Murata Electronics 的 BLM03PX Series Spec 规格书

Spec.N0.J ENF243A70020AF701 BLMOBAGW OOSN1 D BLMOBAG7OOSN1 D BLMOBAGBOOSN1 D ELM03A6121SN1D BLMOBAG241 SNW D BLMOBAGGOW SNW D BLMOBAGW 02SN1 D ELMOSAX1OOSN1 D ELMOSAXSOOSN1 D BLMOSAX121SN1D ELMOSAX241SN1 D ELMOSAXGO1SN1 D ELMOSAX1028N1 D BLMOBPG22OSN1 D BLMOBPGBBOSN1 D BLMOBPX2208N1 D BLMOBPXSSOSN1 D BLMOBPXSOOSN1 D BLMOBPX121SN1D
Spec.No.JENF243A-0020AF-01 P1/9
MURATA MFG.CO.,LTD.
Reference Only
Chip Ferrite Bead BLM03□□□□□SN1□ Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM03_SN Series.
2.Part Numbering
(ex.) BL M 03 AG 121 S N 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (2)Type (3)Dimension(L×W) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz,Under Standard
Testing Condition)
Rated
Current
(mA)
DC Resistance
(Ω max.) Remark
Initial
Values Values
After
Testing
Typical at 85℃ at 125℃
BLM03AG100SN1D
5 to 15 10 500 0.1 0.15
For
general
use
BLM03AG100SN1B
BLM03AG700SN1D
40 to 100 70 200 0.4 0.5
BLM03AG700SN1B
BLM03AG800SN1D 80±25％ 80 200 0.4 0.5
BLM03AG800SN1B
BLM03AG121SN1D 120±25% 120 200 0.5 0.6
BLM03AG121SN1B
BLM03AG241SN1D
240±25% 240 200 0.8 0.9
BLM03AG241SN1B
BLM03AG601SN1D
600±25% 600 100 1.5 1.6
BLM03AG601SN1B
BLM03AG102SN1D
1000±25% 1000 100 2.5 2.6
BLM03AG102SN1B
BLM03AX100SN1D 5～15 10 1000 0.05 0.10
BLM03AX100SN1B
BLM03AX800SN1D 80±25％ 80 500 0.18 0.23
BLM03AX800SN1B
BLM03AX121SN1D 120±25％ 120 450 0.23 0.28
BLM03AX121SN1B
BLM03AX241SN1D 240±25％ 240 350 0.38 0.43
BLM03AX241SN1B
BLM03AX601SN1D 600±25％ 600 250 0.85 0.90
BLM03AX601SN1B
BLM03AX102SN1D 1000±25％ 1000 200 1.25 1.30
BLM03AX102SN1B
BLM03PG220SN1D 22±25% 22 900 0.065 0.115
For DC
power Line
BLM03PG220SN1B
BLM03PG330SN1D 33±25% 33 750 0.090 0.140
BLM03PG330SN1B
BLM03PX220SN1D 22±25％ 22 1800*1 1450*1 0.040 0.045
BLM03PX220SN1B
BLM03PX330SN1D 33±25％ 33 1500*1 1200*1 0.055 0.060
BLM03PX330SN1B
BLM03PX800SN1D 80±25％ 80 1000*1 800*1 0.130 0.135
BLM03PX800SN1B
BLM03PX121SN1D 120±25％ 120 900*1 700*1 0.160 0.210
BLM03PX121SN1B
S ec.N0.J ENF243A70020AF701 BLMOBBm OOSN1 D BLMOBBB22OSN1 D BLMOBBB47OSN1 D BLMOBBB7EOSN1 D BLMOBBBW2WSN1D BLMOBBCBBOSN1 D BLMOBBCEGOSN1 D BLMOBBCBOOSN1 D BLMOBBD7EOSN1 D BLMOBBD12WSN1D BLMOBBD241 SN1 D BLMOBBD471 SN1 D BLMOBBD601 SN1 D BLMOBBX102$N1 D BLMOBBX1828N1 D
Spec.No.JENF243A-0020AF-01 P2/9
MURATA MFG.CO.,LTD.
Reference Only
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz,Under Standard
Testing Condition)
Rated
Current
(mA)
DC Resistance
(Ω max.) Remark
Initial
Values Values
After
Testing
Typical at 85℃ at 125℃
BLM03BB100SN1D
10±25% 10 300 0.4 0.5
For high
speed
signal Line
BLM03BB100SN1B
BLM03BB220SN1D
22±25% 22 200 0.5 0.6
BLM03BB220SN1B
BLM03BB470SN1D
47±25% 47 200 0.7 0.8
BLM03BB470SN1B
BLM03BB750SN1D
75±25% 75 200 1.0 1.1
BLM03BB750SN1B
BLM03BB121SN1D
120±25% 120 100 1.5 1.6
BLM03BB121SN1B
BLM03BC330SN1D 33±25％ 33 150 0.85 0.90
BLM03BC330SN1B
BLM03BC560SN1D 56±25％ 56 100 1.05 1.10
BLM03BC560SN1B
BLM03BC800SN1D 80±25％ 80 100 1.40 1.45
BLM03BC800SN1B
BLM03BD750SN1D
75±25% 75 300 0.4 0.5
BLM03BD750SN1B
BLM03BD121SN1D
120±25% 120 250 0.5 0.6
BLM03BD121SN1B
BLM03BD241SN1D
240±25% 240 200 0.8 0.9
BLM03BD241SN1B
BLM03BD471SN1D 470±25％ 470 215 1.5 1.6
BLM03BD471SN1B
BLM03BD601SN1D 600±25％ 600 200 1.7 1.8
BLM03BD601SN1B
BLM03BX102SN1D 1000±25% 1000 170 1.70 1.75
BLM03BX102SN1B
BLM03BX182SN1D 1800±25% 1800 140 2.50 2.55
BLM03BX182SN1B
■Operating Temperature : -55°C to +125°C ■Storage Temperature : -55°C to +125°C
(Note) As for the Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
4. Style and Dimensions
■ Equivalent Circuit
■ Unit Mass(Typical value)
(in mm) 0.3mg
5.Marking
No marking.
Operating Temperature (°C)
85 125
0
Rated Current (A)
at 85°C
Rated current
at 125°C
Rated current
:Electrode
0.6±0.03 0.3±0.03
0.15±0.05
0.3±0.03
Resistance element becomes
dominant at high frequencies.
()
Sgec.N0.J ENF243A70020AF701 Table 1
Spec.No.JENF243A-0020AF-01 P3/9
MURATA MFG.CO.,LTD.
Reference Only
6.Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3.
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi mete
r
* Except resistance of the Substrate and Wire
7-2.Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance and
Dimensions Meet item 4. Visual Inspection and measured with Measuring
Microscope.
7-2-2 Bending
Strength Meet Table 1.
Table 1
It shall be soldered on the Glass-epoxy substrate.
Substrate : 100mm×40mm×0.8mm
Deflection : 1.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
7-2-3 Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-4 Resistance
to Soldering
Heat
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
7-2-5 Solderability The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
Appearance No damage
Impedance
Change
(at 100MHz) Within ±30%
DC
Resistance Meet item 3.
45mm
R340
F
Deflection
45mm Product
Pressure jig
Sgec.No.J ENF243A70020AF701 Reference Onl P4/9 =* W
Spec.No.JENF243A-0020AF-01 P4/9
MURATA MFG.CO.,LTD.
Reference Only
0.55max.
0.36(Typ.)
0.66(Typ.)
4.0±0.1
φ
1.5
+0.1
-0
1.75±0.1
8.0±0.3
Direction of Feed
3.5±0.05
2.0±0.05
2.0±0.05
7-3.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle Meet Table 1. 1 cycle :
1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
7-3-2 Humidity Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-3 Heat Life Temperature : 125°C±3°C
Applying Current : Rated Current (at 125℃)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-4 Cold Resistance Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
8.Specification of Packaging
8-1.Appearance and Dimensions (8mm-wide paper tape)
(in mm)
(1)Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously
and sealed by cover tape .
(2)Sprocket hole: The sprocket holes are to the right as the tape is pulled toward the user.
(3)Spliced point:The base tape and cover tape have no spliced point
(4)Cavity:There shall not be burr in the cavity.
(5)Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
Reference Onli Sgec.N0.J ENF243A70020AF701 0000 XXX I g Case
Spec.No.JENF243A-0020AF-01 P5/9
MURATA MFG.CO.,LTD.
Reference Only
8-2.Tape Strength
(1)Pull Strength
Cover tape 5N min.
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel 15000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc)
∗1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking » ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(∗2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
∗ Above Outer Case size is typical. It depends on a quantity of an
order.
Empty tape
190 min.
Leader
Trailer
Cover tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
9±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
W
D
Label
H
F
165 to 180 degree Cover tape
Base tape
Refe re nce Onl Sgec.No.JENF243A70020AF701 A f 5 D§
Spec.No.JENF243A-0020AF-01 P6/9
MURATA MFG.CO.,LTD.
Reference Only
9. ！ Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (vehicles, trains, ships, etc.)
(4)Power plant control equipment (9) Data-processing equipment
(5)Medical equipment (10)Applications of similar complexity and /or reliability
requirements to the applications listed in the above
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
• Standard land dimensions (Reflow soldering)
< For BLM03 series (except BLM03PG, BLM03PX, BLM03AX type) >
(in mm)
< For BLM03PG, BLM03PX, BLM03AX type >
Rated
Current
(A) a b c
Land pad thickness
and dimension d
18µm 35µm 70µm
max.0.9 0.25 0.80 0.30 0.3 0.3 0.3
max.1.8 1.2 0.7 0.3
(in mm)
∗The excessive heat by land pads may cause deterioration
at joint of products with substrate.
Type a b c
BLM03
(except 03PG, PX, AX Type) 0.25 0.80 0.30
a
Chip Ferrite Bead
Solder Resist
Pattern
b
c
Chip Ferrite Bead
a
d
b
c
Solder Resist
Pattern
Refe re nce Onl Sgec.No.JENF243A70020AF701
Spec.No.JENF243A-0020AF-01 P7/9
MURATA MFG.CO.,LTD.
Reference Only
10-2.Soldering Conditions
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 150 μm
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
10-3. Reworking with soldering iron
• Pre-heating: 150°C, 1 min • Soldering iron output: 80W max.
• Tip temperature: 350°C max. • Tip diameter:φ3mm max.
• Soldering time : 3(+1,-0) seconds. • Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Recommendable
Upper Limit
t
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Sgec.N0.J ENF243A70020AF701 i E 0000 (:) 0000: BTU '1 A > D is valid whe It a Cutting Disc is (3) Mounting Compun When a component the tightening oi the @IEJ-tfljl 10-6.Mouming density Add special attention The excessive heat b
Spec.No.JENF243A-0020AF-01 P8/9
MURATA MFG.CO.,LTD.
Reference Only
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
10-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
〈
Poor example
〉〈
Good example
〉
b
a
Perforation
Slit
A
B
C
D
Screw Hole Recommended
Refe re nce Onl Sgec.No.JENF243A70020AF701
Spec.No.JENF243A-0020AF-01 P9/9
MURATA MFG.CO.,LTD.
Reference Only
10-7.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
· Isopropyl alcohol (IPA)
2.Aqueous agent
· PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
10-8. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance
of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-9. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
10-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
• Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11 . ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.