Texas Instruments 的 CD54,74HC(T)123,423 规格书

{'9 TEXAS INSTRUMENTS
1
Data sheet acquired from Harris Semiconductor
SCHS142F
September 1997 - Revised October 2003
Features
• Overriding Reset Terminates Output Pulse
• Triggering From the Leading or Trailing Edge
• Q and Q Buffered Outputs
• Separate Resets
• Wide Range of Output-Pulse Widths
• Schmitt Trigger on Both A and B Inputs
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55oC to 125oC
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30%of VCC at
VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il≤1µA at VOL, VOH
Description
The ’HC123, ’HCT123, CD74HC423 and CD74HCT423 are
dual monostable multivibrators with resets. They are all
retriggerable and differ only in that the 123 types can be
triggered by a negative to positive reset pulse; whereas the
423 types do not have this feature. An external resistor (RX)
and an external capacitor (CX) control the timing and the
accuracy for the circuit. Adjustment of Rx and CXprovides a
wide range of output pulse widths from the Q and Q
terminals. Pulse triggering on the A and B inputs occur at a
particular voltage level and is not related to the rise and fall
times of the trigger pulses.
Once triggered, the output pulse width may be extended by
retriggering inputs A and B. The output pulse can be
terminated by a LOW level on the Reset (R) pin. Trailing
edge triggering (A) and leading edge triggering (B) inputs
are provided for triggering from either edge of the input
pulse. If either Mono is not used each input on the unused
device (A, B, and R) must be terminated high or low.
The minimum value of external resistance, Rx is typically
5kΩ. The minimum value external capacitance, CX, is 0pF.
The calculation for the pulse width is t
W
= 0.45 R
X
C
X
at
V
CC
= 5V.
Ordering Information
PART NUMBER TEMP. RANGE (oC) PACKAGE
CD54HC123F3A -55 to 125 16 Ld CERDIP
CD54HCT123F3A -55 to 125 16 Ld CERDIP
CD74HC123E -55 to 125 16 Ld PDIP
CD74HC123M -55 to 125 16 Ld SOIC
CD74HC123MT -55 to 125 16 Ld SOIC
CD74HC123M96 -55 to 125 16 Ld SOIC
CD74HC123NSR -55 to 125 16 Ld SOP
CD74HC123PW -55 to 125 16 Ld TSSOP
CD74HC123PWR -55 to 125 16 Ld TSSOP
CD74HC123PWT -55 to 125 16 Ld TSSOP
CD74HC423E -55 to 125 16 Ld PDIP
CD74HC423M -55 to 125 16 Ld SOIC
CD74HC423MT -55 to 125 16 Ld SOIC
CD74HC423M96 -55 to 125 16 Ld SOIC
CD74HC423NSR -55 to 125 16 Ld SOP
CD74HCT123E -55 to 125 16 Ld PDIP
CD74HCT123M -55 to 125 16 Ld SOIC
CD74HCT123MT -55 to 125 16 Ld SOIC
CD74HCT123M96 -55 to 125 16 Ld SOIC
CD74HCT423E -55 to 125 16 Ld PDIP
CD74HCT423MT -55 to 125 16 Ld SOIC
CD74HCT423M96 -55 to 125 16 Ld SOIC
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
CD54/74HC123, CD54/74HCT123,
CD74HC423, CD74HCT423
High-Speed CMOS Logic Dual Retriggerable
Monostable Multivibrators with Resets
[ /Title
(CD74
HC123
,
CD74
HCT12
3,
CD74
HC423
,
CD74
HCT42
3)
/Sub-
ject
(High
Speed
aF—w—> AI—ANv—>
2
Pinout
CD54HC123, CD54HCT123
(CERDIP)
CD74HC123
(PDIP, SOIC, SOP, TSSOP)
CD74HC423
(PDIP, SOIC, SOP)
CD74HCT123, CD74HCT423
(PDIP, SOIC)
TOP VIEW
Functional Diagram
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
1A
1B
1R
1Q
2Q
2CX
GND
2RXCX
VCC
1CX
1Q
2Q
2R
2B
2A
1RXCX2R 11
2A 9
10
5
12 2Q
2Q
2B
MONO 2
VCC
67
2Cx 2RxCx
1R 3
1A
2
1
13
41Q
1Q
1B
MONO 1
VCC
14 15
1Cx 1RxCx
1Cx 1Rx
2Cx 2Rx
TRUTH TABLE
INPUTS OUTPUTS
ABRQQ
CD74HC/HCT123
HXHLH
XLHLH
L↑H
↓HH
XXLLH
LH↑
CD74HC/HCT423
HXHLH
XLHLH
L↑H
↓HH
XXLLH
H = High Voltage Level, L = Low Voltage Level,
X = Don’t Care.
CD54/74HC123, CD54/74HCT123, CD74HC423, CD74HCT423
3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Package Thermal Impedance, θJA (see Note 1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HC TYPES
High Level Input
Voltage VIH - - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
Low Level Input
Voltage VIL - - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or VIL -0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
High Level Output
Voltage
TTL Loads
- - ---- - - - V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
Low Level Output
Voltage
CMOS Loads
VOL VIH or VIL 0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
- - ---- - - - V
4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC or
GND -6--±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 6 - - 8 - 80 - 160 µA
CD54/74HC123, CD54/74HCT123, CD74HC423, CD74HCT423
4
HCT TYPES
High Level Input
Voltage VIH - - 4.5 to
5.5 2--2 - 2 - V
Low Level Input
Voltage VIL - - 4.5 to
5.5 - - 0.8 - 0.8 - 0.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V
High Level Output
Voltage
TTL Loads
-4 4.5 3.98 - - 3.84 - 3.7 - V
Low Level Output
Voltage
CMOS Loads
VOL VIH or VIL 0.02 4.5 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
4 4.5 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC and
GND 0 5.5 - ±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 5.5 - - 8 - 80 - 160 µA
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆ICC
(Note 2) VCC
-2.1 - 4.5 to
5.5 - 100 360 - 450 - 490 µA
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
DC Electrical Specifications (Continued)
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HCT Input Loading Table
INPUT UNIT LOADS
All 0.35
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.
360µA max at 25oC.
Prerequisite for Switching Specifications
PARAMETER SYMBOL VCC (V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
HC TYPES
Minimum Input,
Pulse Width tWL
A 2 100 - - 125 - - 150 - - ns
4.5 20 - - 25 - - 30 - - ns
617- -21- -26- -ns
Bt
WH 2 100 - - 125 - - 150 - - ns
4.5 20 - - 25 - - 30 - - ns
617- -21- -26- -ns
CD54/74HC123, CD54/74HCT123, CD74HC423, CD74HCT423
5
Rt
WL 2 100 - - 125 - - 150 - 150 ns
4.5 20 - - 25 - - 30 - 30 ns
6 17 - - 21 - - 26 - 26 ns
A and B Hold Time tH2 50 - - 65 - - 75 - 75 ns
4.5 10 - - 13 - - 15 - 15 ns
6 9 - - 11 - - 13 - 13 ns
Reset Removal Time tREM 2 50 - - 65 - - 75 - 75 ns
4.5 10 - - 13 - - 15 - 15 ns
6 9 - - 11 - - 13 - 13 ns
Retrigger Time Number trT 5---------ns
RX = 10KΩ, CX = 0 - 50 - - 63 - - 76 - ns
Output Pulse Width tW5
Q or Q
RX= 10KΩ,C
X= 10nF 40 - 50 38.7 - 51.3 38.2 - 51.8 µs
HCT TYPES
Minimum Input,
Pulse Width tWL 5-
A20--25--30--ns
Bt
WH 20 - - 25 - - 30 - - ns
Rt
WL 20 - - 25 - - 30 - - ns
A and B Hold Time tH510- -13- -15- -ns
Reset Removal Time tREM 510- -13- -15 -ns
Retrigger Time Number
(Note 3)
RX = 10KΩ, CX = 0 trT 5 - 50 - - 63 - - 76 - ns
Output Pulse Width Q or Q tW5 40 - 50 38.7 - 51.3 38.2 - 51.8 µs
RX= 10KΩ,C
X= 10nF
NOTE:
3. Time to trigger depends on the values of RX and CX. The output pulse width can only be extended when the time between the active-
going edges of the trigger input pulses meet the minimum retrigger time requirement.
Prerequisite for Switching Specifications (Continued)
PARAMETER SYMBOL VCC (V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
CD54/74HC123, CD54/74HCT123, CD74HC423, CD74HCT423
6
Switching Specifications Input tr, tf= 6ns, RX = 10KΩ, CX = 0
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC-40oC TO
85oC-55oC TO
125oCUNIT
SMIN TYP MAX MIN MAX MIN MAX
HC TYPES
Trigger Propagation Delay tPLH CL = 50pF
A, B, R to Q 2 - - 300 - 375 - 450 ns
4.5 - - 60 - 75 - 90 ns
CL = 15pF 5 - 25 - - - - - ns
CL = 50pF 6 - - 51 - 64 - 76 ns
A, B, R to Qt
PHL CL = 50pF 2 - - 320 - 400 - 480 ns
4.5 - - 64 - 80 - 96 ns
CL = 15pF 5 - 26 - - - - - ns
CL = 50pF 6 - - 54 - 68 - 82 ns
Reset Propagation Delay tPHL,t
PLH CL = 50pF 2 - - 215 - 270 - 325 ns
R to Q or Q 4.5 - - 43 - 54 - 65 ns
6 - - 37 - 46 - 55 ns
Output Transition Time tTHL, tTLH CL = 50pF 2 - - 75 - 95 - 110 ns
4.5 - - 15 - 19 - 22 ns
6 - - 13 - 16 - 19 ns
Output Pulse Width
RX = 10KΩ, CX = 10nF - - 5 - 45 - - - - - µs
Pulse Width Match Between
Circuits In the Same Package
RX = 10KΩ, CX = 10pF
--5-±2- - - - - %
Power Dissipation Capacitance
(Note 4) CPD CL = 15pF 5 - - - - - - - pF
Input Capacitance CIN CL = 50pF - 10 - 10 - 10 - 10 pF
HCT TYPES
Trigger Propagation Delay
A, B, R to QtPLH CL = 50pF 4.5 - - 60 - 75 - 90 ns
CL = 15pF 5 - 25 - - - - - ns
A, B, R to Qt
PHL CL = 50pF 4.5 - - 68 - 85 - 102 ns
CL =15pF 5 - 27 - - - - - ns
Reset Propagation Delay
R to Q or QtPHL,t
PLH CL = 50pF 4.5 - - 48 - 60 - 72 ns
Output Transition Time tTHL, tTLH CL = 50pF 4.5 - - 15 - 19 - 22 ns
Output Pulse Width
RX = 10KΩ, CX = 10nF - - 5 - 45 - - - - - µs
CD54/74HC123, CD54/74HCT123, CD74HC423, CD74HCT423
7
Switching Specifications Input tr, tf= 6ns, RX = 10KΩ, CX = 0 (Continued)
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC-40oC TO
85oC-55oC TO
125oCUNIT
SMIN TYP MAX MIN MAX MIN MAX
Pulse Width Match Between
Circuits In the Same Package
RX = 10KΩ, CX = 10pF
--5 ±2- - - - - %
Input Capacitance CIN CL = 50pF - - - 10 - 10 - 10 pF
NOTE:
4. CPD is used to determine the dynamic power consumption, per multivibrator.
PD = (CPD + CX) VCC2 fi∑(CL VCC2 fO)
Where
fi = input frequency
fO = Output Frequency
CL = Output Load Capacitance
CX = External Capacitance
VCC = Supply Voltage,
assuming fi « I
tW
-
--
---
CD54/74HC123, CD54/74HCT123, CD74HC423, CD74HCT423
8
Test Circuits and Waveforms
FIGURE 1. OUTPUT PULSE CONTROL USING RESET INPUT
(R) PULSE FOR 123 FIGURE 2. OUTPUT PULSE CONTROL USING RESET INPUT
(R) FOR 423
FIGURE 3. TRIGGERING OF ONE SHOT BY INPUT A OR INPUT B FOR A PERIOD tW
FIGURE 4. TYPICAL OUTPUT PULSE WIDTH AS A FUNCTION
OF CX FOR RX = 10kΩ AND 100kΩFIGURE 5. TYPICAL “K” FACTOR AS A FUNCTION OF VCC
B = LOW
A = HIGH
tWtW
VS
VS
Q
R
B
A
tWtW
A
B
R
B = LOW
A = HIGH
Q
tW
VS
VS
tWtW
A
B
B
A
Q
trT
(R = HIGH)
tWtW
tW
tW
N
OTE: Output pulse control using retrigger pulse for 123 and 423.
VS
OUTPUT PULSE WIDTH (µs)
2
4
6
8
103
102
101
2
4
6
8
2
4
6
8
2
4
6
8
EXTERNAL CAPACITANCE (CX) - pF
2468
1031042 4 68 2 4 68 2 4 68
105106107
RX = 100kΩ
RX = 10kΩ
DC SUPPLY VOLTAGE (VCC) = 5V
AMBIENT TEMPERATURE (TA) = 25oC
EXTERNAL CAPACITANCE (CX) = 10nF
EXTERNAL RESISTANCE (RX) = 10kΩ TO 100kΩ
AMBIENT TEMPERATURE (TA) = 25oC
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1 1234 567891011
“K” FACTOR
HCT
DC SUPPLY VOLTAGE (VCC) - VOLTS
{I} TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 13-Jul-2022
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8684701EA ACTIVE CDIP J 16 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8684701EA
CD54HC123F3A Samples
5962-8970001EA ACTIVE CDIP J 16 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8970001EA
CD54HCT123F3A Samples
CD54HC123F ACTIVE CDIP J 16 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 CD54HC123F Samples
CD54HC123F3A ACTIVE CDIP J 16 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8684701EA
CD54HC123F3A Samples
CD54HCT123F3A ACTIVE CDIP J 16 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8970001EA
CD54HCT123F3A Samples
CD74HC123E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HC123E Samples
CD74HC123EE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HC123E Samples
CD74HC123M ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC123M Samples
CD74HC123M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -55 to 125 HC123M Samples
CD74HC123M96E4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC123M Samples
CD74HC123M96G4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC123M Samples
CD74HC123ME4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC123M Samples
CD74HC123MG4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC123M Samples
CD74HC123MT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC123M Samples
CD74HC123MTG4 ACTIVE SOIC D 16 250 TBD Call TI Call TI -55 to 125 Samples
CD74HC123NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC123M Samples
CD74HC123PW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ123 Samples
CD74HC123PWE4 ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ123 Samples
CD74HC123PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -55 to 125 HJ123 Samples
Addendum-Page 1
{I} TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 13-Jul-2022
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
CD74HC123PWRE4 ACTIVE TSSOP PW 16 2000 TBD Call TI Call TI -55 to 125 Samples
CD74HC123PWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ123 Samples
CD74HC123PWT ACTIVE TSSOP PW 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ123 Samples
CD74HC423E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HC423E Samples
CD74HC423M ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC423M Samples
CD74HC423M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC423M Samples
CD74HC423M96G4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC423M Samples
CD74HC423MG4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC423M Samples
CD74HC423MT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC423M Samples
CD74HC423NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC423M Samples
CD74HCT123E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HCT123E Samples
CD74HCT123M ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT123M Samples
CD74HCT123M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT123M Samples
CD74HCT123M96G4 ACTIVE SOIC D 16 2500 TBD Call TI Call TI -55 to 125 Samples
CD74HCT123MT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT123M Samples
CD74HCT423E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HCT423E Samples
CD74HCT423M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT423M Samples
CD74HCT423M96G4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT423M Samples
CD74HCT423MT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT423M Samples
CD74HCT423MTE4 ACTIVE SOIC D 16 250 TBD Call TI Call TI -55 to 125 Samples
CD74HCT423MTG4 ACTIVE SOIC D 16 250 TBD Call TI Call TI -55 to 125 Samples
Addendum-Page 2
TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 13-Jul-2022
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD54HC123, CD54HCT123, CD74HC123, CD74HCT123 :
•Catalog : CD74HC123, CD74HCT123
•Military : CD54HC123, CD54HCT123
NOTE: Qualified Version Definitions:
Addendum-Page 3
TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 13-Jul-2022
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
Addendum-Page 4
I TEXAS INSTRUMENTS 5:. V.’
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1 Q1Q2 Q2
Q3 Q3Q4 Q4 User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CD74HC123M96 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1
CD74HC123M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD74HC123M96G4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD74HC123NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD74HC123PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD74HC123PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD74HC123PWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD74HC123PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD74HC423M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD74HC423NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD74HCT123M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD74HCT423M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC123M96 SOIC D 16 2500 364.0 364.0 27.0
CD74HC123M96 SOIC D 16 2500 340.5 336.1 32.0
CD74HC123M96G4 SOIC D 16 2500 340.5 336.1 32.0
CD74HC123NSR SO NS 16 2000 356.0 356.0 35.0
CD74HC123PWR TSSOP PW 16 2000 364.0 364.0 27.0
CD74HC123PWR TSSOP PW 16 2000 356.0 356.0 35.0
CD74HC123PWRG4 TSSOP PW 16 2000 356.0 356.0 35.0
CD74HC123PWT TSSOP PW 16 250 356.0 356.0 35.0
CD74HC423M96 SOIC D 16 2500 340.5 336.1 32.0
CD74HC423NSR SO NS 16 2000 356.0 356.0 35.0
CD74HCT123M96 SOIC D 16 2500 340.5 336.1 32.0
CD74HCT423M96 SOIC D 16 2500 340.5 336.1 32.0
Pack Materials-Page 2
I TEXAS INSTRUMENTS
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TUBE
L - Tube length
T - Tube
height
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD74HC123E N PDIP 16 25 506 13.97 11230 4.32
CD74HC123E N PDIP 16 25 506 13.97 11230 4.32
CD74HC123EE4 N PDIP 16 25 506 13.97 11230 4.32
CD74HC123EE4 N PDIP 16 25 506 13.97 11230 4.32
CD74HC123M D SOIC 16 40 507 8 3940 4.32
CD74HC123ME4 D SOIC 16 40 507 8 3940 4.32
CD74HC123MG4 D SOIC 16 40 507 8 3940 4.32
CD74HC123PW PW TSSOP 16 90 530 10.2 3600 3.5
CD74HC123PWE4 PW TSSOP 16 90 530 10.2 3600 3.5
CD74HC423E N PDIP 16 25 506 13.97 11230 4.32
CD74HC423E N PDIP 16 25 506 13.97 11230 4.32
CD74HC423M D SOIC 16 40 507 8 3940 4.32
CD74HC423MG4 D SOIC 16 40 507 8 3940 4.32
CD74HCT123E N PDIP 16 25 506 13.97 11230 4.32
CD74HCT123E N PDIP 16 25 506 13.97 11230 4.32
CD74HCT123M D SOIC 16 40 507 8 3940 4.32
CD74HCT423E N PDIP 16 25 506 13.97 11230 4.32
CD74HCT423E N PDIP 16 25 506 13.97 11230 4.32
Pack Materials-Page 3
MECHANICAL DATA D ( *"ifi O G if” )LASHC SMALL 0U ¥N¥ 4040047 S/M 06/1‘ NO'ES, A AH Hnec' dimensmrs c'e m 'mc'ves ['nflhmeter5> B Th5 drawer ‘5 subje», ,0 change mm: Home, A Body \cngth docs rm mac mod Hoar, p'omswons, (xv gmc bms Mom mm warmers, or gm buns sha‘ nm exceed 3005 (015) eam swce @ Body mm does 101 meme 11mm fish. E Rdererce JEDEC MS 012 mam Ac, nter‘ec: flash sfu‘ not exceed 0017 (043) each swde {if TEXAS INSTRUMENTS www.1i.com
LAND PATTERN DATA D (RiPDSOiGiB) PLASTiC SMALL OUTLINE stencil Openings Example Pod Geometry (See Note c) Non Soidermosk Detirled Pad alir 4x1, 27 i 16X0'55ai ‘+l4xi 27 mwannnaia— i6x}v5°--4Er~Eifl{iEr-Hfl-T @E-HnH-a-a— {downgrade r, Example Snider Mask 0 erlin l /l/ i a i 0 07 It (See Note E) All Around ,' 421i233e4/E oa/iz AH linear dimensions are in millimeters This drawing is subject ta anange without notice. Publication che7351 is recommended tar alternate designs. Laser cutting apertures with trapezoidal wail: and also rounding corners will otter better paste release contact tneir board assembly site ror stencil design recommendations, Rerer to ch—7525 tor otner stencil recommendations Customers shouid contact their board lubrication site tor solder musk toierances between and around Signal pods NOTES: Customers should POE”? r" {I} Tums INSTRUMENTS www.li.com
www.ti.com
PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X 0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
B
NOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
89
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
v¢\‘\‘\‘\+““‘ gimm—LE—urmm M i
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
89
16
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
YL““‘+““‘ fimmamfl J
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
89
16
MECHANICAL DATA NS (R-PDSO-G") PLASTIC SMALL—OUTLINE PACKAGE 14-PINS SHOWN HHFHHFH j j t t H H j, A jfi/—\ % lgLLLLLiLLL/fiif A MAX 1060 1060 1290 1530 A MW 990 9,90 1230 14‘70 4040062/0 03/03 VOTES: A. AH Hneur dimenswons are m mHHmetevs a, Tm: druwmg 5 subject to change wmom name. 0 Body dwmenswons do not mamas mom flash 0v pmtmswom not to exceed 0,15 INSTRUMEN'IS www.li.m
J (R76D1P7TM) CERAVVHC DUAL 1N7L1NE PACKAGE )4 LEADS SHOWN PWS u . W 14 e 18 20 0300 0300 0300 0300 E (7.52) (7.52) (7.62) (7.62) w 5 Est ass ass ass fl fl m m m m m E MAX 0.755 540 0.950 1.060 (19.94) (21.34) (24.35) (25.92) I ..15,,, 1 0 500 0,300 0,310 0.300 U U U U U U U C W (7.52) (7.52) (7.57) (7.52) 0.245 0.245 0.220 0.245 0.005 (1.65) 0 MW 0045 (1.14) (6.22) (6.22) (5.50) (6.22) 0000 ( . ) a «0005(0.13)MN m r ~ 0200 (5.05) MAX 7 ; Seatmg Pmne , 0 (3.30) MN 4 0 020 (0. 66) 0014 (0.36) 0715' 0100 (.)254 0.014 (0.36) 0,000 (0.20) 4040083/F 03/03 VOTES: A. AH Hneur d1mens1ons are 1’1 1mm (muhmeters) a, This druwmg '3 subject m change w'thout nnt'ce. 0, 1m package 15 hermehcoHy sewed mm a cemm 11a usmg q1ass mt. D. 11an pom 1’s prowded on cap fo' 1mm) 1den1111ca0an umy on press cemrmc 9055 m sea) 00W. E FaHs thin ML 513 1035 0011417114. 001141416. GDPPTTB 0'10 001017120
MECHANICAL DATA N (R—PDlP-T“) PLASTIC DUAL—IN—LINE PACKAGE 16 P15 SHOWN PWS " A L . [NM 15 a 20 16 9 0 775 U 777 0 SZU '1 USE 3 , 1H HH HH r% r’H r"—1 r’H H1 1 A VAX “9‘69? (191591 (23,37) (25,92) 0 250 (6,50‘ A MN [1145‘ 0142‘ 0.350 new 3 O 240 (6.10), 15 92/ (1832/ (2 .59) (23,58) MSiUO‘ (A AA AA Ari AA AA AA R1 &. VAR1AT1CN M RR AC AD 1 B 0070( (17s) 0015 (111) A 0045 (1,111 g n > , ‘ -) 3.020 (0,51) MW w o 5 (0 35) 0200( 38) MAX f, ), Gnu E Home 1 1‘ 9 fix—1%)” 1 0125’ 1/111 4% 0010 (v.37 ) NOM 31a) U L»- J 0450 (13,92) MAX L 202‘ (0,53) » e c 015 (0,35) / \ a; 00‘s (0,Zb)® / \ 1 1 \\¥,// 11/18 Pm (My > @ 20 Pm vendor upho'v mom/r 17/7037 NO'FS A AH Mnec' mmensmr‘fi: B 1m: drawmq 1s sume m muss (m1111mevem) 0 change mm): nofice /c\ FuHs wumn JEDEC M57001, except 15 an: 20 p171 'r1111mLm body 1mm (01m A) A The 70 p171 and 15m} shmflder Md” 15 a ve'vdnr 0311071, eher NIH Dr 111 wkflh INSI'RUMENTS www.1i.com
www.ti.com
PACKAGE OUTLINE
C
8.2
7.4 TYP
14X 1.27
16X 0.51
0.35
2X
8.89
0.15 TYP
0 - 10
0.3
0.1
2.00 MAX
(1.25)
0.25
GAGE PLANE
1.05
0.55
A
10.4
10.0
NOTE 3
B5.4
5.2
NOTE 4
4220735/A 12/2021
SOP - 2.00 mm max heightNS0016A
SOP
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
116
0.25 C A B
9
8
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.500
£353 RE Vi“““‘ ““““““ WEECE = Era ,MQL 1"
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
14X (1.27)
(R0.05) TYP
(7)
16X (1.85)
16X (0.6)
4220735/A 12/2021
SOP - 2.00 mm max heightNS0016A
SOP
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
OPENING
SOLDER MASK METAL
SOLDER MASK
DEFINED
LAND PATTERN EXAMPLE
SCALE:7X
SYMM
1
89
16
SEE
DETAILS
SYMM
Efimfifij v¢\‘\‘\‘\
www.ti.com
EXAMPLE STENCIL DESIGN
(7)
(R0.05) TYP
16X (1.85)
16X (0.6)
14X (1.27)
4220735/A 12/2021
SOP - 2.00 mm max heightNS0016A
SOP
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:7X
SYMM
SYMM
1
89
16
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