VI – RO × IO)

(1)

RO[1

ƒosc C(fly) )4ǒ2RSWITCH )ESRCFLYǓ)ESRCO

RO = output resistance of the converter

(2)

8.3.2 Efficiency Considerations

The power efficiency of a switched-capacitor voltage converter is affected by three factors: the internal losses in

the converter IC, the resistive losses of the capacitors, and the conversion losses during charge transfer

between the capacitors. The internal losses are associated with the internal functions of the IC, such as driving

the switches, oscillator, and so forth. These losses are affected by operating conditions such as input voltage,

temperature, and frequency. The next two losses are associated with the output resistance of the voltage

converter circuit. Switch losses occur because of the on-resistance of the MOSFET switches in the IC. Charge-

pump capacitor losses occur because of their ESR. The relationship between these losses and the output

resistance is as follows:

PCAPACITOR LOSSES + PCONVERSION LOSSES = IO2 × RO

RSWITCH = resistance of a single MOSFET-switch inside the converter

fOSC = oscillator frequency

(3)

The first term is the effective resistance from an ideal switched-capacitor circuit. Conversion losses occur during

the charge transfer between C(fly) and CO when there is a voltage difference between them. The power loss is:

PCONV.LOSS +ƪ1

2 C(fly)ǒV2

I*V2

OǓ)1

2COǒV2

RIPPLE *2VOVRIPPLEǓƫ ƒosc

(4)

The efficiency of the TPS6040x devices is dominated by their quiescent supply current at low output current and

by their output impedance at higher current.

IO)IQǒ1*

IO RO

VIǓ

(5)

Where, IQ = quiescent current.

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8.4 Device Functional Modes

8.4.1 Active-Schottky Diode

For a short period of time, when the input voltage is applied, but the inverter is not yet working, the output

capacitor is charged positive by the load. To prevent the output being pulled above GND, a Schottky diode must

be added in parallel to the output. The function of this diode is integrated into the TPS6040x devices, which

gives a defined startup performance and saves board space.

A current sink and a diode in series can approximate the behavior of a typical, modern operational amplifier.

Figure 8-2 shows the current into this typical load at a given voltage. The TPS6040x devices are optimized to

start into these loads.

TPS60400

C1-C1+

5 3

OUT

GND

1 µF

C(fly) 1 µF

Typical

Load

VO (-VI)

-V

GND

Figure 8-2. Typical Load

60 mA

25 mA

0.4 V 1.25 V 5 V

Load Current

Voltage at the Load

0.4 V

Figure 8-3. Maximum Start-Up Current

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9 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes. Customers should validate and test their design

implementation to confirm system functionality.

9.1 Application Information

The TPS6040x is a family of devices that generate an unregulated negative output voltage from an input voltage

ranging from 1.6 V to 5.5 V.

9.2 Typical Application

9.2.1 Voltage Inverter

The design guidelines provide a component selection to operate the device within the recommended operating

conditions.

TPS60400

C1– C1+

3 5

OUTIN

GND

1 µF

–5 V,

Max 60 mA

Input 5 V

C(fly) 1 µF

Figure 9-1. Typical Operating Circuit

9.2.1.1 Design Requirements

The TPS6040x is connected to generate a negative output voltage from a positive input.

9.2.1.2 Detailed Design Procedure

The most common application for these devices is a charge-pump voltage inverter (see Figure 9-1). This

application requires only two external components; capacitors C(fly) and CO, plus a bypass capacitor, if

necessary. Refer to the capacitor selection section for suggested capacitor types.

For the maximum output current and best performance, three ceramic capacitors of 1 µF (TPS60400,

TPS60403) are recommended. For lower currents or higher allowed output voltage ripple, other capacitors can

also be used. It is recommended that the output capacitors has a minimum value of 1 µF. With flying capacitors

lower than 1 µF, the maximum output power decreases.

9.2.1.2.1 Capacitor Selection

To maintain the lowest output resistance, use capacitors with low ESR (see Table 9-1). The charge-pump output

resistance is a function of C(fly)'s and CO's ESR. Therefore, minimizing the charge-pump capacitor's ESR

minimizes the total output resistance. The capacitor values are closely linked to the required output current and

the output noise and ripple requirements. It is possible to only use 1-µF capacitors of the same type.

9.2.1.2.2 Input Capacitor (CI)

Bypass the incoming supply to reduce its ac impedance and the impact of the TPS6040x switching noise. The

recommended bypassing depends on the circuit configuration and where the load is connected. When the

inverter is loaded from OUT to GND, current from the supply switches between 2 x IO and zero. Therefore, use a

large bypass capacitor (for example, equal to the value of C(fly)) if the supply has high ac impedance. When the

inverter is loaded from IN to OUT, the circuit draws 2 × IO constantly, except for short switching spikes. A 0.1-µF

bypass capacitor is sufficient.

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I TEXAS INSTRUMENTS CO 05c>< o="">

9.2.1.2.3 Flying Capacitor (C(fly))

Increasing the flying capacitor's size reduces the output resistance. Small values increases the output

resistance. Above a certain point, increasing C(fly)'s capacitance has a negligible effect, because the output

resistance becomes dominated by the internal switch resistance and capacitor ESR.

9.2.1.2.4 Output Capacitor (CO)

Increasing the output capacitor's size reduces the output ripple voltage. Decreasing its ESR reduces both output

resistance and ripple. Smaller capacitance values can be used with light loads if higher output ripple can be

tolerated. Use the following equation to calculate the peak-to-peak ripple.

VO(ripple) +

fosc Co

)2 IO ESRCO

(6)

Table 9-1. Recommended Capacitor Values

DEVICE VI

[V]

[mA]

[µF]

C(fly)

[µF]

TPS60400 1.8…5.5 60 1 1 1

TPS60401 1.8…5.5 60 10 10 10

TPS60402 1.8…5.5 60 3.3 3.3 3.3

TPS60403 1.8…5.5 60 1 1 1

Table 9-2. Recommended Capacitors

MANUFACTURER PART NUMBER SIZE CAPACITANCE TYPE

Taiyo Yuden EMK212BJ474MG 0805 0.47 µF Ceramic

LMK212BJ105KG 0805 1 µF Ceramic

LMK212BJ225MG 0805 2.2 µF Ceramic

EMK316BJ225KL 1206 2.2 µF Ceramic

LMK316BJ475KL 1206 4.7 µF Ceramic

JMK316BJ106KL 1206 10 µF Ceramic

TDK C2012X5R1C105M 0805 1 µF Ceramic

C2012X5R1A225M 0805 2.2 µF Ceramic

C2012X5R1A335M 0805 3.3 µF Ceramic

Table 9-3 contains a list of manufacturers of the recommended capacitors. Ceramic capacitors will provide the

lowest output voltage ripple because they typically have the lowest ESR-rating.

Table 9-3. Recommended Capacitor Manufacturers

CAPACITOR TYPE MANUFACTURER WEB ADDRESS

X5R / X7R ceramic Taiyo Yuden www.t-yuden.com

X5R / X7R ceramic TDK www.component.tdk.com

X5R / X7R ceramic Vishay www.vishay.com

X5R / X7R ceramic Kemet www.kemet.com

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Product Folder Links: TPS60400 TPS60401 TPS60402 TPS60403

l TEXAS INSTRUMENTS D D ,/ L/ ‘ x > ‘ ‘ , |rﬁm07 s “mm, s

9.2.1.2.5 Power Dissipation

As given in Section 7.4, the thermal resistance of TPS6040x is: RΘJA = 221°C/W.

The terminal resistance can be calculated using the following equation:

RqJA +

TJ*TA

(7)

where:

TJ is the junction temperature. TA is the ambient temperature. PD is the power that is dissipated by the device.

RqJA +

TJ*TA

(8)

The maximum power dissipation can be calculated using the following equation:

PD = VI× II - VO× IO = VI(max)× (IO + I(SUPPLY)) - VO× IO(9)

The maximum power dissipation happens with maximum input voltage and maximum output current.

At maximum load the supply current is 0.7 mA maximum.

PD = 5 V × (60 mA + 0.7 mA) - 4.4 V × 60 mA = 40 mW (10)

With this maximum rating and the thermal resistance of the device on the EVM, the maximum temperature rise

above ambient temperature can be calculated using the following equation:

ΔTJ = RΘJA× PD = 221°C/W × 40 mW =8.8°C (11)

This means that the internal dissipation increases TJ by <10°C.

The junction temperature of the device shall not exceed 125°C.

This means the IC can easily be used at ambient temperatures up to:

TA = TJ(max) -Δ TJ = 125°C/W - 10°C = 115°C (12)

9.2.1.3 Application Curves

– Output Voltage – mV

t – Time – µs

VI= 5 V

IO= 30 mA

TPS60403

TPS60400

100 mV/DIV

50 mV/DIV

4µs/DIV

Figure 9-2. Output Voltage vs Time for TPS60400

and TPS60401

– Output Voltage – mV

t – Time – µs

VI= 5 V

IO= 30 mA

TPS60402

TPS60401

50 mV/DIV

20 µs/DIV

Figure 9-3. Output Voltage vs Time for TPS60401

and TPS60402

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I TEXAS INsnunngTs V c".W H1_uF H 1 OUT 01+ 5 2 TPssmnu m 3 m GND 4 NVV417 ) c 4,c0 GND GND Cum \ “‘F \ \ 1 ouT 01+ 5 2 TPssn4nu IN 3 01- GND 4 ) CI Co GND GND

9.3 System Examples

To reduce the output voltage ripple, a RC post filter can be used.

An output filter can easily be formed with a resistor (RP) and a capacitor (CP). Cutoff frequency is given by:

TPS60400

OUT C1+

C1– GND

C(fly) 1 µF

1 µF

VO (–VI)

GND

Figure 9-4. TPS60400 with RC-Post Filter

The equation refers only to the relation between output and input of the ac ripple voltages of the filter.

ƒc+1

2pRPCP

(1)

and ratio VO/VOUT is:

ŤVO

VOUTŤ+1

1)ǒ2pƒRPCPǓ2

Ǹ(2)

with RP = 50 Ω, CP = 0.1 µF and f = 250 kHz: ŤVO

VOUTŤ+0.125

(13)

To reduce the output voltage ripple, a LC post filter can be used.

Figure 9-5 shows a configuration with a LC-post filter to further reduce output ripple and noise.

TPS60400

OUT C1+

C1– GND

C(fly) 1 µF

1 µF

VO (–VI)

GND

VOUT

Figure 9-5. LC-Post Filter

The application allows to generate a voltage rail at a level of 1/2 of the input voltage.

A switched-capacitor voltage inverter can be configured as a high efficiency rail-splitter. This circuit provides a

bipolar power supply that is useful in battery powered systems to supply dual-rail ICs, like operational amplifiers.

Moreover, the SOT23-5 package and associated components require very little board space.

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I TEXAS INSTRUMENTS 5 T Ch P5604nn GND GND 5 OUT 01+ V1pns) TPSSO4DD IN c1— GND GND

After power is applied, the flying capacitor (C(fly)) connects alternately across the output capacitors C3 and CO.

This equalizes the voltage on those capacitors and draws current from VI to VO as required to maintain the

output at 1/2 VI.

The maximum input voltage between VI and GND in the schematic (or between IN and OUT at the device itself)

must not exceed 6.5 V.

TPS60400

OUT C1+

C1- GND

C(fly) 1 µF

1 µF

VO = VI/2

GND

1 µF

Figure 9-6. TPS60400 as a High-Efficiency Rail Splitter

The application allows to generate a voltage rail at a level of -Vi as well as 2 x Vi (V(pos)).

In the circuit of Figure 9-7, capacitors CI, C(fly), and CO form the inverter, while C1 and C2 form the doubler. C1

and C(fly) are the flying capacitors; CO and C2 are the output capacitors. Because both the inverter and doubler

use part of the charge-pump circuit, loading either output causes both outputs to decline toward GND. Make sure

the sum of the currents drawn from the two outputs does not exceed 60 mA. The maximum output current at

V(pos) must not exceed 30 mA. If the negative output is loaded, this current must be further reduced.

TPS60400

OUT C1+

C1– GND

C(fly) 1 µF

1 µF

–VI

GNDGND

V(pos)

II ≈ –IO + 2 × IO(POS)

Figure 9-7. TPS60400 as Doubler/Inverter

The application generate a voltage rail at a level -2 x Vi.

Two devices can be cascaded to produce an even larger negative voltage (see Figure 9-8). The unloaded output

voltage is normally -2 × VI, but this is reduced slightly by the output resistance of the first device multiplied by the

quiescent current of the second. When cascading more than two devices, the output resistance rises

dramatically.

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ITEXAs INSTRUMENTS V. ) 9"” H ‘ “F H H H 1 OUT on 5 1 OUT (21+ 5 2 TPSSMOO 2 TPSSMOO m m im— em: 4 im— em) 4 c. Co T luF 1MF T Gun . GND CUM H "‘F H 1 OUT en» 5 ' OUT c1. 5 TPSEMOO TF5604DD ) 2 2 m i icu- GND 4 T . GND V ) ‘3qu H "‘F H 1 om 01+ 5 TPSEMOO 4E N c1— cm) 4 (moi GND

TPS60400

OUT C1+

C1– GND

C(fly) 1 µF

1 µF

VO (–2 VI)

GND

TPS60400

OUT C1+

C1– GND

1 µF

GND

C(fly) 1 µF

Figure 9-8. Doubling Inverter

The application allows to increase the output current by using two or more in parallel.

Paralleling multiple TPS6040xs reduces the output resistance. Each device requires its own flying capacitor

(C(fly)), but the output capacitor (CO) serves all devices (see Figure 9-9). Increase CO's value by a factor of n,

where n is the number of parallel devices. Equation 1 shows the equation for calculating output resistance.

TPS60400

OUT C1+

C1– GND

C(fly) 1 µF

1 µF

VO (–VI)

GND

TPS60400

OUT C1+

C1– GND

C(fly) 1 µF

2.2 µF

Figure 9-9. Paralleling Devices

The application adds a shutdown function.

If shutdown is necessary, use the circuit in Figure 9-10. The output resistance of the TPS6040x typically is 15 Ω

plus two times the output resistance of the buffer.

Connecting multiple buffers in parallel reduces the output resistance of the buffer driving the IN pin.

TPS60400

OUT C1+

C1– GND

C(fly) 1 µF

1 µF

VO (–VI)

GND

SDN

Figure 9-10. Shutdown Control

The application generates a regulated output voltage for a GaAs bias supply.

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l TEXAS INSTRUMENTS R (—2.7 V/3 mA) Cum H 0.: “F H R2 OUT 01+ Co 2 TPssowo | HF IN TLV43I R1 3 ND GND 0 01

A solution for a -2.7-V/3-mA GaAs bias supply is proposed in Figure 9-11. The input voltage of 3.3 V is first

inverted with a TPS60403 and stabilized using a TLV431 low-voltage shunt regulator. Resistor RP with capacitor

CP is used for filtering the output voltage.

TPS60400

OUT C1+

C1– GND

C(fly) 0.1 µF

1 µF

0.1 µF

VO (–2.7 V/3 mA)

GND

VI (3.3 V)

GND

TLV431

Figure 9-11. GaAs Supply

A 0.1-µF capacitor was selected for C(fly). By this, the output resistance of the inverter is about 52 Ω.

RPMAX can be calculated using the following equation:

VO+ * ǒ1)R1

R2Ǔ Vref *R1 II(ref)

(14)

A 100-Ω resistor was selected for RP.

The reference voltage across R2 is 1.24 V typical. With 5-µA current for the voltage divider, R2 gets:

RPMAX +ǒVCO *VO

IO*ROǓ

With: VCO = –3.3 V; VO = –2.7 V; IO = –3 mA

RPMAX = 200 Ω – 52 Ω = 148 Ω

(15)

With CP = 1 µF the ratio VO/VI of the RC post filter is:

R2 +1.24 V

5mA

[250 kW

R1 +2.7 *1.24 V

5mA

[300 kW

(16)

ŤVO

VIŤ+1

1)(2p125000Hz 100W 1mF)2

Ǹ[0.01

(17)

The application generates an output voltage of 1/2 of the input voltage.

By exchanging GND with OUT (connecting the GND pin with OUT and the OUT pin with GND), a step-down

charge pump can easily be formed. In the first cycle S1 and S3 are closed, and C(fly) with CO in series are

charged. Assuming the same capacitance, the voltage across C(fly) and CO is split equally between the

capacitors. In the second cycle, S2 and S4 close and both capacitors with VI/2 across are connected in parallel.

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The maximum input voltage between VI and GND in the schematic (or between IN and OUT at the device itself)

must not exceed 6.5 V. For input voltages in the range of 6.5 V to 11 V, an additional Zener-diode is

recommended (see Figure 9-14).

C(fly)

1 µF

VO (VI/2)

GND

VO (VI/2)

Figure 9-12. Step-Down Principle

TPS60400

OUT C1+

C1- GND

C(fly) 1 µF

1 µF

VO (VI/2)

GND

Figure 9-13. Step-Down Charge Pump Connection

OUT

C1–

TPS60400

C1+

GND

C(fly) 1 µF

5V6

1 µF

GND

VO – VI

GND

Figure 9-14. Step-Down Charge Pump Connection for Higher Input Voltages

10 Power Supply Recommendations

The TPS60400 device family has no special requirements for its power supply. The power supply output needs

to be rated according to the supply voltage, output voltage and output current of the TPS6040x.

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Product Folder Links: TPS60400 TPS60401 TPS60402 TPS60403

m“ mm

11 Layout

11.1 Layout Guidelines

All capacitors should be soldered as close as possible to the IC. A PCB layout proposal for a single-layer board

is shown in Figure 11-1. Care has been taken to connect all capacitors as close as possible to the circuit to

achieve optimized output voltage ripple performance.

11.2 Layout Example

CFLY

CIN

COUT

TPS60400

GND

OUT

Figure 11-1. Recommended PCB Layout for TPS6040x (Top Layer)

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I TEXAS INSTRUMENTS

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.1.2 Device Family Products

Other inverting DC-DC converters from Texas Instruments are listed in Table 12-1.

Table 12-1. Product Identification

PART NUMBER DESCRIPTION

TPS6735 Fixed negative 5-V, 200-mA inverting dc-dc converter

TPS6755 Adjustable 1-W inverting dc-dc converter

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 12-2. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS

TOOLS &

SOFTWARE

SUPPORT &

COMMUNITY

TPS60400 Click here Click here Click here Click here Click here

TPS60401 Click here Click here Click here Click here Click here

TPS60402 Click here Click here Click here Click here Click here

TPS60403 Click here Click here Click here Click here Click here

12.3 Trademarks

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

12.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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Product Folder Links: TPS60400 TPS60401 TPS60402 TPS60403

I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples Samples Samples Samples Samples

PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TPS60400DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFKI

TPS60400DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFKI

TPS60400DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFKI

TPS60400DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFKI

TPS60401DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFLI

TPS60401DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFLI

TPS60401DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFLI

TPS60401DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFLI

TPS60402DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFMI

TPS60402DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFMI

TPS60402DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFMI

TPS60402DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFMI

TPS60403DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFNI

TPS60403DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFNI

TPS60403DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFNI

TPS60403DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PFNI

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

I TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

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Addendum-Page 2

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TPS60400, TPS60401, TPS60402, TPS60403 :

•Automotive: TPS60400-Q1, TPS60401-Q1, TPS60402-Q1, TPS60403-Q1

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I+Ko '«Pt» Reel DlameIer A0 Dimension designed to accommodate the component Width Bo Dimension designed to accommodate the component Iength K0 Dimension designed to accommodate the component thickness 7 w OveraH Wiotn ot the carrier Iape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE DOODOOOD ,,,,,,,,,,, ‘ User Direcllon 0' Feed SprockeI Hoies Pockel Quadrams

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TPS60400DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

TPS60400DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

TPS60401DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3

TPS60401DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

TPS60402DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3

TPS60402DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

TPS60403DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

TPS60403DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

PACKAGE MATERIALS INFORMATION

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Pack Materials-Page 1

I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS60400DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0

TPS60400DBVT SOT-23 DBV 5 250 180.0 180.0 18.0

TPS60401DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0

TPS60401DBVT SOT-23 DBV 5 250 180.0 180.0 18.0

TPS60402DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0

TPS60402DBVT SOT-23 DBV 5 250 180.0 180.0 18.0

TPS60403DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0

TPS60403DBVT SOT-23 DBV 5 250 180.0 180.0 18.0

PACKAGE MATERIALS INFORMATION

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Pack Materials-Page 2

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PACKAGE OUTLINE

0.22

0.08 TYP

0.25

3.0

2.6

2X 0.95

1.9

1.45

0.90

0.15

0.00 TYP

5X 0.5

0.3

0.6

0.3 TYP

0 TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/F 06/2021

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.25 mm per side.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/F 06/2021

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/F 06/2021

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

8. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

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standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

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Texas Instruments 的 TPS60400-03 规格书

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