EPCOS - TDK Electronics 的 B58031 (LP) CeraLink™ Series 规格书

@TDK
CeraLink®
Capacitors for fast-switching semiconductors
Series/Type: Low profile (LP) series
Ordering code: B58031*
Date: 2019-01-07
Version: 6.1
TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without TDK Electronics' prior express consent is prohibited.
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Identification/Classification 1
(header 1 + top left bar):
CeraLink®
Identification/Classification 2
(header 2 + bottom left header bar):
Capacitors for fast-switching semiconductors
Ordering code: (top right header bar)
B58031*
Series/Type: (bottom right header bar)
Low profile (LP) series
Preliminary data (optional):
Department:
PPD PI AE/IE
Date:
2019-01-07
Version:
6.1
Prepared by:
Markus Hopfer
Signed by :
Modifications:
Markus Hopfer, Harald Kastl, Thomas Pirhofer
™ changed to ®, EPCOS to TDK; IEC 60068-2-58 added p. 17
TDK tan 5
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 2 of 2
Important notes at the end of this document.
Applications
Power converters and inverters
DC link/snubber capacitor for power converters and inverters
Features
High ripple current capability
High temperature robustness
Low equivalent serial inductance (ESL)
Low equivalent serial resistance (ESR)
Low power loss
Low dielectric absorption
Optimized for high frequencies up to several MHz
Increasing capacitance with DC bias up to operating voltage
High capacitance density
Minimized dielectric loss at high temperatures
Qualification based on AEC-Q200 rev. D
Suitable for reflow soldering only
Construction
RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate)
Copper inner electrodes
Silver outer electrodes
Silver coated copper-invar lead frame
General technical data
Dissipation factor
tan 𝛿
< 0.02
Insulation resistance
Rins, typ1)
> 1
GΩ
Operating device temperature
Tdevice
-40 … +150
°C
Weight of device
approx.. 1.3
g
1) Typical insulation resistance, measured at operating voltage Vop and measurement time > 240s, 25 °C
@TDK
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 3 of 3
Important notes at the end of this document.
Electrical specifications and ordering codes
Lead
type
Vpk, max
V
VR
V
Vop
V
Cnom, typ
µF
Ceff, typ
µF
C0
µF
Ordering code
L-style
650
500
400
1
0.6
0.35 ±20%
B58031I5105M062
J-style
650
500
400
1
0.6
0.35 ±20%
B58031U5105M062
L-style
1000
700
600
0.5
0.25
0.14 ±20%
B58031I7504M062
J-style
1000
700
600
0.5
0.25
0.14 ±20%
B58031U7504M062
L-style
1300
900
800
0.25
0.13
0.07 ±20%
B58031I9254M062
J-style
1300
900
800
0.25
0.13
0.07 ±20%
B58031U9254M062
Typical values as a design reference for CeraLink applications
Rated voltage
VR
V
ESR
0 VDC,
0.5 VRMS,
25 °C, 1 kHz
ESR
0 VDC,
0.5 VRMS,
25 °C, 1 MHz
ESL
Iop 1)
100 kHz
Tamb = 85 °C
Iop 1)
100 kHz
Tamb = 105
°C
Ω
mΩ
nH
ARMS
ARMS
500
3
12
3
11
10
700
6
24
3
7
6
900
14
45
3
5
5
1) Normal operating current without forced cooling at Tdevice = 150 °C. Higher values permissible at reduced lifetime.
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CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 4 of 4
Important notes at the end of this document.
Dimensional drawings
L-style
Recommended solder pads
Dimensions in mm
J-style
@TDK
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 5 of 5
Important notes at the end of this document.
L-style
J-style
Manufacturer’s logo
CeraLink type
X.XX = Nominal capacitance (1, 0.5, 0.25)
YYY = Rated voltage (500, 700, 900)
Note that polarity is only for incoming inspection purposes and it does not affect operation. If put under reverse
rated voltage VR, CeraLink is repoled and works identically.
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 6 of 6
Important notes at the end of this document.
Typical characteristics as a function of temperature and voltage VR = 500 V
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff,typ and tan δ which are given on page 2 and 3 of this data sheet.
5004003002001000
120
110
100
90
80
70
60
50
Voltage [VDC]
Capacitance [%]
-25
25
85
125
T [°C ]
1501251007550250-25-50
120
110
100
90
80
70
60
50
40
Temperature [°C]
Capacitance [%]
0
400
500
[VDC ]
Bias
5004003002001000
600
500
400
300
200
100
0
Voltage [VDC]
Dissipation factor [%]
-25
25
85
125
T [°C ]
1501251007550250-25-50
600
500
400
300
200
100
0
Temperature [°C]
Dissipation factor [%]
0
400
500
[VDC ]
Bias
5004003002001000
500
400
300
200
100
0
Voltage [VDC]
ESR [%]
-25
25
85
125
T [°C ]
1501251007550250-25-50
600
500
400
300
200
100
0
Temperature [°C]
ESR [%]
0
400
500
[VDC ]
Bias
@TDK —c—c>
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 7 of 7
Important notes at the end of this document.
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage VR = 500 V
5004003002001000
225
200
175
150
125
100
75
50
Voltage [VDC]
Capacitance [%]
large signal
small signal
Variable
Large signal capacitance:
Quasistatic (slow variation of the voltage), 25 °C
The nominal capacitance is defined as the large signal
capacitance at Vop.
See glossary for further information.
Small signal capacitance:
0.5 VRMS, 1 kHz, 25 °C
The effective capacitance is defined as the small signal
capacitance at Vop.
Typical impedance and ESR as a function of frequency VR = 500 V
10M1M100k10k1k
1000
100
10
1
0,1
0,01
0,001
Frequency [Hz]
|Z|, ESR [Ohm]
Z [Ohm]
ESR [Ohm]
Variable
VDC = 0 V, VAC = 0.5 VRMS, Tdevice = 25 °C
Typical permissible current as a function of frequency VR = 500 V
100806040200
11
10
9
8
7
6
5
4
3
2
Frequency [kHz]
Normal Operation Current [A rms]
85 °C
105 °C
Tamb
Measurement performed at Vop.
The values correspond to a device temperature
of 150 °C.
No forced cooling was used.
Note hat with additional cooling the typical permissible
current can be significantly higher.
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time.
The typical aging rate is about 2.5% per logarithmic decade in hours.
@TDK
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 8 of 8
Important notes at the end of this document.
Typical characteristics as a function of temperature and voltage VR = 700 V
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff, typ and tan δ which are given on page 2 and 3 of this data sheet.
7006005004003002001000
130
120
110
100
90
80
70
60
50
40
Voltage [VDC]
Capacitance [%]
-25
25
75
125
T/°C
150100500-50
140
120
100
80
60
40
20
Temperature [°C]
Capacitance [%]
0
600
700
[VDC ]
Bias
7006005004003002001000
600
500
400
300
200
100
0
Voltage [VDC]
Dissipation factor [%]
-25
25
75
125
T/°C
150100500-50
600
500
400
300
200
100
0
Temperature [°C]
Dissipation factor [%]
0
600
700
[VDC ]
Bias
7006005004003002001000
500
400
300
200
100
0
Voltage [VDC]
ESR [%]
-25
25
75
125
T/°C
150100500-50
600
500
400
300
200
100
0
Temperature [°C]
ESR [%]
0
600
700
[VDC ]
Bias
@TDK —c—c>
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 9 of 9
Important notes at the end of this document.
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage VR = 700 V
7006005004003002001000
200
175
150
125
100
75
50
Voltage [VDC]
Capacitance [%]
large signal * V
small signal * Bias [V]
Variable
Large signal capacitance:
Quasistatic (slow variation of the voltage), 25 °C
The nominal capacitance is defined as the large signal
capacitance at Vop.
See glossary for further information.
Small signal capacitance:
0.5 VRMS, 1 kHz, 25 °C
The effective capacitance is defined as the small signal
capacitance at Vop.
Typical impedance and ESR as a function of frequency VR = 700 V
10M1M100k10k1k
1000
100
10
1
0,1
0,01
0,001
Frequency [Hz]
|Z|, ESR [Ohm]
Z [Ohm]
ESR [Ohm]
Variable
VDC = 0 V, VAC = 0.5 VRMS, Tdevice = 25 °C
Typical permissible current as a function of frequency VR = 700 V
100806040200
7
6
5
4
3
2
1
Frequency [kHz]
Normal Operation Current [A rms]
85 °C
105 °C
Tamb
Measurement performed at Vop.
The values correspond to a device temperature
of 150 °C.
No forced cooling was used.
Note that with additional cooling the typical permissible
current can be significantly higher.
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time.
The typical aging rate is about 2.5% per logarithmic decade in hours.
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 10 of 10
Important notes at the end of this document.
Typical characteristics as a function of temperature and voltage VR = 900 V
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff, typ and tan δ which are given on page 2 and 3 of this data sheet.
9008007006005004003002001000
140
120
100
80
60
40
Voltage [VDC]
Capacitance [%]
-25
25
75
125
T/°C
150100500-50
130
120
110
100
90
80
70
60
50
40
Temperature [°C]
Capacitance [%]
0
800
900
Bias [V]
9008007006005004003002001000
700
600
500
400
300
200
100
0
Voltage [VDC]
Dissipation Factor [%]
-25
25
75
125
T/°C
150100500-50
700
600
500
400
300
200
100
0
Temperature [°C]
Dissipation Factor [%]
0
800
900
Bias [V]
9008007006005004003002001000
500
400
300
200
100
0
Voltage [VDC]
ESR [%]
-25
25
75
125
T/°C
150100500-50
600
500
400
300
200
100
0
Temperature [°C]
ESR [%]
0
800
900
Bias [V]
@TDK
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 11 of 11
Important notes at the end of this document.
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage VR = 900 V
9008007006005004003002001000
200
175
150
125
100
75
50
Voltage [VDC]
Capacitance [%]
large signal
small signal
Variable
Large signal capacitance:
Quasistatic (slow variation of the voltage), 25 °C
The nominal capacitance is defined as the large
signal capacitance at Vop.
See glossary for further information.
Small signal capacitance:
0.5 VRMS, 1 kHz, 25 °C
The effective capacitance is defined as the small
signal capacitance at Vop.
Typical impedance and ESR as a function of frequency VR = 900 V
10M1M100k10k1k
10000
1000
100
10
1
0,1
0,01
Frequency [Hz]
|Z|, ESR [Ohm]
Z [Ohm]
ESR [Ohm]
Variable
VDC = 0 V, VAC = 0.5 VRMS, Tdevice = 25 °C
Typical permissible current as a function of frequency VR = 900 V
100806040200
5
4
3
2
1
Frequency [kHz]
Normal Operation Current [Arms]
85 °C
105 °C
Tamb
Measurement performed at Vop.
The values correspond to a device temperature
of 150 °C.
No forced cooling was used.
Note that with additional cooling the typical
permissible current can be significantly higher.
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time. The typical aging
rate is about 2.5% per logarithmic decade in hours.
@TDK Fusmng tom Cavadw Roam:
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 12 of 12
Important notes at the end of this document.
Reliability
A. Preconditioning:
Reflow solder the capacitor on a PCB using the recommended soldering profile
Check of external appearance
Measurement of electrical parameters Rins, C0, tan δ
o Apply Vpk,max for 7 seconds and measure Rins at room temperature:
Isolation resistance (@ Vpk,max, 7 s, 25 °C) Rins > 100 MΩ
o Measure C0 and tan δ within 10 minutes to 1 hour afterwards:
Initial capacitance (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C)
Dissipation factor (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C)
B. Performance of a specific reliability test.
C. After performing a specific test:
Check the external appearance again
Repeat the measurement of the electrical parameters
o Apply Vpk,max for 7 seconds and measure Rins at room temperature:
Isolation resistance (@ Vpk,max, 7 s, 25 °C) Rins > 10 MΩ
o Measure C and tan δ:
Change of initial capacitance (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C) | Δ C / C0 | < 15%
o Dissipation factor (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C) tan δ < 0.05
Test
Standard
Test conditions
Criteria
External
appearance
Visual inspection with magnifying glass
No defects that might affect
performance
High
temperature
operating life
MIL-STD-202,
method 108
150 °C, VR, 1000 hours
No mechanical damage
| Δ C / C0 |, tan δ and Rins
within defined limits
Biased
humidity
MIL-STD-202,
method 103
85 °C, 85% rel. hum., VR, 1000 hours
No mechanical damage
| Δ C / C0 |, tan δ and Rins
within defined limits
Temperature
shock
IEC 60384-9,
4.8
-55 °C to +150 °C
20 seconds transfer time
15 minutes dwell time
1000 cycles
No mechanical damage
| Δ C / C0 |, tan δ and Rins
within defined limits
Terminal
strength test
AEC-Q200-005
Apply a force of 17.7 N for 60 seconds
No detaching of termination.
No rupture of ceramic
| Δ C / C0 |, tan δ and Rins
within defined limits
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CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 13 of 13
Important notes at the end of this document.
Test
Standard
Test conditions
Criteria
Tensile
strength test
(unsoldered)
Apply a force of 10 N in the shown direction.
Ceramic body is clamped :
No detaching of termination.
No rupture of ceramic
| Δ C / C0 |, tan δ and Rins
within defined limits
Board flex
AEC-Q200-005
Bending of 2 mm for 60 seconds
Dimensions in mm
No mechanical damage
| Δ C / C0 |, tan δ and Rins
within defined limits
Vibration
MIL-STD-202,
method 204
5 g/ 20 min, 12 cycles, 3 axis
10 Hz to 2000 Hz
No mechanical damage
| Δ C / C0 |, tan δ and Rins
within defined limits
Mechanical
shock
MIL-STD-202,
method 213
Acceleration 400 m/s²
Half sine pulse duration 6 milliseconds
4000 bumps
No mechanical damage
| Δ C / C0 |, tan δ and Rins
within defined limits
Reflow test
3 times recommended reflow soldering
profile
No mechanical damage
Proper solder coating of
contact areas
| Δ C / C0 |, tan δ and Rins
within defined limits
Leaching test
(lead frame
only)
MIL-STD-202,
method 210,
condition B
Dip test of contact areas in solder bath
(260 °C for 10 seconds)
No damage of lead frame
silver coating
Solderability
(lead frame
only)
J-STD-002,
method A @
235 °C,
category 3
Dip test of contact areas in solder bath
(235 °C for 5 ± 0.5 seconds)
> 95% wettability of lead frame
Resistance to
solvent
Dipping and cleaning with isopropanol
Marking must be legible
| Δ C / C0 |, tan δ and Rins
within defined limits
Geometry
Using a caliper
Within specified tolerance in
the chapter construction
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CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 14 of 14
Important notes at the end of this document.
Packaging
The CeraLink LP types will be delivered in a blister tape (taping to IEC 60286-3).
Blister tape for L-style terminal
Blister tape for J-style terminal
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CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 15 of 15
Important notes at the end of this document.
Part orientation for L-style terminal
Part orientation for J-style terminal
Taping information
Trailer: There is a minimum of 160 mm of carrier tape with empty compartments and sealed by the cover tape.
Leader: There is a minimum of 400 mm of cover tape, which includes at least 100 mm of carrier tape with empty
compartments.
Dimensions in mm
Fixing peeling strength (top tape)
The peeling strength is 0.1 … 1.3 N.
@TDK I ' (Uril:nIn)
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 16 of 16
Important notes at the end of this document.
Reel packing
Dimensions in mm
L-style terminal
J-style terminal
A
330 ±2
330 ±2
B
100 ±1
62 ±1
C
13 +0.5/ -0.2
12.8 +0.7
D
20.2 min.
19.1 min.
E
2.2 ±0.2
1.6 ±0.5
W
24.2 +2
16.4 +2
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CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 17 of 17
Important notes at the end of this document.
Recommended reflow soldering profile
Profile feature
SAC, Sn95.5Ag3.8Cu0.7 @ N2 atmosphere
Preheat and soak
- Temperature min
- Temperature max
- Time
Tsmin
Tsmax
tsmin to tsmax
150 °C
200 °C
60 … 120 seconds
Average ramp-up rate
TL to Tp
3 °C/ second max.
Liquidus temperature
Time at liquidus temperature
TL
tL
217 °C
60 … 150 seconds
Peak package body temperature
Tp1)
245 °C … 260 °C max.2)
Time (tp)3) within 5 °C of specified
classification temperature (Tc)
30 seconds3)
Average ramp-down rate
Tp to TL
6 °C/ second max.
Time 25 °C to peak temperature
maximum 8 minutes
1) Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness (cf. JEDEC J-STD-020D).
3) Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Notes:
All temperatures refer to topside of the package, measured on the package body surface.
Max. number of reflow cycles: 3
After the soldering process, the capacitance is lowered. Applying VR to the device will re-establish the capacitance.
The proposed soldering profile is based on IEC 60068-2-58 (respectively JEDEC J-STD-020D) recommendations.
@TDK
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 18 of 18
Important notes at the end of this document.
General technical information
Storage
Only store CeraLink capacitors in their original packaging. Do not open the package prior to
processing.
Storage conditions in original packaging: temperature −25 °C to +45 °C, relative humidity ≤ 75%
annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CeraLink capacitors where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CeraLink may stick together, causing problems during
mounting.
Avoid contamination of the CeraLink surface during storage, handling and processing.
Avoid storing CeraLink devices in harmful environments where they are exposed to corrosive
gases (e.g. SOx, Cl).
Use CeraLink as soon as possible after opening factory seals such as polyvinyl-sealed packages.
Solder CeraLink components within 6 months after shipment.
Handling
Do not drop CeraLink components or allow them to be chipped.
Do not touch CeraLink with your bare hands - gloves are recommended.
Avoid contamination of the CeraLink surface during handling.
The CeraLink LP series was tested to withstand the board flex test defined in the AEC-Q200 rev.
D, method 005.
The CeraLink LP series uses copper-invar lead frames to prevent mechanical stress to the
ceramic. Too much bending causes open mode. Avoid high mechanical stress like twisting after
soldering on a PCB.
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CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 19 of 19
Important notes at the end of this document.
Mounting
Do not subject CeraLink devices to mechanical stress when encapsulating them with sealing
material or overmolding with plastic material. Encapsulation may lead to worse heat dissipation
too. Please ask for further information.
Do not scratch the electrodes before, during or after the mounting process.
Make sure contacts and housings used for assembly with CeraLink components are clean before
mounting.
The surface temperature of an operating CeraLink can be higher than the ambient temperature.
Ensure that adjacent components are placed at a sufficient distance from a CeraLink to allow
proper cooling.
Avoid contamination of the CeraLink surface during processing.
Soldering
The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
Complete removal of flux is recommended to avoid surface contamination that can result in an
insable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Excessive usage of solder paste can reduce the mechanical robustness of the device, whereas
insufficient solder may cause the CeraLink to detach from the PCB. Use an adequate amount of
solder paste, but on the landing pads only.
If an unsuitable cleaning fluid is used, flux residue or foreign particles may stick to the CeraLink
surface and deteriorate its insulation resistance. Insufficient or improper cleaning of the CeraLink
may cause damage to the component.
o Excessive washing like ultrasonic cleaning, can affect the connection between the ceramic
chip and the outer electrode. To avoid this, we give the following recommendation: Power:
20 W/l max.
o Frequency: 40 kHz max.
o Washing time: 5 minutes max.
@TDK Vop
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 20 of 20
Important notes at the end of this document.
Glossary
Initial capacitance C0: Is the value at the origin of the hysteresis without any applied direct
voltage.
Effective capacitance Ceff: Occurs at Vop and is measured with an applied ripple voltage of
0.5 VRMS and 1 kHz. The CeraLink is designed to have its highest
capacitance value at the operating voltage Vop.
Nominal capacitance Cnom: Is the value derived by the tangent of the mean hysteresis as the
derivative of the mean hysteresis is dQ/dV ~ C.
@TDK
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 21 of 21
Important notes at the end of this document.
Symbols and terms
AC Alternating current
C0 Initial capacitance @ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C
Ceff,typ Typical effective capacitance @ Vop, 0.5 VRMS, 1 kHz, 25 °C
Cnom,typ Typical nominal capacitance @ Vop, quasistatic, 25 °C. See glossary on
previous page for definition of the nominal capacitance
DC Direct current
ESL Equivalent serial inductance
ESR Equivalent serial resistance
Iop Operating ripple current, root mean square value of sinusoidal AC current
LP Low profile
PCB Printed circuit board
PLZT Lead lanthanum zirconium titanate
Rins Insulation resistance @ Vpk, measurement time t = 7 s, 25 °C
Rins, typ Insulation resistance @ Vop, measurement time t > 240 s, 25 °C
SAC Tin silver copper alloy; lead-free solder paste
Tamb Ambient temperature
tan δ Dissipation factor @ 0 Vdc, 0.5 Vrms 1 kHz, 25°C
Tdevice Device temperature. Tdevice = Tamb + ΔT (ΔT defines the self-heating of the device
due to applied current).
Vop Operating voltage
VR Rated voltage
VRMS Root mean square value of sinusoidal AC voltage
Vpk,max Maximum peak operating voltage
ΔT Increase of temperature during operation
@TDK
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 22 of 22
Important notes at the end of this document.
Cautions and warnings
General
Not for use in resonant circuits, where a voltage of alternating polarity occurs.
Not for AC applications. Consult our local representative for further details.
If used in snubber circuits, ensure that the sum of all voltages remains at the same polarity.
Some parts of this publication contain statements about the suitability of our CeraLink components for
certain areas of application, including recommendations about incorporation/design-in of these
products into customer applications. The statements are based on our knowledge of typical
requirements often made of our CeraLink devices in the particular areas. We nevertheless expressly
point out that such statements cannot be regarded as binding statements about the suitability of our
CeraLink components for a particular customer application. As a rule, TDK is either unfamiliar with
individual customer applications or less familiar with them than the customers themselves. For these
reasons, it is always incumbent on the customer to check and decide whether the CeraLink devices
with the properties described in the product specification are suitable for use in a particular customer
application.
Do not use CeraLink components for purposes not identified in our specifications.
Ensure the suitability of a CeraLink in particular by testing it for reliability during design-in.
Always evaluate a CeraLink™ component under worst-case conditions.
Pay special attention to the reliability of CeraLink devices intended for use in safety-critical
applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes
Consider derating at higher operating temperatures. As a rule, lower temperatures and voltages
increase the life time of CeraLink devices.
If steep surge current edges are to be expected, make sure your design is as low-inductive as
possible.
In some cases the malfunctioning of passive electronic components or failure before the end of
their service life cannot be completely ruled out in the current state of the art, even if they are
operated as specified. In applications requiring a very high level of operational safety and
especially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line
applications such as clamp 30), ensure by suitable design of the application or other measures
(e.g. installation of protective circuitry, fuse or redundancy) that no injury or damage is sustained
by third parties in the event of such a malfunction or failure.
Specified values only apply to CeraLink components that have not been subject to prior electrical,
mechanical or thermal damage. The use of CeraLink devices in line-to-ground applications is
therefore not advisable, and it is only allowed together with safety countermeasures such as
thermal fuses.
@TDK
CeraLink® B58031*
Capacitors for fast-switching semiconductors Low profile (LP) series
PPD PI AE/IE 2019-01-07
Please read Cautions and warnings and Page 23 of 23
Important notes at the end of this document.
Operation
Use CeraLink only within the specified operating temperature range.
Use CeraLink only within specified voltage and current ranges.
The CeraLink has to be operated in a dry atmosphere, which must not contain any additional
chemical vapors or substances.
Environmental conditions must not harm the CeraLink. Use the capacitors under normal
atmospheric conditions only. A reduction of the oxygen partial pressure to below 1 mbar is not
permissible.
Prevent a CeraLink from contacting liquids and solvents.
Avoid dewing and condensation.
During operation, the CeraLink can produce audible noise due to its piezoelectric characteristic.
CeraLink components are mainly designed for encased applications. Under all circumstances
avoid exposure to:
o direct sunlight
o rain or condensation
o steam, saline spray
o corrosive gases
o atmosphere with reduced oxygen content
This listing does not claim to be complete, but merely reflects the experience of TDK.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data books,
other publications, on the company website, or in order-related documents such as shipping notes, order
confirmations and product labels. The varying representations of the ordering codes are due to
different processes employed and do not affect the specifications of the respective products.
Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
@TDK
Important notes
Page 24 of 24
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule we are either unfamiliar with individual customer applications or less familiar with them than
the customers themselves. For these reasons, it is always ultimately incumbent on the customer
to check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and
customer specific requirements (“CSR”) TDK always has and will continue to have the policy of
respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of
unilateral requirements, we hereby like to emphasize that only requirements mutually agreed
upon can and will be implemented in our Quality Management System. For clarification
purposes we like to point out that obligations from IATF 16949 shall only become legally binding if
individually agreed upon.
@TDK
Important notes
Page 25 of 25
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar,
SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10