Molex 的 78726-002 Appl Spec 规格书

TABLE OF CONTENTS REVTSION ECN INFORMATION. EC No DATE. T‘TLE SHEET No. DOCUMENT NUMBER. AS-78726-002 CREATED / REVTSED BY CHECKED BY. APPROVED BY.
DDR4 DIMM THROUGH-HOLE CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION:
ECN INFORMATION: TITLE:
SI Routing Guidelines for
DDR4 DIMM Vertical Through-Hole Connector
SHEET No.
B
EC No:
S2014-1130
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DATE:
2014/05/19
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TEMPLATE FILENAME: SPM[SIZE_A](V.1).DOC
TABLE OF CONTENTS
1.0 SCOPE
2.0 PC BOARD REQUIREMENTS
2.1 MATERIAL THICKNESS
2.2 HOLE DIMENSIONS
2.3 LAYOUT
3.0 HIGHSPEED ROUTING
3.1 GENERAL ROUTING EXAMPLE
3.2 HIGH SPEED REFERENCE PLANE ANTI-PAD
3.3 CONNECTOR THROUGH-HOLE INTERFACE VIA STUBS
3.4 SKEW COMPENSATION
3.5 TRACE COMPARISON FOR DIFFERENTIAL SIGNALING
? olex‘ C REVISION: ECN \NFORMATION: EC No: DATE TITLE: SHEET ND DOCUMENT NUMBER. AS -78726-002 CREATED / REVISED BY: CHECKED BY. APPROVED BY
DDR4 DIMM THROUGH-HOLE CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION:
ECN INFORMATION: TITLE:
SI Routing Guidelines for
DDR4 DIMM Vertical Through-Hole Connector
SHEET No.
B
EC No:
S2014-1130
2
of
7
DATE:
2014/05/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
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S
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CMWONG 2014/05/19 CHYEO 2014/05/19 WTCHUA 2014/05/19
TEMPLATE FILENAME: SPM[SIZE_A](V.1).DOC
1.0 SCOPE
This specification covers the high-speed PCB routing recommendations of DQ and DQS signals
for 78726 (Standard) and 151016 (Aero) series connector. The connector is a vertical through-
hole type designed for use with 0.66mm finished vias. The pins of the connector are soldered for
mechanical retention to the PC board.
DISCLAIMER: Molex does not guarantee the performance of the final product to match the
information provided in this document. All information in this report is considered proprietary,
confidential and the property of Molex. This guide is not intended as a substitute for engineering
analysis.
FIGURE 1
? olex‘ C Recommended Hole Dimensions FN‘SHEU I'TH ,le A JfiLLE ,2 IEIAVETEH 5N E! ANVxJLI-‘AR RING “1 r— cm 0 FT? THIFKKETS >EE NOTE TCT AL THIC K\E Vfi k ELEITR 3-DEPOSITED ( u: vE.‘ REVISION: ECN \NFORMATION: TITLE: SHEET No, EC No: DATE DOCUMENT NUMBER. CREATED I REVISED BY: CHECKED BY. APPROVED BY AS -78726-002
DDR4 DIMM THROUGH-HOLE CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION:
ECN INFORMATION: TITLE:
SI Routing Guidelines for
DDR4 DIMM Vertical Through-Hole Connector
SHEET No.
B
EC No:
S2014-1130
3
of
7
DATE:
2014/05/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
A
S
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CMWONG 2014/05/19 CHYEO 2014/05/19 WTCHUA 2014/05/19
TEMPLATE FILENAME: SPM[SIZE_A](V.1).DOC
2.0 PC BOARD REQUIREMENTS
2.1 MATERIAL THICKNESS
The recommended PC board thickness shall be 1.57mm, 2.36mm or 3.00mm, depending on
the length of the lead-in tail of the terminal selected. Suitable PC board material shall be
glass epoxy (FR-4).
2.2 HOLE DIMENSIONS
The holes for the connector assembly must be drilled and plated through to dimensions
specified in Figure 2.
DIM. “A”
MM (INCH)
DIM. “B”
MM (INCH)
DIM. “C”
MM (INCH)
0.66+/-0.05 (0.026+/-0.002) 0.762+/-0.01 (0.030+/-0.0004)
0.9652+/-0.05 (0.038+/-0.002)
Note: Refer to appropriate sales drawing for recommended PCB holes and PCB thickness
FIGURE 2
2.3 LAYOUT
The holes for the connector assembly must be precisely located to ensure proper placement
and optimum performance of the connector assembly. Refer to the applicable Sales
Drawing for the recommended hole pattern, dimensions and tolerances.
lexi‘ 0
DDR4 DIMM THROUGH-HOLE CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION:
ECN INFORMATION: TITLE:
SI Routing Guidelines for
DDR4 DIMM Vertical Through-Hole Connector
SHEET No.
B
EC No:
S2014-1130
4
of
7
DATE:
2014/05/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
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CMWONG 2014/05/19 CHYEO 2014/05/19 WTCHUA 2014/05/19
TEMPLATE FILENAME: SPM[SIZE_A](V.1).DOC
3.0 HIGH-SPEED ROUTING
3.1 GENERAL ROUTING EXAMPLE (other configurations are possible)
The routing example shown is for reference only. The above was extracted to show a portion that
contains the routing of DQ and DQS signals. It shows 2 layers overlaid (1 signal and 1 reference
ground layer).
Parameter MM (INCH)
Single-ended trace width 0.1651 (0.0065)
Differential trace width / spacing 0.1016 (0.0040) / 0.1016 (0.0040)
DQ to DQ spacing (S1) 0.6604 (0.0260)
DQ to DQS spacing (S2) 0.6604 (0.0260)
Note: All the parameters above can vary from recommendation to meet board thickness, routing
and electrical requirements.
> olex‘“ C 0000000 0000000 OOOOOOC OOOOOOO REVISION: ECN \NFORMATION: EC No: DATE TITLE: SHEET ND DOCUMENT NUMBER. AS -78726-002 CREATED / REVISED BY: CHECKED BY. APPROVED BY
DDR4 DIMM THROUGH-HOLE CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION:
ECN INFORMATION: TITLE:
SI Routing Guidelines for
DDR4 DIMM Vertical Through-Hole Connector
SHEET No.
B
EC No:
S2014-1130
5
of
7
DATE:
2014/05/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
A
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7
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CMWONG 2014/05/19 CHYEO 2014/05/19 WTCHUA 2014/05/19
TEMPLATE FILENAME: SPM[SIZE_A](V.1).DOC
3.2 HIGH-SPEED REFERENCE PLANE ANTI-PAD
All Ground Planes
Note: Dimensions can vary from recommendation to meet board thickness, routing and electrical
requirements.
Anti
-
pad
Diameter
= 1.2192mm (0.048”)
? olex‘ C __‘ F— Aruh. Him 5w H'ch’erm Luye’ J Law a one Luyu __| l.— Amglu Nu '_ 5‘10 Bottom Launch T° Launch REVISION: ECN \NFORMATION: TITLE: SHEET ND EC No: DATE DOCUMENT NUMBER. CREATED / REVISED BY: CHECKED BY. APPROVED BY AS -78726-002
DDR4 DIMM THROUGH-HOLE CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION:
ECN INFORMATION: TITLE:
SI Routing Guidelines for
DDR4 DIMM Vertical Through-Hole Connector
SHEET No.
B
EC No:
S2014-1130
6
of
7
DATE:
2014/05/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
A
S
-
78
7
26
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2
CMWONG 2014/05/19 CHYEO 2014/05/19 WTCHUA 2014/05/19
TEMPLATE FILENAME: SPM[SIZE_A](V.1).DOC
3.3 CONNECTOR THROUGH-HOLE INTERFACE VIA STUBS
Only the signal reference ground planes were shown above and only two annular rings are required
for retention of the through-hole via within the printed circuit board. Non-functional annular rings
should be removed for unassociated signal layers.
For the connector through-hole vias, specify not only the 0.66mm (0.026”) finished hole size but
also the 0.762mm (0.030”) drill size for the board fabrication.
Bottom Launch
Driven Via
(Preferred)
Top
Launch
Stub Via
(Worst Case)
? olex‘ \J PREFERRED NOT RECOMMENDED , 2‘ T _ REVISION: ECN \NFORMATION: TITLE: SHEET No, EC No: DATE DOCUMENT NUMBER. CREATED I REVISED BY: CHECKED BY. APPROVED BY AS-78726-002
DDR4 DIMM THROUGH-HOLE CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION:
ECN INFORMATION: TITLE:
SI Routing Guidelines for
DDR4 DIMM Vertical Through-Hole Connector
SHEET No.
B
EC No:
S2014-1130
7
of
7
DATE:
2014/05/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
A
S
-
78
7
26
-
00
2
CMWONG 2014/05/19 CHYEO 2014/05/19 WTCHUA 2014/05/19
TEMPLATE FILENAME: SPM[SIZE_A](V.1).DOC
3.4 SKEW COMPENSATION
It is recommended that skew compensation be distributed verses grouped in one or more
locations. This applies for both intra skew compensation of each DQS pair and inter skew
compensation between all DQ and DQS within the same data lane group.
3.5 TRACE COMPARISON FOR DIFFERENTIAL SIGNALING
TRANSITION SHOULD BE SYMMETRIC