TE Connectivity AMP Connectors 的 Edge Connectors 规格书

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MULTI-BEAM CARD
EDGE CONNECTORS
DATA AND DEVICES /// MULTI-BEAM CARD EDGE CONNECTORS
TE Connectivity’s (TE) next generation MULTI-BEAM card edge connectors deliver the best overall power and
signal density to address server market requirements for performance, profile and cost. MULTI-BEAM card
edge connectors are also applicable in global data communication applications to decrease costs.
These products are the next generation card edge connectors over the current SEC-II power card edge
products and deliver superior current and signal density with a unique design.
The scalable and modular features also support greater flexibility in configuration and PCB design.
KEY BENEFITS
• High density
• Better connectivity tolerance
• Modular design
• Better performance
APPLICATIONS
• Data center
• Telecommunications
• Industrial automation devices
• Power systems
nal-upt Power -
Signal - up to 60% space savings
Power - up to 30% space savings
ORDERING INFORMATION
Part Number Configuration Positions
Power Signal
2212112-1 Vertical 2x4 2x4
2214913-1 Vertical 2x13 2x24
2214913-4 Vertical 2x6 2x12
2214913-5 Vertical 2x4 2x4
2204072-1 Vertical 2x3 2x5
2214934-3 Vertical 2x2 2x4
2212078-1 Straddle 2x13 2x24
1-2212115-4 Right Angle 2x1 2x4
2212115-1 Right Angle 2x13 2x24
2214913-7 Vertical 2x2 2x6
1-2214934-4 Vertical 2x2 2x6
Vertical
Straddle
Right Angle
PAGE 2
DATA AND DEVICES /// MULTI-BEAM CARD EDGE CONNECTORS
MULTI-BEAM Card Edge Connectors
PRODUCT FEATURES & BENEFITS
High Density
• Highest signal density in the market with 60% signal space savings
• 30% power density improvement over legacy products
• Smaller pitch: signal pitch 1.00mm, power pitch 7.26mm
• Greater power contact, max. 43A
Better Connectivity Tolerance
• Better gatherability for blind-mate applications: +/-2.0mm (X),
+/-1.54mm (Y)
• More clearance between PCB pads for signal contact to prevent solder
bridging, and 1.3mm larger pads for easier alignment
• Support two PCB thickness: 1.57mm and 2.36mm
Modular Design
• Common power and signal contact module
• Flexible configuration with different contact quantities and positions
• Better scalability (AC & DC, low power & high power)
Better Performance
• Excellent mechanical and electrical performance
• Easy mating/un-mating with proper retention force
• Low level contact resistance
PRODUCT CONFIGURATIONS
Specifications
• Current rating:
• Power contact: up to 43A
• Signal contact: up to 2A
• Voltage rating:
• Power: 100V max.
• Signal: 60V max.
• Durability: 200 mating cycles
• Mechanical shock: EIA-364-27
• Vibration: EIA-364-28
• Operating temperature: -55°C to 105°C
• Low mating force
• 6N max. per power contact
• 1.5N max. per signal contact
• PCB thickness: 1.57mm and 2.36mm
• Material: high conductivity copper alloy and
high temperature resin with RoHS compliance
• Product spec: 108-32043
• Application spec: 114-128016
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1-1773923-7  06/17   DND