Littelfuse Inc. 的 MHS Varistor Series 规格书

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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
MHS Varistor Series
Description
The Multilayer High–Speed MHS Series is a very-low
capacitance extension to the Littelfuse ML family of
transient voltage surge suppression devices available in an
0402 and 0603–size surface mount chip.
The MHS Series provides protection from ESD and EFT in
high–speed data line and other high frequency applications.
The low capacitance of the MHS Series permits usage
in analog or digital circuits where it will not attenuate or
distort the desired signal or data.
Their small size is ideal for high–density printed circuit
boards, being typically applied to protect intergrated
circuits and other sensitive components. They are
particularly well suited to suppress ESD events including
those specified in IEC 61000-4-2 or other standards used
for Electromagnetic Compliance (EMC) testing.
The MHS Series is manufactured from semiconducting
ceramics and is supplied in a leadless, surface mount
package. The MHS Series is also compatible with modern
reflow and wave soldering prcesses.
Littelfuse Inc. manufactures other multilayer varistor series
products, see the ML, MLE, MLN and AUML Series data
sheets.
Features
• Halogen-Free and
RoHS compliant
• 3pF, 12pF, and 22pF
capacitance versions
suitable for high–speed
data rate lines
• ESD rated to IEC
61000-4-2 (Level 4)
• EFT/B rated to IEC
61000-4-4 (Level 4)
• Low leakage currents
• -55ºC to +125ºC
operating temp. range
• Inherently bi-directional
Applications
• Data, Diagnostic
I/O Ports
• Universal Serial
Bus (USB)
• Video & Audio Ports
• Portable/Hand-
Held Products
• Mobile
Communications
• Computer/DSP
Products
• Industrial Instruments
Including Medical
Absolute Maximum Ratings
Size Table
Metric EIA
1005 0402
1608 0603
• For ratings of individual members of a series, see device ratings and specifications table.
Continuous MHS Series Units
Steady State Applied Voltage:
DC Voltage Range (VM(DC)) : V0402/0603MHS03 ≤ 42 V
V0402/0603MHS12 ≤ 18 V
V0402/0603MHS22 ≤ 09 V
Operating Ambient Temperature Range (TA)-55 to +125 OC
Storage Temperature Range (TSTG)-55 to +150 OC
RoHS
Additional Information
Datasheet Samples
Resources
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Device Ratings and Specifications
Part
Number
Performance Specifications (25 ºC)
Maximum
Clamping
Voltage At
1A (8X20µs)
Maximum ESD Clamp
Voltage (Note 1)
Typical Leakage
Current at Specified
DC Voltage
Typical
Capacitance at
1MHz (1V p-p)
Typical
Inductance
(from Impedance
Analysis)
8kV Contact (Note 2) 15kV AIR (Note 3) 3.5V 5.5V C (Note 4) L
Clamp Clamp P ILMIN MAX
(Vc) (V) (V) (µA) (µA) (pF) (pF) (nH)
V0402MHS03N (Note 5) 135 <300 <400 0.5 1.00 2 5 <1.0
V0402MHS03F (Note 7) 135 <300 <400 0.5 1.00 2 5 <1.0
V0603MHS03N (Note 5) 135 <300 <400 0.5 1.00 1 6 <1.0
V0603MHS03F (Note 7) 135 <300 <400 0.5 1.00 1 6 <1.0
V0402MHS12N (Note 5) 55 <125 <160 0.5 1.00 8 16 <1.0
V0402MHS12F (Note 7) 55 <125 <160 0.5 1.00 8 16 <1.0
V0603MHS12N (Note 5) 55 <125 <160 0.5 1.00 8 16 <1.0
V0603MHS12F (Note 7) 55 <125 <160 0.5 1.00 8 16 <1.0
V0402MHS22N (Note 5) 30 <125 <160 0.5 1.00 15 29 <1.0
V0402MHS22F (Note 7) 30 <125 <160 0.5 1.00 15 29 <1.0
V0603MHS22N (Note 5) 30 <65 <10 0 0.5 1.00 15 29 <1.0
V0603MHS22F (Note 7) 30 <65 <100 0.5 1.00 15 29 <1.0
NOTES:
1. Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
2. Direct discharge to device terminals (IEC preferred test method).
3. Corona discharge through air (represents actual ESD event).
4. Capacitance may be customized, contact your Littelfuse Sales Representative.
5. V0402MHSxxx (0402 size devices) available as "R" packaging option only. Example: V0402MHS03NR. See Packaging and Tape and Reel sections (last page) for additional information.
6. The typical capacitance rating is discrete component test result.
7. Items are lead free and antimony free, available as "R" packing option only.
For applications exceeding 125ºC ambient temperature, the peak surge
current and energy ratings must be reduced as shown below.
Peak Current and Energy Derating Curve
Standby Current at Normalized Varistor Voltage and
Temperature
1.2
0.0
0.0001
25
0.001 0.01 0.1 1
CURRENT (mA)
NORMALIZED VARISTOR VOLTAGE (V)
FIGURE 2. STANDBY CURRENT AT NORMALIZED VARISTOR
VOLTAGE AND TEMPERATURE
1.0
0.8
0.6
0.4
0.2
85
125
O
O
O
100
80
60
40
20
0
-55 50 60 70 80 90 100110 120130 140150
PERCENT OF RATED VALUE
AMBIENT TEMPERATURE ( oC)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
Figure 1 Figure 2
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
FIGURE 3. NOMINAL VOLTAGE STABILITY TO MULTIPLE
ESD IMPULSES (8KV CONTACT DISCHARGES
PER IEC 61000-4-2)
60
10
1
Number of Pulses
NOMINAL VOLTAGE AT 1mADC
10 1001000 10000
20
30
40
50
V0402MHS03
V0402MHS12
V0603MHS03
V0603MHS12
0
V0402MHS22
V0603MHS22
Nominal Voltage Stability to Multiple ESD Impulses
(8kV Contact Discharges per IEC 61000-4-2)
Insertion Loss (S21) Characteristics
FIGURE 4. INSERTION LOSS (S21) CHARACTERISTICS
-30
FREQUENCY (MHz)
INSERTION LOSS (dB)
10 1001000 10000
-20
-10
0
V0402MHS22
V0603MHS22
V0402MHS12
V0402MHS03
V0603MHS12
V0603MHS03
Figure 3 Figure 4
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
The recommended solder for the MHS suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
6.
5.
230
5.0 6.0 7. 0
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
Reflow Solder Profile
Device Characteristics
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance model (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100µA, typically 25µA;
for 0402 size below 20µA, typically 5µA.
100%
1E-9 1E-8
SUPPRESSOR CURRENT (ADC)
10%
1E-7 1E-6 1E-5 1E-4 1E-3 1E-2
25 50 75 100125oC
SUPPRESSOR VOLTAGE IN PERCENT OF
VNOM VALUE AT 25 oC (%)
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC
CURVE IN THE LEAKAGE REGION
o
oo
o
Typical Temperature Dependance of the Characteristic
Curve in the Leakage Region
Speed of Response
The Multilayer Suppressor is a leadless device. Its response
time is not limited by the parasitic lead inductances found
in other surface mount packages. The response time of the
ZNO dielectric material is less than 1ns and the MLE can
clamp very fast dV/dT events such as ESD. Additionally,
in “real world” applications, the associated circuit wiring
is often the greatest factor effecting speed of response.
Therefore, transient suppressor placement within a circuit
can be considered important in certain instances.
GRAINS
DEPLETION
FIRED CERAMIC
DIELECTRIC
REGION
METAL
ELECTRODES
DEPLETION
REGION
METAL END
TERMINATION
FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION
Multilayer Internal Construction
Figure 5 Figure 6
Figure 7
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Product Dimensions (mm)
DIMENSION A
mm
1.70 0.020
0402
2.54 0.030
TABLE 1: PAD LAYOUT DIMENSIONS
0603
in
0.067
0.100
B
mm
0.510
0.760
in
0.610
0.890
C
mm
0.024
0.035
in
Note: Avoid metal runs in this area, parts are not
recommended for use in applications using silver
(Ag) expoxy paste.
Note: Avoid metal runs in this area, parts are
not recommended for use in applications using
Silver (Ag) epoxy paste.
D
E
W
L
Dimension 0402 Size 0603 Size
IN MM IN MM
A0.067 1.700 0.100 2.540
B0.020 0.510 0.030 0.760
C0.024 0.610 0.035 0.890
D (max.) 0.024 0.600 0.040 1.000
E0.01 +/- 0.006 0.25 +/- 0.15 0.015 +/- 0.008 0.4 +/- 0.2
L0.039 +/- 0.004 1.00 +/- 0.10 0.063 +/- 0.006 1.6 +/- 0.15
W0.020 +/- 0.004 0.50 +/- 0.10 0.032 +/- 0.006 0.8 +/- 0.15
PAD LAYOUT DEMENSIONS CHIP LAYOUT DIMENSIONS
6.
5.
230
5.0 6.0 7. 0
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
Lead–free (Pb-free) Soldering Recommendations
When using a reflow process, care should be taken to
ensure that the MHS chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Lead–free Re-flow Profile
Figure 10
6.
5.
230
5.0 6.0 7. 0
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
Wave Solder Profile
Figure 8
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Part Numbering System
V 0402
PACKING OPTIONS (See quantities in Packaging section)
DEVICE FAMILY
Littelfuse TVSS Device
R
DEVICE SIZE
0402 = .04 inch x .02 inch
(1.0 mm x 0.5 mm)
0603 = .063 inch x .031 inch
(1.6 mm x 0.8 mm)
MHS 03 N
CAPACITANCE DESIGNATION
03 = 3pF
12 = 12pF
22 = 22pF
END TERMINATION OPTION
Nickel Barrier(Ni/Sn)
N letter: lead free
F letter: lead free and antimony free
SERIES DESIGNATOR
MHS = Multilayer Hi-Speed
T = (0603 device only)13in (330mm) Diameter Reel, Plastic Carrier Tape
H = (0603 device only) 7in (178mm) Diameter Reel, Plastic Carrier Tape
R = (available for 0402 and 0603 devices) 7in (178mm) Diameter Reel, Paper Carrier Tape
Packaging*
Quantity
Device Size 13 Inch Reel
("T" Option)
7 Inch Reel
("H" Option)
7 Inch Reel
("R" Option)
0603 10,000 2,500 4,000
0402 not available not available 10,000
K0
T
1
D0P0
D1
P1A0
P2
B0
F
E
W
T
Tape and Reel Specifications
Symbol Description Dimensions in Millimeters
0402 Size 0603 Size
A0Width of Cavity Dependent on Chip Size to Minimize Rotation.
B0Length of Cavity Dependent on Chip Size to Minimize Rotation.
K0Depth of Cavity Dependent on Chip Size to Minimize Rotation.
WWidth of Tape 8 -/+ 0.2 8 -/+ 0.3
FDistance Between Drive Hole Centers and Cavity Centers 3.5 -/+.05 3.5 -/+.05
EDistance Between Drive Hole Centers and Tape Edge 1.75 -/+ 0.1 1.75 -/+ 0.1
P1Distance Between Cavity Centers 2 -/+ 0.05 4 -/+ 0.1
P2Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2 -/+ 0.1 2 -/+ 0.1
P0Axial Drive Distance Between Drive Hole Centers 4 -/+ 0.1 4 -/+ 0.1
D0Drive Hole Diameter 1.55 -/+ 0.05 1.55 -/+ 0.05
D1Diameter of Cavity Piercing N/A 1.05 -/+ 0.05
T1Top Tape Thickness 0.1 Max 0.1 Max
TNominal Carrier Tape Thickness 1. 1 1. 1
Notes:
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.