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Encoder

RESET

IR_RXD

16XCLK

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U_RXD

IR_TXD

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TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

TIR1000x Standalone IrDA™ Encoder and Decoder

1 Features 3 Description

The TIR1000x serial infrared (SIR) encoder and

1• Adds Infrared (IR) Port to Universal Asynchronous decoder is a CMOS device that encodes and

Receiver Transmitter (UART) decodes bit data in conformance with the IrDA

• Compatible With Infrared Data Association specification.

(IrDA™) and Hewlett Packard Serial Infrared A transceiver device is needed to interface to the

(HPSIR) photo-sensitive diode (PIN) and the light emitting

• Provides 1200-bps to 115-kbps Data Rate diode (LED). A UART is needed to interface to the

• Operates from 2.7 V to 5.5 V serial data lines.

• Provides Simple Interface With UART Device Information(1)

• Decodes Negative or Positive Pulses PART NUMBER PACKAGE BODY SIZE (NOM)

• Available in Two 8-Terminal Plastic Small Outline TSSOP (8) 3.00 mm × 4.40 mm

Packages (PSOP) TIR1000x SO (8) 6.20 mm × 5.30 mm

– PS Package Has Slightly Larger Dimensions (1) For all available packages, see the orderable addendum at

Than PW Package the end of the data sheet.

2 Applications

• UART Interfacing

• Infrared Data Communications

Functional Block Diagram

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION

DATA.

l TEXAS INSTRUMENTS

TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

www.ti.com

Table of Contents

7.3 Feature Description................................................... 6

1 Features.................................................................. 17.4 Device Functional Modes.......................................... 7

2 Applications ........................................................... 18 Application and Implementation .......................... 9

3 Description ............................................................. 18.1 Application Information.............................................. 9

4 Revision History..................................................... 28.2 Typical Application ................................................... 9

5 Pin Configuration and Functions......................... 39 Power Supply Recommendations...................... 11

6 Specifications......................................................... 310 Layout................................................................... 12

6.1 Absolute Maximum Ratings ...................................... 310.1 Layout Guidelines ................................................. 12

6.2 ESD Ratings ............................................................ 410.2 Layout Example .................................................... 12

6.3 Recommended Operating Conditions....................... 411 Device and Documentation Support ................. 13

6.4 Thermal Information.................................................. 411.1 Community Resources.......................................... 13

6.5 Electrical Characteristics........................................... 411.2 Trademarks........................................................... 13

6.6 Switching Characteristics.......................................... 511.3 Electrostatic Discharge Caution............................ 13

7 Detailed Description.............................................. 611.4 Glossary................................................................ 13

7.1 Overview ................................................................... 612 Mechanical, Packaging, and Orderable

7.2 Functional Block Diagram......................................... 6Information ........................................................... 13

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (July 1999) to Revision G Page

• Added Applications,Pin Configuration and Functions section, ESD Ratings table, Typical Characteristics section,

Feature Description section, Device Functional Modes,Application and Implementation section, Power Supply

Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,

Packaging, and Orderable Information section ..................................................................................................................... 1

• Added PS package drawing ................................................................................................................................................... 3

• Changed troutput rise time FROM: 1.3 ns TO: 23.8 ns in Switching Characteristics ........................................................... 5

• Changed tfoutput fall time FROM: 1.8 ns TO: 9.2 ns in Switching Characteristics .............................................................. 5

Product Folder Links: TIR1000

l TEXAS INSTRUMENTS MN MW x0

16XCLK 8

U_TXD

U_RXD

GND RESET

IR_RXD

IR_TXD

VCC

16XCLK

U_TXD

U_RXD

GND RESET

IR_RXD

IR_TXD

VCC

TIR1000, TIR1000I

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SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

5 Pin Configuration and Functions

PS Package PW Package

8-Pin SO 8-Pin TSSOP

Top View Top View

Pin Functions

PIN I/O DESCRIPTION

NAME NO.

Clock signal. 16XCLK must be set to 16 times the baud rate. The highest baud rate for IrDA is 115.2 kbps

16XCLK 1 I for which the clock frequency equals 1.843 MHz (this terminal is tied to the BAUDOUT of a UART).

GND 4 — Ground

Infrared receiver data. IR_RXD is an IrDA-SIR-modulated input from an optoelectronics transceiver whose

IR_RXD 6 I input pulses should be 3/16 of the baud rate period.

IR_TXD 7 O Infrared transmitter data. IR_TXD is an IrDA-SIR-modulated output to an optoelectronics transceiver.

Active high reset. RESET initializes an IrDA-SIR-decode/encode state machine (this terminal is tied to a

RESET 5 I UART reset line).

Receiver data. U_RXD is decoded (demodulated) data from IR_RXD according to the IrDA specification (this

U_RXD 3 O terminal is tied to SIN of a UART).

Transmitter data. U_TXD is encoded (modulated) data and output data as IR_TXD (this terminal is tied to

U_TXD 2 I SOUT from a UART).

VCC 8 — Supply voltage

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNIT

VCC Supply voltage(2) –0.5 6 V

VIInput voltage at any input –0.5 VCC + 0.5 V

VOOutput voltage –0.5 VCC + 0.5 V

TIR1000 0 °C

TAOperating free-air temperature range TIR1000I –40 85 °C

Case temperature for 10 seconds SO package 260 °C

Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage levels are with respect to GND.

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TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

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6.2 ESD Ratings

VALUE UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

V(ESD) Electrostatic discharge V

Charged-device model (CDM), per JEDEC specification JESD22- ±900

C101(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

LOW VOLTAGE (3-V NOMINAL)

VCC Supply voltage 2.7 3 3.3 V

VIH High-level input voltage 0.7 VCC V

VIL Low-level input voltage 0.2 VCC V

TIR1000 0 70

Operating free-air

TA°C

temperature TIR1000I –40 85

STANDARD VOLTAGE (5-V NOMINAL)

VCC Supply voltage 4.5 5 5.5 V

VIH High-level input voltage 0.7 VCC V

VIL Low-level input voltage 0.2 VCC V

TIR1000 0 70

Operating free-air

TA°C

temperature TIR1000I –40 85

6.4 Thermal Information

TIR1000

THERMAL METRIC(1) PS (SO), PW (TSSOP) UNIT

8 PINS

RθJA Junction-to-ambient thermal resistance 179.8 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 63.4 °C/W

RθJB Junction-to-board thermal resistance 108.4 °C/W

ψJT Junction-to-top characterization parameter 7.0 °C/W

ψJB Junction-to-board characterization parameter 106.7 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

IOH = – 4 mA VCC = 5 V VCC – 0.8

VOH High-level output voltage V

IOH = – 1.8 mA VCC = 3 V VCC – 0.55

IOL = +4 mA VCC = 5 V 0.5

VOL Low-level output voltage V

IOL = +1.8 mA VCC = 3 V 0.5

IIII Input current VI= 0 to VCC All other pins floating ±3 µA

VCC = 5.25 V TA= 25°C

ICC Supply current All inputs at 0.2 V 16XCLK at 2 MHz 1 mA

No load on outputs

Ci(16XCLK) Clock input capacitance 5 pF

f(16XCLK) Clock frequency 2 MHz

Product Folder Links: TIR1000

“p'ﬁams INSTRUMENTS wwwwwvvwv 000000000 zgggaaaam 9 ¢ 3 2a owwwww 00000 zaaam owv 00. aka v 0 § A 5’. &> Hi \ ’O'Q'O'O'Q'O 900900 \Lwa

16 Cycles7 Cycles

External Strobe

16XCLK

IR_RXD

U_RXD

16 Cycles16 Cycles

TIR1000, TIR1000I

www.ti.com

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT

trOutput rise time No load 23.8 ns

tfOutput fall time No load 9.2 ns

(1) Typical values are at TA= 25°C.

Figure 1. Recommended Strobing For Decoded Data

Product Folder Links: TIR1000

l TEXAS INSTRUMENTS ii—lii

Decoder

Encoder

RESET

IR_RXD

16XCLK

U_TXD

U_RXD

IR_TXD

TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

www.ti.com

7 Detailed Description

7.1 Overview

TIR1000 serial infrared (SIR) encoder and decoder is a device (CMOS) that encodes and decodes bit data

according with the IrDA specifications.

For the correct performance of the TIR1000 device, an optoelectronics device and a UART device are

necessary. The TIR1000 device operates as an interface between wireless infrared and UART communication.

7.2 Functional Block Diagram

7.3 Feature Description

The Infrared Data Association (IrDA) defines several protocols for sending and receiving serial infrared data,

including the following rates:

• 115.2 kbps

• 0.576 Mbps

• 1.152 Mbps

• 4 Mbps

The low rate of 115.2 kbps was specified first and the others must maintain downward compatibility with it. At the

115.2 kbps rate, the protocol implemented in the hardware is fairly simple. It primarily defines a serial infrared

data word to be surrounded by a start bit equal to 0 and a stop bit equal to 1. Individual bits are encoded or

decoded the same whether they are start, data, or stop bits.

The TIR1000 and TIR1000I devices evaluate only single bits and follow only the 115.2-kbps protocol. The

115.2-kbps rate is a maximum rate. When both ends of the transfer are set up to a lower but matching speed,

the protocol (with the TIR1000 and TIR1000I devices) still works.

The clock used to code or sample the data is 16 times the baud rate, or 1.843 MHz maximum. To code a 1, no

pulse is sent or received for 1-bit time period, or 16 clock cycles. To code a 0, one pulse is sent or received

within a 1-bit time period, or 16 clock cycles. The pulse must be at least 1.6 μs wide and 3 clock cycles long at

1.843 MHz. At lower baud rates, the pulse can be 1.6 μs wide or as long as 3 clock cycles.

The transmitter output, IR_TXD, is intended to drive an LED circuit to generate an infrared pulse. The LED

circuits work on positive pulses. A terminal circuit is expected to create the receiver input, IR_RXD. Most (but not

all) PIN circuits have inversion and generate negative pulses from the detected infrared light. Their output is

normally high. The TIR1000 and TIR1000I devices can decode either negative or positive pulses on IR_RXD.

Product Folder Links: TIR1000

l TEXAS INSTRUMENTS ~.~.~.~.~.~.~.~.~.~.~.~. ..~.~.~.~.~.~.~.~.~.« avmvwv." " “wwww ggotgopdofdm. mtotofodoafof Ag”,

IR_RXD

16XCLK

U_RXD

1 2 3 45678 10 12 14 16

16XCLK

IR_RXD

U_RXD

16 Cycles16 Cycles 16 Cycles16 Cycles

1 2 3 45678 12 14

U_TXD

16XCLK

IR_TXD

10 16

16XCLK

U_TXD

IR_TXD

16 Cycles16 Cycles 16 Cycles16 Cycles

TIR1000, TIR1000I

www.ti.com

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

7.4 Device Functional Modes

7.4.1 IrDA Encoder Function

Serial data from a UART is encoded to transmit data to the optoelectronics. While the serial data input to this

block (U_TXD) is high, the output (IR_TXD) is always low, and the counter used to form a pulse on IR_TXD is

continuously cleared. After U_TXD resets to 0, IR_TXD rises on the falling edge of the seventh 16XCLK. On the

falling edge of the tenth 16XCLK pulse, IR_TXD falls, creating a 3-clock-wide pulse. While U_TXD stays low, a

pulse is transmitted during the seventh to tenth clocks of each 16-clock bit cycle.

Figure 2. IrDA-SIR Encoding Scheme Figure 3. Encoding Scheme

Detailed Timing Diagram Macro View

7.4.2 IrDA Decoder Function

After reset, U_RXD is high and the 4-bit counter is cleared. When a falling edge is detected on IR_RXD, U_RXD

falls on the next rising edge of 16XCLK with sufficient setup time. U_RXD stays low for 16 cycles (16XCLK) and

then returns to high as required by the IrDA specification. As long as no pulses (falling edges) are detected on

IR_RXD, U_RXD remains high.

Figure 4. IrDA-SIR Decoding Scheme Figure 5. Decoding Scheme

Detailed Timing Diagram Macro View

It is possible for jitter or slight frequency differences to cause the next falling edge on IR_RXD to be missed for

one 16XCLK cycle. In that case, a 1-clock-wide pulse appears on U_RXD between consecutive zeroes. It is

important for the UART to strobe U_RXD in the middle of the bit time to avoid latching this 1-clock-wide pulse.

The TL16C550C UART already strobes incoming serial data at the proper time. Otherwise, note that data is

required to be framed by a leading zero and a trailing one. The falling edge of that first zero on U_RXD

synchronizes the read strobe. The strobe occurs on the eighth 16XCLK pulse after the U_RXD falling edge and

once every 16 cycles thereafter until the stop bit occurs.

Product Folder Links: TIR1000

*9 TEXAS INSTRUMENTS vvv 99m 2&&V 0’9 929 3 d 9 9 353% dbhﬁu 99 9 ﬁt vvvvv‘ 99 99 && && 9 ﬁ 9 9 ﬁr 3% ﬁ» 3' 4' CV. 99 2&t vvvvv‘ 99 99 && && 9 ﬁ 9 9 ﬁr 9v9ww 99999 &&&R& ”vs ‘ at. 2.2. 9 &

16XCLK

IR_RXD

U_RXD

16 Cycles16 Cycles16 Cycles16 Cycles

1 2 3 4 5 6 7 8 10 12 14 16

IR_RXD

16XCLK

U_RXD

1 2 3 4 5 6 7 8 10 12 14 16 1 2 3 4 5 6 7 8 10 12 14 16

IR_RXD

16XCLK

U_RXD

TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

www.ti.com

Figure 6. Timing Causing 1-Clock-Wide Pulse Between Consecutive Ones

The TIR1000 and TIR1000I can decode positive pulses on IR_RXD. The timing is different, but the variation is

invisible to the UART. The decoder, which works from the falling edge, now recognizes a zero on the trailing

edge of the pulse rather than on the leading edge. As long as the pulse width is fairly constant, as defined by the

specification, the trailing edges should also be 16 clock cycles apart and data can readily be decoded. The zero

appears on U_RXD after the pulse rather than at the start of it.

Figure 7. Positive IR_RXD Pulse Decode

Detailed View

Figure 8. Positive IR_RXD Pulse Decode

Macro View

Product Folder Links: TIR1000

l TEXAS INSTRUMENTS TUECSSUC (UART) T‘R1000‘TIR1UOOI

D7–D0

MEMR or I/OR

or I/ONMEMW

INTR

RESET

XOUT

XIN

RCLK

BAUDOUT

CTS

DCD

DSR

DTR

RTS

SOUT IR_TXD

IR_RXD

SIN

INTRPT

D7–D0

U_TXD To LED

U_RXD From TERMINAL

16XCLK

RD1

WR1

ADS

WR2

RD2

CS2

CS1

CS0

TL16C550C

(ACE)

TL16C550C (UART) TIR1000, TIR1000I Optoelectronics

1.843 MHz

TIR1000, TIR1000I

www.ti.com

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

IrDA provides several specifications for a complete set of protocols for wireless infrared communications.

8.2 Typical Application

A simple application of the TIR1000 device is developing a system with an optoelectronics device and a UART

device (TL16C500C). Hence, the TIR1000 device interfaces between the infrared and serial devices.

Figure 9. Typical Application Schematic

Product Folder Links: TIR1000

‘% $4 “HF H “HF

Driver

Optional

Driver

External

Clock

Optional

Clock

Output

Oscillator Clock

to Baud Generator

Logic

Oscillator Clock

to Baud Generator

Logic

XIN

XOUT

VCC

Crystal

XIN

RX2 XOUT

VCC

TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

www.ti.com

Typical Application (continued)

8.2.1 Design Requirements

Table 1 lists the design requirements for the typical application.

Table 1. Design Requirements

DESIGN PARAMETER EXAMPLE VALUE

Power supply 3 V (low voltage)

1.843-MHz clock source Crystal

Baud rate 115.2 kbps

TRANSMITTER

Peak wavelength 850–900 nm

Intensity in angular range 40–500 mW/Sr

Half angle ±15-30°

Pulse Duration at 115.2 kbps 2.23 µs

RECEIVER

Irradiance in angular range 4–500 mW/cm2

Half angle ±15°

Receiver latency 10 ms

8.2.2 Detailed Design Procedure

The asynchronous communications element (TL16C550C) contains a programmable baud generator that takes a

clock input in the range between DC and 16 MHz and divides it by a divisor in the range between

1 and (216 – 1). The output frequency of the baud generator is sixteen times (16×) the baud rate. The formula for

the divisor is shown in Equation 1.

divisor = XIN frequency input / (desired baud rate × 16) (1)

For example:

divisor = 1.843 MHz / (115.2 kbps × 16) = 0.9999 (2)

Error (divisor) <1%

Figure 10. Typical Clock Circuits (Programmable Baud Generator)

Table 2. Typical Crystal Oscillator Network

CRYSTAL Rp RX2 C1 C2

1.8432 MHz 1 MΩ1.5 kΩ10–30 pF 40–60 pF

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TIR1000, TIR1000I

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SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

8.2.3 Application Curves

Figure 11. Rise Time of IR_TXD (Data) Figure 12. Fall Time of IR_TXD (Data)

9 Power Supply Recommendations

All power rails require a 10-µF capacitor or 1-µF capacitors for stability and noise immunity. These bulk

capacitors can be placed anywhere on the power rail. The smaller decoupling capacitors must be placed as

close to the power pins of the TIR1000 device as possible with an optimal grouping of two of differing values per

pin.

Product Folder Links: TIR1000

l TEXAS INSTRUMENTS

Power Plane

VCC

IR_TXD

IR_RXD

RESET

Ground Plane

GND

U_RXD

U_TXD

16XCLK

TIR1000

TL16C550C

BADOUT

SOUT

SIN

0.57 W´

TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

www.ti.com

10 Layout

10.1 Layout Guidelines

There is no fundamental information about how many layers should be used and how the board stackup should

look. Again, the easiest way the get good results is to use the design from the EVMs of Texas Instruments. The

magazine Elektronik Praxis has published an article with an analysis of different board stackups. These are listed

in Table 3. Generally, the use of microstrip traces needs at least two layers, whereas one of them must be a

GND plane. Better is the use of a four-layer PCB, with a GND and a VCC plane and two signal layers. If the

circuit is complex and signals must be routed as stripline, because of propagation delay and/or characteristic

impedance, a six-layer stackup should be used.

Table 3. Possible Board Stackup on a Four-Layer PCB

MODEL 1 MODEL 2 MODEL 3 MODEL 4

Layer 1 SIG SIG SIG GND

Layer 2 SIG GND GND SIG

Layer 3 VCC VCC SIG VCC

Layer 4 GND SIG VCC SIG

Decoupling Good Good Bad Bad

EMC Bad Bad Bad Bad

Signal integrity Bad Bad Good Bad

Self disturbance Satisfaction Satisfaction Satisfaction High

Avoid right-angle bends in a trace and try to route them at least with two 45° corners. To minimize any

impedance change, the best routing would be a round bend as shown in Figure 13.

Figure 13. Poor and Good Right Angle Bends

10.2 Layout Example

Figure 14. Layout Example

Product Folder Links: TIR1000

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SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.2 Trademarks

E2E is a trademark of Texas Instruments.

IrDA is a trademark of Infrared Data Association.

11.3 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: TIR1000

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PACKAGE OPTION ADDENDUM

www.ti.com 13-Aug-2021

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TIR1000IPS ACTIVE SO PS 8 80 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 IR1000I

TIR1000IPSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 IR1000I

TIR1000IPW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 R1000I

TIR1000IPWG4 ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 R1000I

TIR1000IPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 R1000I

TIR1000PSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 IR1000

TIR1000PSRG4 ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 IR1000

TIR1000PWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 IR1000

TIR1000PWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 IR1000

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

I TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

www.ti.com 13-Aug-2021

Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

l TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “KO '«m» Reel Diameter AD Dimension deswgned to accommodate the componem wwdlh ED Dimension desxgned to accommodate the componenl \engm K0 Dimenslun deswgned to accommodate the componem thickness , w OveraH wwdm loe earner cape i p1 Pitch between successwe cavuy cemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D D Sprockemules ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrams

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TIR1000IPSR SO PS 8 2000 330.0 16.4 8.35 6.6 2.5 12.0 16.0 Q1

TIR1000IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

TIR1000PSR SO PS 8 2000 330.0 16.4 8.35 6.6 2.5 12.0 16.0 Q1

TIR1000PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

Pack Materials-Page 1

l TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TIR1000IPSR SO PS 8 2000 853.0 449.0 35.0

TIR1000IPWR TSSOP PW 8 2000 853.0 449.0 35.0

TIR1000PSR SO PS 8 2000 853.0 449.0 35.0

TIR1000PWR TSSOP PW 8 2000 853.0 449.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

Pack Materials-Page 2

l TEXAS INSTRUMENTS T - Tube height| L - Tube length l ,g + w-Tuhe _______________ _ ______________ width 47 — B - Alignment groove width

TUBE

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)

TIR1000IPS PS SOP 8 80 530 10.5 4000 4.1

TIR1000IPW PW TSSOP 8 150 530 10.2 3600 3.5

TIR1000IPWG4 PW TSSOP 8 150 530 10.2 3600 3.5

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

Pack Materials-Page 3

MECHANICAL DATA PS (R-PDSO-GB) PLASTIC SMALL-OUTLINE PACKAGE {XI OAS NOM m1 w 5, 0 7,40 0 I 4 H) 5,90 E if 0,05 Seuﬁng P‘une 7 2,00 MAX 4040063/0 03/03 NOTES. A, NI \inear dimensbns are in mimme|ers B Tm's drawing 15 subjac| |o chowge wwlhou| Hoﬁce. C Endy dimens'mns dc nut incmde mnld ﬂush or prnhusian. rm| |u exceed 0.!5 *1? TEXAS INSTRUMENTS www.li.cnm

PC "RipﬂiCiGﬂ FL/“wT‘C SM/LL OdTLVE Exarrpre Board LcyoM Sten(eNmL)epeDn)rnge (\ute c) > \ , em? «*1 BE if *E'H'HEF ' Examp‘e Nun Sodarmask Deﬁned Pad ‘ , 7 Exumse Pad Geomeuy (See Noie c) Exampe Nunesmer Mask Oeemrg (See Nate E] AH hnec' drmensruns c'e rn m'hrmers THs druwmq rs s to Change wrtrrou: rretrce Pubhcahon PCe/Ja rs reccwmended «or aHe'nate desrgns \aser cuﬂmg apemres wrm rrceemrdur ons cm arse rounqu corners wﬂ arier bener paste re‘euse (hammers mum cuNad U‘ev buurc ussemb‘y srte for stem: desrqn reca'nmerdm'ms. Refer «0 PC 7525 for uther stenc' rscummendchurs Customers snoum cu'vtuct t've'v board ut'mr site {or seder may lu‘evuuces betweev and «Foam srgrrc pads NO’ES Sam?

PW0008A '

www.ti.com

PACKAGE OUTLINE

TYP

6.6

6.2

1.2 MAX

6X 0.65

8X 0.30

0.19

1.95

0.15

0.05

(0.15) TYP

0 - 8

0.25

GAGE PLANE

0.75

0.50

NOTE 3

3.1

2.9

NOTE 4

4.5

4.3

4221848/A 02/2015

TSSOP - 1.2 mm max heightPW0008A

SMALL OUTLINE PACKAGE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-153, variation AA.

0.1 C A B

PIN 1 ID

AREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.800

PW0008A

www.ti.com

EXAMPLE BOARD LAYOUT

(5.8)

0.05 MAX

ALL AROUND 0.05 MIN

ALL AROUND

8X (1.5)

8X (0.45)

6X (0.65)

(R )

TYP

0.05

4221848/A 02/2015

TSSOP - 1.2 mm max heightPW0008A

SMALL OUTLINE PACKAGE

SYMM

LAND PATTERN EXAMPLE

SCALE:10X

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

PW0008A

www.ti.com

EXAMPLE STENCIL DESIGN

(5.8)

6X (0.65)

8X (0.45)

8X (1.5)

(R ) TYP0.05

4221848/A 02/2015

TSSOP - 1.2 mm max heightPW0008A

SMALL OUTLINE PACKAGE

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:10X

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