Laird Thermal Systems, Inc. 的 66195-505 规格书

This broad prod high-performance an TEMs is availabl us heat pumping ca shapes, and inp es. Assembled w Te||uride semic rial and thermall Aluminum Oxi P Series is des current and la pplications. FEATURES APPLICATIONS SPECIFICATIONS TECHNICAL Hot Side Temperature ( C) 25'C SO'C Qmax (Watts) 18.1 20.0 Delta Tmax ('C] 67 75 Imax (Amps) 2.1 2.1 Vmax (Volts) 14.4 16.4 Module Resistance (Ohms) 6.31 7.12 L 0.5430010" 0.0015"/o.oo15" Lapped Lapped L1 0.5430010" 0.001"/D.001” Lapped Lapped L2 o.134"¢o.ooos" 0.0005"/o.0005" Lapped Lapped ML D.138"1:0.010" 0.002"/D.002” Metallized Lapped LM D.138"1:0.010" 0.002"/D.002” La (1 Metallized MM D.142"1:0.010" 0.002"/D.002” Metallized Metallized SEALING OPTIONS SUFFIX I SEALANT COLOR TEMP RANGE DESCRIPTION RT RTV White >60 to 204 'C Non-corrosive, silicone adhesive EP Epoxy Black 55 to 150 'C Low density syntactic foam epoxy encapsulant
Ceramic Plate Series CP08-127-06
Thermoelectric Modules
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The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is
considered ‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable
TEMs is available in numerous heat pumping capacities, geometric
shapes, and input power ranges. Assembled with Bismuth
Telluride semiconductor material and thermally conductive
Aluminum Oxide ceramics, the CP Series is designed for higher
current and large heat-pumping applications.
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
ets.sales@lairdtech.com
www.lairdtech.com
FEATURES
• Precise temperature control
• Compact geometric sizes
• Reliable solid state operation
• No sound or vibration
• Environmentally friendly
• DC operation
• RoHS compliant
APPLICATIONS
• Medical lasers
• Lab science instrumentation
• Clinical diagnostics systems
• Photonics laser systems
• Electronic enclosure cooling
• Food & beverage cooling
• Chillers (liquid cooling)
SPECIFICATIONS
TECHNICAL
Hot Side Temperature (°C)
25°C
50°C
Qmax (Watts)
18.1
20.0
Delta Tmax (°C) 67 75
Imax (Amps)
2.1
2.1
Vmax (Volts)
14.4
16.4
Module Resistance (Ohms) 6.31 7.12
SUFFIX
(PRIOR TO
TINNING)
FLATNESS &
PARALLELISM
HOT FACE
L
0.0015”/0.0015”
Lapped
L1
0.001”/0.001”
Lapped
L2
0.0005”/0.0005”
Lapped
ML 0.138”±0.010” 0.002”/0.002” Metallized Lapped 4.5”
LM
0.002”/0.002”
Lapped
MM
0.002”/0.002”
Metallized
SEALING OPTIONS
SUFFIX
SEALANT
COLOR
TEMP RANGE
DESCRIPTION
RT RTV White -60 to 204 °C Non-corrosive, silicone adhesive
EP Epoxy Black -55 to 150 °C Low density syntactic foam epoxy encapsulant
Performance Curves at Th =25°C
5;) THERMO 20.0 10.0 10.0 14.0 12.0 10.0 OCIWI 0.0 X 6.0 l.0 20 0.0 aomoosoaoaozowo Delia‘N'C) ELECTRIC Voltagc (V) wmoosoaoaozuuoo Del'aT(‘C)
CP08-127-06
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THERMO
ELECTRIC
0.97 TYP (24.6) I RED (» 26 AWG PVC 0.97 TV? 45 (HA) In lENGTH (24.6) BLACK (‘) NEAY SHRINK TUBING (2 HACKS! (“D "AI (SE! "“0"” {SEE mm) an ass "01 FME ISIS 07mm) Ceramk Material: Alumina (Alp) Soldev Communion: 138°C. Bismuth Tm (BiSn)
CP08-127-06
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NOTES
1. Max operating temperature: 80°C
2. Do not exceed Imax or Vmax when operating module
3. Reference assembly guidelines for recommended installation
4. Solder tinning also available on metallized ceramics
Laird-ETS-CP08-127-06-Data-Sheet-100616
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