MMT20303HT1 规格书

T20303H 12/2015 \/RoHS 5' fre escale‘
MMT20303HT1
1
RF Device Data
Freescale Semiconductor, Inc.
3--Bit Digital Step Attenuator
The MMT20303H is an integrated 3--bit digital step attenuator witha1dB
step size. It is controlled via a 3--bit parallel interface and operates from a 3 to 5 V
supply. The MMT20303H is suitable for 3G/4G small cell transmitter and mobile
radio applications using frequencies from 50 to 4000 MHz.
Features
Frequency: 50–4000 MHz
Maximum RF Input Power: 30 dBm (CW)
Typical IIP3 > 50 dBm
Programmable Attenuator with 7 dB Maximum Range, 1 dB Step Size
Low Insertion Loss
0.1 dB Typical Bit Error
Excellent Consistency over Temperature and Supply Voltage
Single 3 to 5 V Supply
50 Ohm Operation
P1dB Independent of Control Voltage
3--bit Digital Control
TTL/CMOS Interface Compatible
Cost--effective 16--pin, 3 mm QFN Surface Mount Plastic Package
Table 1. Typical Performance (1)
Characteristic Symbol
250
MHz
900
MHz
4000
MHz Unit
Insertion Loss IL –0.6 –0.7 –1.3 dB
Attenuation Accuracy (Worst Case State) —+0.1, –0.1 +0.1, 0 +0.1, –0.1 dB
Third Order Intercept Input Point (2) IIP3 47 54 52 dBm
Power Input @ 1 dB Compression P1dB 30 35 (3) 35 (3) dBm
1. VDD =5Vdc,T
A=25C,50 ohm system, application circuit tuned for specific frequency.
2. Two--tone input power = +13 dBm each tone.
3. Operate within specified maximum rating.
Figure 1. Functional Block Diagram
RFin RFout
b2
1dB 2dB 4dB
b1b0
VDD
Document Number: MMT20303H
Rev. 0, 12/2015
Freescale Semiconductor
Technical Data
MMT20303HT1
50–4000 MHz, 3 Bit
1dBLSB
QFN 3 3
PLASTIC
Freescale Semiconductor, Inc., 2015.
A
ll rights reserved.
2
RF Device Data
Freescale Semiconductor, Inc.
MMT20303HT1
Table 2. Maximum Ratings
Rating Symbol Value Unit
Supply Voltage VDD 6 V
RF Input Power Pin 30 dBm
Storage Temperature Range Tstg –65 to +150 C
Case Operating Temperature Range TC–40 to +85 C
Junction Temperature TJ175 C
Table 3. Electrical Characteristics (VDD = 5 Vdc, 900 MHz, TA=25C, 50 ohm system, in Freescale Application Circuit)
Characteristic Symbol Min Typ Max Unit
Insertion Loss 1 (50–900 MHz) IL1—0.6 1.0 dB
Insertion Loss 2 (1000–2500 MHz) IL2—0.8 —dB
Insertion Loss 3 (2500–4000 MHz) IL3—1.2 —dB
Input Return Loss (S11) IRL — 20 —dB
Output Return Loss (S22) ORL —20 —dB
Attenuation Control Maximum Range R — 7 — dB
Attenuation Step R— 1 — dB
Attenuation Accuracy — — 0.1 0.25 dB
Turn--on Time ton —60 —ns
Turn--off Time toff —100 —ns
Power Output @ 1dB Compression P1dB —35 —dBm
Third Order Input Intercept Point @ 5 V IIP35—50 —dBm
Third Order Input Intercept Point @ 3 V IIP33—50 —dBm
Max Input Voltage Logic Low @ 100 A, 3 V VIL — — 0.8 V
Min Input Voltage Logic High @ 100 A, 3 V VIH 2.3 — — V
Supply Current @ 5 V IDD — 2 3 mA
Table 4. ESD Protection Characteristics
Test Methodology Class
Human Body Model (per JESD22--A114) 1A
Machine Model (per EIA/JESD22--A115) A
Charge Device Model (per JESD22--C101) III
Table 5. Moisture Sensitivity Level
Test Methodology Rating Package Peak Temperature Unit
Per JESD22--A113, IPC/JEDEC J--STD--020 1260 C
Table 6. Ordering Information
Device Tape and Reel Information Package
MMT20303HT1 T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel QFN 3 3
MMT20303HT1
3
RF Device Data
Freescale Semiconductor, Inc.
Table 7. Functional Pin Description
Pin Number Pin Function Pin Description
1, 3, 4, 5, 8,
9, 10, 12
N.C. No Connection
2RFin RF Input
6, 7 ACG (1) AC Ground
11 RFout RF Output
13 b0Attenuator Bit 0 (active low)
14 b1Attenuator Bit 1 (active low)
15 b2Attenuator Bit 2 (active low)
16 VDD Supply Voltage
1. AC ground connection for operation below 700 MHz.
Table 8. Logic Truth Table
b2b1b0State
Attenuation
(dB)
H H H 111 0
L H H 011 1
H L H 101 2
L L H 001 3
H H L 110 4
L H L 010 5
H L L 100 6
L L L 000 7
(Top View)
1
2
3
16
4
RFin
N.C.
15
b0
14 13
5678
12
11
10
9N.C.
N.C.
N.C.
N.C.
RFout
N.C.
Figure 2. Pin Connections
N.C.
VDD
Note: Exposed backside of the package is DC and
RF ground. N.C. can be connected to GND.
b1
b2
N.C. ACG1 ACG2
WIIIIJ rIIIIL U U U U |_T___
4
RF Device Data
Freescale Semiconductor, Inc.
MMT20303HT1
50 OHM APPLICATION CIRCUIT: 50–4000 MHz, 5 VOLT OPERATION
16 15 14 13
1
2
3
4
5 6 7 8
12
11
10
9
C1
RF
INPUT
C2
RF
OUTPUT
C3
VDD
R1
C4
b1 b2 b0
Figure 3. MMT20303HT1 Test Circuit Schematic
VCTL
Table 9. MMT20303HT1 Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2, C4 0.1 F Chip Capacitors GRM155R61A104KA01D Murata
C3 3300 pF Chip Capacitor GRM1557U1A332JA01D Murata
J1, J2, J3 3--pin Header 22--28--8360 Molex
R1 1000 , 1/16 W Chip Resistor RC0402FR--071KL Yageo
PCB Rogers RO4350B, 0.010,r=3.66 M60818 MTL
0000000 00000 00030000 3003 QUOOSZOOOOO 000000000 00%;, a o o rx, or o o O ‘ CC 0 O O 000000000000 0 0 o 00 \13 1‘ p o _ 0 0 00 (C a 0 o u‘x‘c ‘0 no ouo \0 CO 0 O O OO O O 0 o \c c O n o b o 0 H0 0 o X 00 o o 0 c coo? CO C C 00 a a o o o a, a o , 0 o o \/ 0 00000000000 0000300000 06 0000000 00000n 00000000c coo
MMT20303HT1
5
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 50–4000 MHz, 5 VOLT OPERATION
Figure 4. MMT20303HT1 Test Circuit Component Layout
b0b1
Com
b2
C4
C1 C2
C3
R1
VDD
RFOUT
RFIN
VCTL
QFN 33 16A
Rev. 1
J1 J2 J3
PCB actual size: 1.251.62.
Table 9. MMT20303HT1 Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2, C4 0.1 F Chip Capacitors GRM155R61A104KA01D Murata
C3 3300 pF Chip Capacitor GRM1557U1A332JA01D Murata
J1, J2, J3 3--pin Header 22--28--8360 Molex
R1 1000 , 1/16 W Chip Resistor RC0402FR--071KL Yageo
PCB Rogers RO4350B, 0.010,r=3.66 M60818 MTL
(Test Circuit Component Designations and Values table repeated for reference.)
/
6
RF Device Data
Freescale Semiconductor, Inc.
MMT20303HT1
50 OHM APPLICATION CIRCUIT: 50–4000 MHz, 5 VOLT OPERATION
Figure 5. Insertion Loss versus Frequency
versus Temperature
–1.6
–
0.4
0
f, FREQUENCY (MHz)
–0.8
–1
–1.2
–1.4
INSERTION LOSS (dB)
–0.6
1000 2000 40003000
–40C
25C
85C
VDD =5Vdc
–180
180
90
Figure 6. Insertion Phase versus Frequency
versus Temperature (–40C, 25C, 85C)
45
–45
–90
f, FREQUENCY (MHz)
INSERTION PHASE ()
135
0
–135
0 1000 2000 40003000
VDD =5Vdc
W h w W
MMT20303HT1
7
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 50–4000 MHz, 5 VOLT OPERATION
Figure 7. S11 versus Frequency
–40
–
10
0
f, FREQUENCY (MHz)
–20
–25
–30
–35
S11 (dB)
–15
1000 2000 40003000
VDD =5Vdc
Figure 8. S22 versus Frequency
–40
–
10
0
f, FREQUENCY (MHz)
–20
–25
–30
–35
S22 (dB)
–15
1000 2000 4000
3000
VDD =5Vdc
State = 111
State = 011
State = 110
State = 101
State = 111
State = 000
State = 110
State = 101
State = 011
State = 000
–8
1
–1
–2
–4
–5
f, FREQUENCY (MHz)
ATTENUATION (dB)
0
–3
–6
0 1000 2000 40003000
VDD =5Vdc
–7
State = 111
State = 011
State = 101
State = 110
State = 000
Attenuation Error Due to Temperature
Major Setting
Temperature
Range
Attenuation due
to Temperature
0dB –40Cto85C0dB
1dB 0.08 dB
2dB 0.08 dB
4dB 0.08 dB
7dB 0.20 dB
Figure 9. Attenuation versus Frequency
8
RF Device Data
Freescale Semiconductor, Inc.
MMT20303HT1
50 OHM APPLICATION CIRCUIT: 50–4000 MHz, 5 VOLT OPERATION
–3
6
4
Figure 10. Phase Shift versus Frequency
3
1
0
f, FREQUENCY (MHz)
PHASE SHIFT ()
5
2
–1
0 1000 2000 40003000
VDD =5Vdc
–2
52
62
60
Figure 11. IIP3 versus Frequency
56
f, FREQUENCY (MHz)
IIP3 (dBm)
58
900 1350 1800 36002250
VDD =5Vdc
54
2700 3150
30
35
34
Figure 12. Input P0.1dB versus Frequency
32
f, FREQUENCY (MHz)
INPUT P0.1dB
33
500 1000 1500 3500
2000
VDD =5Vdc
31
2500 3000
State = 110
State = 000
State = 111
State = 101
State = 011
State = 000
State = 111
State = 111
MMT20303HT1
9
RF Device Data
Freescale Semiconductor, Inc.
Figure 13. PCB Pad Layout for QFN 3 3, 16 Lead
1.6 1.6 solder pad with
thermal via structure. All
dimensions in mm.
x
0.70
0.30
0.50
2.00 3.40
3.0 3.0
Figure 14. Product Marking
MT01
WLYW
DETAIL 2X V’_"_‘x QOAC PIN T TDJ7 | U U EXPOSED DE 7 I ATTACH PAD . I I . 1,5 3 1.4 _ I-IIEI i 9 29 f1 . P‘N1‘D flfllflfl I | | I 4 16 16X 0.20 MW!- © FREEffnglggrgcggggggg; ”‘C- MECHANICAL OUTLINE PRTNT VERSION NOT To SCALE TTTLE: QFN (PUNCH) DOCUMENT NO: 98ASA00598D REV: o , THERMALLY ENHANCED STANDARD: NONidEDEC 3 x 3 x 0.85, 05 PTTCH, 16 TERMINAL 20 MAM“
10
RF Device Data
Freescale Semiconductor, Inc.
MMT20303HT1
PACKAGE DIMENSIONS
o 0070 0060 0.90 0.80 (0-2)— 0,o5 $900 SEATTNG PLANE EXPOSED DTE ATTACH PAD DETA‘L G VIEw ROTATED 90‘ CW 0 FREEELCL‘LSISflS‘nggEungg' ”‘0' MECHANICAL OUTLINE PRLNT VERSION NOT To SCALE TITLE: QFN (PUNCH) DOCUMENT NO: 95ASA005950 REV: 0 THERMALLY ENHANCED 3 X 3 X 0.85, 0.5 P‘TCH, 16 TERMINAL STANDARD: NONidEDEC 20 MAY 2013
MMT20303HT1
11
RF Device Data
Freescale Semiconductor, Inc.
NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME YI4.5M—2009, ATHIS DIMENSION APPLIES TO METALIZED TERMINAL AND IS MEASURED BETWEEN 015 AND 0,30MM FROM TERMINAL TIP, ABILATERAL COPLANARITY ZONE APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. ATHIS DIMENSION APPLIES ONLY FOR TERMINALS. © FREESCALE SEMIC°NWCT°R- INC- MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE ALL RIGHTS RESERVED. TITLE: QFN (PUNCH), THERMALLY ENHANCED 3 x 3 x 0.85, 05 PITCH, I6 TERMINAL DOCUMENT NO: QBASAOOSQSD REV: 0 STANDARD: NON—JEDEC 20 MAY 2013
12
RF Device Data
Freescale Semiconductor, Inc.
MMT20303HT1
MMT20303HT1
13
RF Device Data
Freescale Semiconductor, Inc.
PRODUCT DOCUMENTATION AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Development Tools
Printed Circuit Boards
To Download Resources Specific to a Given Part Number:
1. Go to http://www.freescale.com/rf
2. Search by part number
3. Click part number link
4. Choose the desired resource from the drop down menu
FAILURE ANALYSIS
At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In
cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third
party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision Date Description
0Dec. 2015 Initial release of data sheet
freescale‘
14
RF Device Data
Freescale Semiconductor, Inc.
MMT20303HT1
Information in this document is provided solely to enable system and software
implementers to use Freescale products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits based on the
information in this document.
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for
each customer application by customer’s technical experts. Freescale does not convey
any license under its patent rights nor the rights of others. Freescale sells products
pursuant to standard terms and conditions of sale, which can be found at the following
address: freescale.com/SalesTermsandConditions.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their
respective owners.
E2015 Freescale Semiconductor, Inc.
How to Reach Us:
Home Page:
freescale.com
Web Support:
freescale.com/support
Document Number: MMT20303H
Rev. 0, 12/2015