3M 的 ECM 规格书

Utilize a Proven Solution
A UL certified and RoHS2 compliant laminate with high capacitance
density that can be embedded into PCBs and chip packages as either a
power ground plane or a discrete capacitor
Consists of a very thin layer of ceramic-filled epoxy sandwiched between
two layers of copper foil
Compatible with a large range of PCB material sets and with standard
PCB fabrication and assembly processes, including lead-free
Halogen-free3 versions available along with a variety of panel sizes and
copper thicknesses
In production in telecom, computer, test and measurement, military/
aerospace, medical and consumer electronics applications
Simplify Design while Amplifying Performance
Increases usable board area by allowing for the removal of many, if not
all, capacitors equal to or below 0.1 µF and their associated solder joints
and vias
Improves power integrity by reducing power bus noise and PCB
impedance
Reduces EMI by decreasing resonance that causes EMI
Dissipates heat better than thin FR-4 due to high thermal conductivity
and low thermal impedance
Enable Product Roadmaps
Simplify board layout and routing
Reduce PCB size, thickness and weight
Add functionality on fixed form factors
Lower spreading inductance
Decrease need for EMC measures such as metal shells, tapes, etc.
Reduce interference from digital circuits to analog/RF circuits in mixed
signal applications
Add PCB layers while maintaining similar PCB thickness
Reduce design spins by solving noise issues early in the design cycle
Improve PCB panel utilization
Improve assembly yields and board reliability due to fewer components
3M Embedded Capacitance Material (ECM)
Visit us at www.3Mcapacitance.com
3M Embedded Capacitance
Material (ECM)
IC
IC SMT-Capacitor
SMT-Capacitor
PCB
PCB
Allows for Capacitor Removal
Field Strength
Frequency
PCB with SMT Capacitor
PCB with 2 mil FR-4
PCB with 3M Embedded
Capacitance Material (ECM)
Reduces EMI
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
10
99.4
189
278
368
457
546
636
725
815
904
993
1083
1172
1262
1351
1440
Bus Noise (dbm)
Frequency (MHz)
PCB with 3 mil FR-4
PCB with 3M ECM
3 mil FR-4,
No Low L Caps
3M Embedded
Capacitance Material (ECM)
Reduces Power Bus Noise
Important Notice
All statements, technical information, and recommendations related to 3M’s products are based on information believed to be reliable, but the accuracy or completeness is not
guaranteed. Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such
use. Any statements related to the product which are not contained in 3M’s current publications, or any contrary statements contained on your purchase order shall have no
force or effect unless expressly agreed upon, in writing, by an authorized officer of 3M.
Warranty; Limited Remedy; Limited Liability.
This product will be free from defects in material and manufacture for a period of one year from the time of purchase. 3M MAKES NO OTHER WARRANTIES INCLUDING, BUT NOT
LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. If this product is defective within the warranty period stated above,
your exclusive remedy shall be, at 3M’s option, to replace or repair the 3M product or refund the purchase price of the 3M product. Except where prohibited by law, 3M will not be
liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of the legal theory asserted.
3
Electronic Solutions Division
6801 River Place Blvd.
Austin, TX 78726-9000
1-888-845-3393
www.3Mcapacitance.com
Please recycle. Printed in USA.
© 3M 2013. All rights reserved.
80-0011-3700-1
For more information, please visit our website to learn more: www.3Mcapacitance.com
3M Embedded Capacitance Material (ECM)
Property Test Method C0614 C1012 C2006
Capacitance/Unit Area (1 kHz) Supplier Method 6.4 nF/in2
(1.0 nF/cm2)
10.0 nF/in2
(1.6 nF/cm2)
20.0 nF/in2
(3.1 nF/cm2)
Dielectric Thickness Cross-section 14 µm (0.55 mils) 12 µm (0.47 mils) 6 µm (0.24 mils)
Copper Type Supplier Method RA ED or RA RA
Copper Thickness Cross-section 35 µm 35 µm (ED/RA)
or 17 µm (ED) 35 µm RA
Capacitance Tolerance Supplier Method +/- 10% +/- 10% +/- 10%
Dielectric Constant (1 kHz) Supplier Method 16 22 22
Dissipation Factor (1 kHz) Supplier Method 0.005 0.010 0.010
Temperature Coefficient of Capacitance (TCC) Supplier Method Meets X7R requirements
Dielectric Strength (Volts/Mil) ASTM D149 3300 3000 3000
HiPOT Voltage IPC-TM-650 2.5.7.2 100 V 100 V 50 V
UL Flammability Rating UL 94 94 V-0
UL Relative Thermal Index (RTI) UL 796 130°C 90°C490°C4
UL Solderability Limits UL 796 288°C/30 sec. 288°C/20 sec. 288°C/20 sec.
Glass Transition Temperature Supplier Method (DSC) 120°C
Moisture Absorption (wt %) ASTM D570 0.11 0.10 0.10
CTE (ppm/C) Supplier Method (TMA) 32 (x,y,z) 31 (x,y,z) 31 (x,y,z)
Degradation Temperature IPC-TM-650 2.3.40 345°C 375°C 375°C
Peel Strength (pli) IPC-TM-650 2.4.9 modified 4.0 6.0 (ED)/4.0 (RA) 4.0 (RA)
Thermal Conductivity (W/m*K) ASTM F433 modified 0.5
Halogen Content (ppm) BS EN 14582:2007 <400 None Detected
1) All test data provided are typical values and not intended to be specification values.
2) “RoHS 2011/65/EU” means that the product or part does not contain any of the substances in excess of the maximum concentration values (“MCVs”) in EU RoHS Directive 2011/65/EU. The MCVs
are by weight in homogeneous materials. This information represents 3M’s knowledge and belief, which may be based in whole or in part on information provided by third party suppliers to 3M.
In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability and Buyer’s exclusive remedy will be in accordance with the Warranty stated
below.
3) Halogen Free is defined as both 1) no halogen compounds that are intentionally added to the product or used in the manufacturing process for the product and 2) any impurities present are less
than 900 ppm bromine, less than 900 ppm chlorine and/or less than 1500ppm total bromine and chlorine. The latter are the levels set forth in certain industry standards for printed circuit boards,
such as the International Electrotechnical Commission (IEC) 61249-2-21 standard. This information represents 3M/s knowledge and belief which may be based in whole or in part on information
provided by 3rd party suppliers to 3M.
4) Epoxy default RTI temperature.
3M is a trademark of 3M Company.