Littelfuse Inc. 的 MCR716, 718 规格书

© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Small Size
Passivated Die for Reliability and Uniformity
Low Level Triggering and Holding Characteristics
Epoxy Meets UL 94 V−0 @ 0.125 in
ESD Ratings: Human Body Model, 3B > 8000 V
Machine Model, C > 400 V
Pb−Free Packages are Available
Features
Designed for high volume, low cost, industrial and
consumer applications such as motor control; process
control; temperature, light and speed control.
Description
MCR716, MCR718
Functional Diagram
K
G
A
Pb
Additional Information
Samples
Resources
Datasheet
Pin Out
12
3
4
1
23
4
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Rating Symbol Value Unit
Peak Repetitive Off−State Voltage (Note 1)
(TJ =− 40 to 125°C, Sine Wave, 50 to 60 Hz, Gate Open)
MCR716
MCR718
VDRM,
VRRM 400
600
V
On-State RMS Current (All Conduction Angles; TC = 90°C) IT (RMS) 4.0 A
Average On−State Current (180° Conduction Angles; TC = 90°C) IT(AV) 2.6 A
Peak Non-Repetitive Surge Current
(1/2 Cycle, Sine Wave 60 Hz, TJ = 110°C) ITSM 25 A
Circuit Fusing Consideration (t = 8.3 ms) I2t 2.6 A²sec
Forward Peak Gate Power (Pulse Width ≤ 10. µsec,TC = 90°C) PGM 0.5 W
Forward Average Gate Power (t = 8.3 msec, TC = 90°C) PGM (AV) 0.1 W
Forward Peak Gate Current (Pulse Width 1.0 µsec, TC= 90°C) IGM 0.2 A
Operating Junction Temperature Range TJ-40 to +110 °C
Storage Temperature Range Tstg -40 to +150 °C
Maximum Ratings (TJ = 25°C unless otherwise noted)
Thermal Characteristics
Rating Symbol Value Unit
Thermal Resistance, Junction−to−Case R8JC 3.0 °C/W
Thermal Resistance, Junction−to−Ambient (Note 2) R8JA 80
Maximum Lead Temperature for Soldering Purposes 1/8" from Case for
10 Seconds TL260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is
not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. V DRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent
with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Electrical Characteristics - OFF (TJ = 25°C unless otherwise noted)
Electrical Characteristics - ON (TJ = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Peak Repetitive Forward or Reverse Blocking Current
(Note 3) (VAK = Rated VDRM or VRRM, RGK = 1.0 kΩ
TJ = 25°C IDRM,
IRRM
- - 10
µA
TJ = 110°C - - 200
Dynamic Characteristics
Characteristic Symbol Min Typ Max Unit
Critical Rate of Rise of Off−State Voltage
(VD = 0.67 X Rated VDRM, Exponential Waveform, RGK = 1.0 kQ, TJ = 110°C) dv/dt 5.0 10 − V/µs
Critical Rate of Rise of On−State Current
(IPK = 50 A, Pw = 40 sec, diG/dt = 1 A/sec, Igt = 50 mA di/dt − 100 Aµs
Characteristic Symbol Min Typ Max Unit
Peak Reverse Gate Blocking Voltage (IGR = 10 µA) VGRM 10 12.5 18 V
Peak Reverse Gate Blocking Current (VGR = 10 V) IRGM 1. 2 µA
Peak Forward On−State Voltage (Note 4)
(ITM = 5.0 A Peak)
VTM
1. 3 1. 5
V
(ITM = 8.2 A Peak) 1. 5 2.2
Gate Trigger Current (Continuous dc) (Note 5)
(VAK = 12 Vdc, RL = 30 Ω)
(TJ = 25°C)
IGT
1. 0 25 75
µA
(TJ = −40°C) _ _ 300
Gate Trigger Voltage (Continuous dc)
(VD = 12 VDC, RL = 30 Ω) (Note 5)
( TJ = 25°C)
VGT
0.3 0.55 0.8
V(TJ = −40°C) 1. 0
(TJ = 110°C) 0.2
Holding Current
(VD = 12 V, Initiating Current = 200 mA, RGK = 1 kΩ)
( TJ = 25°C) IH
0.4 1. 0 5.0
mA
(TJ = −40°C) 10
Latching Current
(VD = 12 VDC, IG = 2.0 mA,TC = 25°C)
(VD = 12 VDC, IG = 2.0 mA,TC = -40°C)
IL 5.0
mA
10
Total Turn−On Time
(Source Voltage = 12 V, RS = 6.0 kΩ, IT = 8 A(pk), RGK = 1.0 kΩ)
(VD = Rated VDRM, Rise Time = 20 ns, Pulse Width = 10 µs)
tgt _ 2.0 5.0 µs
2. Case 369C, when surface mounted on minimum recommended pad size.
3. Ratings apply for negative gate voltage or RGK = 1.0 kQ. Devices shall not have a positive gate voltage concurrently with a negative voltage on the anode. Devices
should not be tested with a constant current source for forward and reverse blocking capability such that the voltage applied exceeds the rated blocking voltage.
4. Pulse Test; Pulse Width ≤ 2.0 msec, Duty Cycle ≤ 2%.
5. RGK current not included in measurements.
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Voltage Current Characteristic of SCR
Symbol Parameter
VDRM Peak Repetitive Forward Off State Voltage
IDRM Peak Forward Blocking Current
VRRM Peak Repetitive Reverse Off State Voltage
IRRM Peak Reverse Blocking Current
VTM Maximum On State Voltage
IHHolding Current
+C urrent
+V oltage
VTM
IDRM at VDRM
IH
Anode +
on state
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode
Forward Blocking Region
IRRM at VRRM
(off state)
Figure 1. RMS Current Derating Figure 2. On−State Power Dissipation
Figure 3. On−State Characteristics Figure 4. Transient Thermal Response
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
-20 40-40
TJ, JUNCTION TEMPERATURE (°C)
35
30
25
20
15
0
, GATE TRIGGER CURRENT ( A)IGT
20 10060 80 110
110-40
TJ, JUNCTION TEMPERATURE (°C)
2.0
1.5
IH, HOLDING CURRENT (mA)
0.5
0
20-200 40
1.0
60 80 100
Figure 5. Typical Gate Trigger Current vs Junction Temperature
Figure 7. Typical Holding Current vs Junction Temperature
Figure 6. Typical Gate Trigger Voltage vs Junction Temperature
Figure 8. Typical Latching Current vs Junction Temperature
TJ, JUNCTION TEMPERATURE (°C)
1.0
0
0.5
VGT, GATE TRIGGER VOLTAGE (VOLTS)
-20 40-40 02 0 10060 80 110
I, LATCHING CURRENT (mA)
L
110-40
TJ, JUNCTION TEMPERATURE (°C)
2.0
1.5
0.5
0
20-200 40
1.0
60 80 100
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Dimensions Soldering Footprint
Part Marking System
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
Dim
Inches Millimeters
Min Max Min Max
A 0.235 0.245 5.97 6.22
B 0.250 0.265 6.35 6.73
C 0.086 0.094 2.19 2.38
D 0.027 0.035 0.69 0.88
E 0.018 0.023 0.46 0.58
F 0.037 0.045 0.94 1. 14
G 0.180 BSC 4.58 BSC
H0.034 0.040 0.87 1.01
J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
L0.090 BSC 2.29 BSC
R 0.180 0.215 4.57 5.45
S 0.025 0.040 0.63 1. 01
U 0.020 −−− 0.51 −−−
V 0.035 0.050 0.89 1.27
Z 0.155 −−− 3.93 −−−
Pin Assignment
1 Cathode
2 Anode
3 Gate
4 Anode
Ordering Information
Device Package Shipping
MCR716T4 DPAK
2500 /
Tape & Reel
MCR716T4G DPAK
(Pb−Free)
MCR718T4 DPAK
MCR718T4G DPAK
(Pb−Free)
D
A
K
B
R
V
S
F
L
G
2 PL
M
0.13 (0.005)T
E
C
U
J
H
SEATING
PLANE
Z
12 3
45.80
0.228
2.58
0.101
1.6
0.063
6.20
0.244
3.0
0.118
6.172
0.243
mm
inches
SCALE 3:1
DPAK
CASE 369C
STYLE 4
12
3
4
Y= Y ear
WW = Work Week
MCR71x = Device Code
x= 6 or 8
G= Pb Free Package
YWW
MCR
71xG
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete
Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics