Texas Instruments 的 CD4060B Types 规格书

*5" TEXAS INSTRUMENTS CD4OGOB Types CMOS 14-Suge Rlpple- Carry Blnary Counter/Di ider and Oscillator High-Volmga Types (20-Volt Rating) Features: 11 MHzclonk rm n15 V 00mm nut Fully antic Won Mum! imam and oumun sun-in my inpurpuhl llm 1m mud In: wine-m aunt“ n m v sundnrdiud, Iymmnliwl output dun-medulla: 5-v, llw, ml ls-V wlnmvle "ting! Mans all mammals of JEDEC Tonmlva Sand-7d No. ISB. "Slant” SM":- llam lor dualpfion ul "a" Sories cMos Dmm" Oscillator Few lures: I All min com-m: on will I no 0! try“ will“ mfi'uninn - ac willm Mummy m sea km min t 15 v '_____ a ol .2 °"I_"’°” (ta—r“! I rru m I Ila—I n on - I-nlou non-um mum m "ml Vw ,, M I n m "E” m E w a norm ‘ 9m: flflu‘fifi‘ufiflfi‘flfi%fi mum "F“ “no ‘0’ unknown Vs: Fig. 1 — Louie «nun. mun um‘mmm no mv-voumm: Mao) ValmWhymT-M...... ”Ham/luaov NPWVOLTAGEMNGEMLWHITB l-omuvnnwsv DCNPWMW,MNEIWy POWER 033mm" pen name (Pox rwvA-mqolm . Fun-newclouzmc Dawes nlsanmou m olnpurmuumn mum soonw zoomw ma YA - mu. rm—rm'mmanmae um Pm typos) .N loomw ovmmtemms mesa» .wc h olzsflc aromasleuvzmlwzmzlrm) l-Wcholm LEAD YEMPEMWRE mama mammal: Almmegl/umnungonmnwunuulww-m l. .. ouflc 3458 , 5 s n-IHIC ' -®+— .m .I . m... .. mm m. “59... V_.. .. . “In“ I. ' ’GQ I 30 "trauma FUNCYIOIAAL DIAGRAM Applications l camel want-n - Tim-n I Flmncv div/Hon I “My circuit: mum: r}, 2 4 mil mm"; mph.» m... Mm m. mmmm um -.. wm-m-uun M'IfiiManI fig 1 — Yypicalncmm-l uuwrlnw mm mutmton'a‘lifl.
Data sheet acquired from Harris Semiconductor
SCHS049C − Revised October 2003
HCD4060B consists of an oscillator
section and 14 ripple-carry binary counter
stages. The oscillator configuration allows
design of either RC or crystal oscillator
circuits. A RESET input is provided which
resets the counter to the all-O’s state and
disables the oscillator. A high level on the
RESET line accomplishes the reset function.
All counter stages are master-slave flip-flops.
The state of the counter is advanced one step
in binary order on the negative transition of fI
(and fO). All inputs and outputs are fully
buffered. Schmitt trigger action on the
input-pulse line permits unlimited
input-pulse rise and fall times.
The CD4060B-series types are supplied in
16-lead hermetic dual-in-line ceramic packages
(F3A suffix), 16-lead dual-in-line plastic
packages (E suffix), 16-lead small-outline
packages (M, M96, MT, and NSR suffixes), and
16-lead thin shrink small-outline packages (PW
and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
004061237571” sum: ELECTRICAL cums 11157ch 1 . 1 u wan; counmom Hum :17 mmcxrzu 1510531111125 (6c) r rams-11c . 1 V0 V111 Von ‘ "'5 s M 1v) M —55 411 +55 +125 1111.. Wu Mex. o“. ‘ - 0,5 5 5 5 150 1511 _ om 5 0;...3‘ - 5,10 15 1o 10 3011 zoo - 0.04 111‘,A nun-m. _ 11,15 15 20 21> 5011 too .2: am an 7 loom-1. — 0,20 211 100 1110 3000 new _ 0.05 1011 , 051 11.42 .a . 1 - 011191.11.“ 0,4 11,5 5 1194 o 5 051 (swan-um, 0.5 11,10 11) 1.5 1.5 1.1 11.9 1.3 15 — 'OLM‘"' 1.5 0.15 15 4.2 4 2.5 2.4. 3.4 5,5 — (H5111 4.5 0,5 5 —o.sa1 —o.s1 —o.42 41.35 4.51 —1 — mA (some. 25 0.5 5 -2 —1.5 4.11—1.15 4.5 4.2 e W" ', 9.5 0,10 10 v1.5 —1.5 —1,1 —o.s —1.:1 —2.e — 10,.Mm, . 13.5 0,15 15 4.2 _4 _2.5 72.1 43.4 —e.s — Oumwww. — 0,5 5 6.05 ‘ , o 0.55 1.1mm“. 7 0.10 10 0.05 _ o 0.55 VOLM“ — 5,15 15 0.05 7 a 0.05 V amp." 4 0,5 5 4.95 4,55? .5 — VFW“: - 0,11) 111 9.95 sissf 10 — 0,15 15 14.95 14. 15 - — 5 1.5 _ _ 1.5 — I0 :1 _ — :1 — 15 4 _ A 4 v 7 5 3.5 3.5 — — — 1a 7 7 _ _ _ 1s 11 11 — — '1W‘,fi‘"""‘ - 0.15 I8 20,1 211.1 11 .51 - :1r5 1151 11A IN “- ‘Dln nm nwlb-hl- 1n mum-111 or 10. RECOMMENDED OPERATING CONDITIONS For maximum "liability, Mina! wanting condition: would be NEW n um mania" i! always M'Wn ”I fol/mam cmaAcrsmmc V“, “'4'" umrd MIN. MAX. SuBPW‘Volugt Rang: (F171 1’ = Full Package Temperature Range) A ‘ 3 '3 V 5 mo — 111911145115- Width, ‘W (i = 100 kHz) l0 ‘0 7 115 IE 30 - 5 IHWK‘VUIR Kin Tim and Fall Time, (m, ‘M II) Unlimitld I5 5 7 3.5 lnpuM’ulw Fremancy, {OI (Exxernal nulse source) In - 3 MHz 15 . — 12 5 120 — Ruse! Pulse Width. ‘W IO 60 7 115 IS 40 — 3-159 Wm" wan-1111 mar-1124M: v51.“ wry Fig 4 — Minimum MMnMInuuwl/ow kink) cwmnl cummmu NAM-mm mummy—v 5..me 1-- Fig 5 — 1m“; “MIMI! nurpumign 1mm; wmntcmucrvixna. NEH VOLTAGE IGI MOI“ 0008 mwmm mu mew—v Fig. 5 — Minimum ”hum-I mum man ham-l cum! «nu-mama E i i 5 o m «1 1w umllu-(nnkpr mm“, Fig. 7 — 1mm plop-prion my um 10,, 11: anal - . mm M Imam/unto.
6040608 Type: DYNAMIC ELECTRICAL CHABMTERISTICS at YA: 5° C Input .3 ' 20 m. CL” ‘ BL = zoo m 2 TEST um'rs — wARACVERIsTIC oouoITlous UNIrs E VDD MIN. m. MAX. ‘ (VD 5mm vault: :vwvw Mun-Pal“ own-m E ‘ ' _. " Provisallon Dgllv 5 - 37° 7‘" ,3 ~ Time,¢[ too-10m: m ‘ 150 300 5 WHL‘ KPLH :5 ~ '00 zoo § Pmasauw Dehv 5 ‘ '°° 2"“ ° 3" M 53mm #3 . . "’ "’° . I. _' uu- nu- Tune. On [D 0.14], ‘0 ‘ 50 ‘00 n, a- "gummy any rim-Io, n a, lPNL. ‘PLH I5 ~ 40 Ba Oawvflflllumn‘onaHafiW-m. Transmon Time, 5 ~ 100 200 mu, .TLH l0 — so 100’ "S 15 v to so = . . 5 v so I a Mm: Input Pulse k ‘00 kHz 0|) : wmh. (W m , 20 40 ! l5 — 15 so ; mum-Pun Rise & Full 5 g y, Tim:, 1”,, I“, 10 Unhmilzd g 4" I5 Max. InpuH’uln 5 3.5 7 — Frequencv, l _ new... (Emma mug '0 a '6 ‘ W“ MWMW ’ WM, \5 I2 14 _ Fr, 9 _ Yyplul I‘multion Iimou a rum/on fluid m , lnputCapacuunu,Cq Any Inpm — 5 7.5 pF ° E m RIM Damon Alllsnr rfiurouvul‘ 47.1-25' : Proms-non Dolly 5 _ we 350 —_ :Lfl-Alliilncluntz mm”. Time, lPHL ID - so I60 I5 — so we ,3 Minimum Run 5 — 60 ‘10 Pulse wmh. 1w 10 ~ 30 so '7 15 — 20 40 ~ % / ,, / ,m. 1:4“; . 1 :m; m“ mmsmuw. x. mputsv Fig 10 — Typk‘ll WWII: pm! fi'fl/fllm‘. function cl r'rlpln‘ [Wt cl cxm-cncpcmu nc-Immen smmv mm»- ns-cullm u-wm m. .,;. MM [-12 I“ "ti-311” nun-mm. Ila-51154 Fig I! — Wmo‘i‘sinln'on uremic. n. 12 - W Mama". my 13 A maul mun mm", 3-180
6040603 Type: DWAMIC ELECTRICAL CHARACTERISTICS at 7A - 5°C. Input 9, If I 20 III. y CL-SflpF. nL- zoom [nom’dl f” LIMITS VD" mm: TEST umrs y' annAcrzmsnc vDD 5' WND'T'MS (V) Min. Tyn. Mu. RC Ont-ion c -2oo pF, 5 — 2311064 — v v F - X unmzntamgwum) “5 = 55° “‘1' “’ _ “*1“ ’ “ RX - 50 m 15 — mum — v! m: m mm Variation 0" Flt Cx = 200 PF, 5V to m V _ L5 _ by. u — amnumdhm current. qu-ncv wnh voltage as n 560 m, Iov w Isv _ 05 _ change (Saml Unit) ax = so kn Rxmax. cx=I0pF 5 — — 20 = so uF Io — — 20 rm "f“ = ID uF Is — — 10 ml 21mm cX max‘ Rx = 500 m 5 A A 1000 V.“ : I , = 300 m In — - so uF v.1 ._ , - 300 m 15 — , so ~ ' Maximum Oscillator £5301?) ID 530 650 810 k"! 3“ ”ya-Lima”... memy' ex = l5 pF IS 690 300 940 ”my“ g g Drive Cuuem u Fm 15 , Input mm... 3 5 Pin 9 (For own-m 5 Dcsigu) v0 = M v 5 mo n.3a _ g IOL = ,5v lo 042 0.8 — um i E = 45 v I5 2 — 1 "‘A "MILL = V0 = 4.5 v 5 —o.1a 4:435 — y“, ._ ms 'oH ' 9‘5 V W 47.42 4’3 - W ‘— mflfi’" =13.5v l5 _‘ -2 — Vs: :: mmwvu we uncillllm toplicaflom m n01 mommm-a It supply vnluual Wow 7 v w ax < so="" m.="" l="" mné'féwn="" m="" :1.="" 15="" —="" ["0111th="" terminal="" diagram="" ..="" _="" m="" m="" a.="" as="" .2="" —qu="" u="" _="" 41="" n="" —ao="" ’="" —="" ‘0="" "a!="" mu:="" mgrum:="" in="" ,="" fin-”10‘="" man-o4="" mam="" mummm.mum=""> drum! 6nd rmumou m m null mr’ ml. DrmMuwu m pom-mu m a. Mum." w oxen-nun cm dlmwlI-Iom And pad hymn Ior cm 3-181
I TEXAS INSTRUMENTS
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
CD4060BE ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4060BEE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4060BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4060BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4060BF3AS2534 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4060BM ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BM96 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BM96E4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BM96G4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BME4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BMG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BMT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BMTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BMTG4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4060BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
I TEXAS INSTRUMENTS
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
*3 TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’4» KB «P1» ®®¢®®®€>€> .. W 0 '69 (I) Ree‘ Diameter Cavity AU Dtmenston oestgneo to accommodate the component width BO Dtmenslon destgned to accommodate tne component tengtn K0 Dtmenslon destgned to accommodate tne component thickness 7 w Overall mom 0! Ihe carrier tape 1 P1 Pttcn between successive cavtty centers :IZCI: 1 Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O O O O O O SpracketHales ,,,,,,,,,,, ‘ User Dlreclion 0' Feed Pocket Quadrants
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
CD4060BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4060BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4060BPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
{9 TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4060BM96 SOIC D 16 2500 333.2 345.9 28.6
CD4060BNSR SO NS 16 2000 346.0 346.0 33.0
CD4060BPWR TSSOP PW 16 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
-WV Ti— HHHHHHH T O A HHHHHHH, <74» ~/="" 5m?="" ¢="" p="" dim="" ‘v'="" texas="" instruments="">
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
J (R76D1P7TM) CERAVVHC DUAL 1N7L1NE PACKAGE )4 LEADS SHOWN PWS u . W 14 e 18 20 0300 0300 0300 0300 E (7.52) (7.52) (7.62) (7.62) w 5 Est ass ass ass fl fl m m m m m E MAX 0.755 540 0.950 1.060 (19.94) (21.34) (24.35) (25.92) I ..15,,, 1 0 500 0,300 0,310 0.300 U U U U U U U C W (7.52) (7.52) (7.57) (7.52) 0.245 0.245 0.220 0.245 0.005 (1.65) 0 MW 0045 (1.14) (6.22) (6.22) (5.50) (6.22) 0000 ( . ) a «0005(0.13)MN m r ~ 0200 (5.05) MAX 7 ; Seatmg Pmne , 0 (3.30) MN 4 0 020 (0. 66) 0014 (0.36) 0715' 0100 (.)254 0.014 (0.36) 0,000 (0.20) 4040083/F 03/03 VOTES: A. AH Hneur d1mens1ons are 1’1 1mm (muhmeters) a, This druwmg '3 subject m change w'thout nnt'ce. 0, 1m package 15 hermehcoHy sewed mm a cemm 11a usmg q1ass mt. D. 11an pom 1’s prowded on cap fo' 1mm) 1den1111ca0an umy on press cemrmc 9055 m sea) 00W. E FaHs thin ML 513 1035 0011417114. 001141416. GDPPTTB 0'10 001017120
MECHANICAL DATA NS (R-PDSO-G") PLASTIC SMALL—OUTLINE PACKAGE 14-PINS SHOWN HHFHHFH j j t t H H j, A jfi/—\ % lgLLLLLiLLL/fiif A MAX 1060 1060 1290 1530 A MW 990 9,90 1230 14‘70 4040062/0 03/03 VOTES: A. AH Hneur dimenswons are m mHHmetevs a, Tm: druwmg 5 subject to change wmom name. 0 Body dwmenswons do not mamas mom flash 0v pmtmswom not to exceed 0,15 INSTRUMEN'IS www.li.m
MECHANICAL DATA D (M ‘ms 0 G 933‘ ‘LASHC SMALLiobLN¥ \JAEXALL 40mm 5/J 09/39 NO'ES, A AH Hnec' dimensmrs c'e m 'mc'ves ['nflhmeter5> B Th5 drawer ‘5 subje», ,0 change mm: Home, A Body \cngth docs rm mac mod Hoar, p'omswons, cv gmc bms Vo‘c vow warmers, or gm buns sha‘ nm exceed 006 (0 ‘5) pev em @ Body mm does 101 meme Manama fish. nter‘ec: flash W m exceed m7 (0,sz per side. E Rdererce JEDEC MS 012 varm'o" AC, ‘1; ”Dams INSI'RUMENTS www.1i.com
LAND PATTERN D" Examp‘e Boyd ,uyuu: stem Opemrgs (Nate 0) (me D) > 4 > ' A ‘F A +_ V V 3 Now Sumey Musk DeHe Pad ’ ‘ /Su‘dev Musk ope, m X (me E) *Jad seawew ‘ , , (None c) NOTES N \meur dwmenswons are m rmerrete's A 3 TN: dqu ‘5 subject (a cmge mm: mme r ?e(er m \PC7351 m auemm bourc design D Laser mum apc'twcs mm "apczmda ons and 0‘50 rouncmq comers wm cm boner caste rccusc may m \PCJizé thew aoard assemwy sue for New can I:, Custume's shoud comcc: Mew board ‘c deswgn recommencnmons when sHe m su‘der mm \o‘e'ances between urd c'omd swgna‘ pacs Cdstomcrs shame Insmmms www.2i.com
MECHANICAL DATA N (R—PDlP-T“) PLASTIC DUAL—IN—LINE PACKAGE 16 P15 SHOWN PWS " A L . [NM 15 a 20 16 9 0 775 U 777 0 SZU '1 USE 3 , 1H HH HH r% r’H r"—1 r’H H1 1 A VAX “9‘69? (191591 (23,37) (25,92) 0 250 (6,50‘ A MN [1145‘ 0142‘ 0.350 new 3 O 240 (6.10), 15 92/ (1832/ (2 .59) (23,58) MSiUO‘ (A AA AA Ari AA AA AA R1 &. VAR1AT1CN M RR AC AD 1 B 0070( (17s) 0015 (111) A 0045 (1,111 g n > , ‘ -) 3.020 (0,51) MW w o 5 (0 35) 0200( 38) MAX f, ), Gnu E Home 1 1‘ 9 fix—1%)” 1 0125’ 1/111 4% 0010 (v.37 ) NOM 31a) U L»- J 0450 (13,92) MAX L 202‘ (0,53) » e c 015 (0,35) / \ a; 00‘s (0,Zb)® / \ 1 1 \\¥,// 11/18 Pm (My > @ 20 Pm vendor upho'v mom/r 17/7037 NO'FS A AH Mnec' mmensmr‘fi: B 1m: drawmq 1s sume m muss (m1111mevem) 0 change mm): nofice /c\ FuHs wumn JEDEC M57001, except 15 an: 20 p171 'r1111mLm body 1mm (01m A) A The 70 p171 and 15m} shmflder Md” 15 a ve'vdnr 0311071, eher NIH Dr 111 wkflh INSI'RUMENTS www.1i.com
I TEXAS INSTRUMENTS ‘3‘ V.'
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1 Q1Q2 Q2
Q3 Q3Q4 Q4 User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CD4060BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4060BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4060BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4060BM96 SOIC D 16 2500 340.5 336.1 32.0
CD4060BNSR SO NS 16 2000 356.0 356.0 35.0
CD4060BPWR TSSOP PW 16 2000 356.0 356.0 35.0
Pack Materials-Page 2
I TEXAS INSTRUMENTS
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TUBE
L - Tube length
T - Tube
height
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD4060BE N PDIP 16 25 506 13.97 11230 4.32
CD4060BE N PDIP 16 25 506 13.97 11230 4.32
CD4060BEE4 N PDIP 16 25 506 13.97 11230 4.32
CD4060BEE4 N PDIP 16 25 506 13.97 11230 4.32
CD4060BM D SOIC 16 40 507 8 3940 4.32
CD4060BMG4 D SOIC 16 40 507 8 3940 4.32
CD4060BPW PW TSSOP 16 90 530 10.2 3600 3.5
Pack Materials-Page 3
J (R76D1P7TM) CERAVVHC DUAL 1N7L1NE PACKAGE )4 LEADS SHOWN PWS u . W 14 e 18 20 0300 0300 0300 0300 E (7.52) (7.52) (7.62) (7.62) w 5 Est ass ass ass fl fl m m m m m E MAX 0.755 540 0.950 1.060 (19.94) (21.34) (24.35) (25.92) I ..15,,, 1 0 500 0,300 0,310 0.300 U U U U U U U C W (7.52) (7.52) (7.57) (7.52) 0.245 0.245 0.220 0.245 0.005 (1.65) 0 MW 0045 (1.14) (6.22) (6.22) (5.50) (6.22) 0000 ( . ) a «0005(0.13)MN m r ~ 0200 (5.05) MAX 7 ; Seatmg Pmne , 0 (3.30) MN 4 0 020 (0. 66) 0014 (0.36) 0715' 0100 (.)254 0.014 (0.36) 0,000 (0.20) 4040083/F 03/03 VOTES: A. AH Hneur d1mens1ons are 1’1 1mm (muhmeters) a, This druwmg '3 subject m change w'thout nnt'ce. 0, 1m package 15 hermehcoHy sewed mm a cemm 11a usmg q1ass mt. D. 11an pom 1’s prowded on cap fo' 1mm) 1den1111ca0an umy on press cemrmc 9055 m sea) 00W. E FaHs thin ML 513 1035 0011417114. 001141416. GDPPTTB 0'10 001017120
MECHANICAL DATA N (R—PDlP-T“) PLASTIC DUAL—IN—LINE PACKAGE 16 P15 SHOWN PWS " A L . [NM 15 a 20 16 9 0 775 U 777 0 SZU '1 USE 3 , 1H HH HH r% r’H r"—1 r’H H1 1 A VAX “9‘69? (191591 (23,37) (25,92) 0 250 (6,50‘ A MN [1145‘ 0142‘ 0.350 new 3 O 240 (6.10), 15 92/ (1832/ (2 .59) (23,58) MSiUO‘ (A AA AA Ari AA AA AA R1 &. VAR1AT1CN M RR AC AD 1 B 0070( (17s) 0015 (111) A 0045 (1,111 g n > , ‘ -) 3.020 (0,51) MW w o 5 (0 35) 0200( 38) MAX f, ), Gnu E Home 1 1‘ 9 fix—1%)” 1 0125’ 1/111 4% 0010 (v.37 ) NOM 31a) U L»- J 0450 (13,92) MAX L 202‘ (0,53) » e c 015 (0,35) / \ a; 00‘s (0,Zb)® / \ 1 1 \\¥,// 11/18 Pm (My > @ 20 Pm vendor upho'v mom/r 17/7037 NO'FS A AH Mnec' mmensmr‘fi: B 1m: drawmq 1s sume m muss (m1111mevem) 0 change mm): nofice /c\ FuHs wumn JEDEC M57001, except 15 an: 20 p171 'r1111mLm body 1mm (01m A) A The 70 p171 and 15m} shmflder Md” 15 a ve'vdnr 0311071, eher NIH Dr 111 wkflh INSI'RUMENTS www.1i.com
www.ti.com
PACKAGE OUTLINE
C
8.2
7.4 TYP
14X 1.27
16X 0.51
0.35
2X
8.89
0.15 TYP
0 - 10
0.3
0.1
2.00 MAX
(1.25)
0.25
GAGE PLANE
1.05
0.55
A
10.4
10.0
NOTE 3
B5.4
5.2
NOTE 4
4220735/A 12/2021
SOP - 2.00 mm max heightNS0016A
SOP
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
116
0.25 C A B
9
8
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.500
£353 RE Vi“““‘ ““““““ WEECE = Era ,MQL 1"
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
14X (1.27)
(R0.05) TYP
(7)
16X (1.85)
16X (0.6)
4220735/A 12/2021
SOP - 2.00 mm max heightNS0016A
SOP
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
OPENING
SOLDER MASK METAL
SOLDER MASK
DEFINED
LAND PATTERN EXAMPLE
SCALE:7X
SYMM
1
89
16
SEE
DETAILS
SYMM
Efimfifij v¢\‘\‘\‘\
www.ti.com
EXAMPLE STENCIL DESIGN
(7)
(R0.05) TYP
16X (1.85)
16X (0.6)
14X (1.27)
4220735/A 12/2021
SOP - 2.00 mm max heightNS0016A
SOP
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:7X
SYMM
SYMM
1
89
16
MECHANICAL DATA D ( *"ifi O G if” )LASHC SMALL 0U ¥N¥ 4040047 S/M 06/1‘ NO'ES, A AH Hnec' dimensmrs c'e m 'mc'ves ['nflhmeter5> B Th5 drawer ‘5 subje», ,0 change mm: Home, A Body \cngth docs rm mac mod Hoar, p'omswons, (xv gmc bms Mom mm warmers, or gm buns sha‘ nm exceed 3005 (015) eam swce @ Body mm does 101 meme 11mm fish. E Rdererce JEDEC MS 012 mam Ac, nter‘ec: flash sfu‘ not exceed 0017 (043) each swde {if TEXAS INSTRUMENTS www.1i.com
LAND PATTERN DATA D (RiPDSOiGiB) PLASTiC SMALL OUTLINE stencil Openings Example Pod Geometry (See Note c) Non Soidermosk Detirled Pad alir 4x1, 27 i 16X0'55ai ‘+l4xi 27 mwannnaia— i6x}v5°--4Er~Eifl{iEr-Hfl-T @E-HnH-a-a— {downgrade r, Example Snider Mask 0 erlin l /l/ i a i 0 07 It (See Note E) All Around ,' 421i233e4/E oa/iz AH linear dimensions are in millimeters This drawing is subject ta anange without notice. Publication che7351 is recommended tar alternate designs. Laser cutting apertures with trapezoidal wail: and also rounding corners will otter better paste release contact tneir board assembly site ror stencil design recommendations, Rerer to ch—7525 tor otner stencil recommendations Customers shouid contact their board lubrication site tor solder musk toierances between and around Signal pods NOTES: Customers should POE”? r" {I} Tums INSTRUMENTS www.li.com
www.ti.com
PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X 0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
B
NOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
89
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
v¢\‘\‘\‘\+““‘ gimm—LE—urmm M i
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
89
16
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
YL““‘+““‘ fimmamfl J
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
89
16
MECHANICAL DATA NS (R-PDSO-G") PLASTIC SMALL—OUTLINE PACKAGE 14-PINS SHOWN HHFHHFH j j t t H H j, A jfi/—\ % lgLLLLLiLLL/fiif A MAX 1060 1060 1290 1530 A MW 990 9,90 1230 14‘70 4040062/0 03/03 VOTES: A. AH Hneur dimenswons are m mHHmetevs a, Tm: druwmg 5 subject to change wmom name. 0 Body dwmenswons do not mamas mom flash 0v pmtmswom not to exceed 0,15 INSTRUMEN'IS www.li.m
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated