Texas Instruments 的 TPS61098(1,2) 规格书

U Ordering & Technical Design a 3 Support 5 o . quahly documentation development (raming I TEXAS INSTRUMENTS ] NH W W41
TPS61098x Ultra-Low Quiescent Current Synchronous Boost with Integrated LDO/
Load Switch
1 Features
• 300-nA ultra-low IQ in low power mode
• Start-up into load at 0.7-V input voltage
• Operating input voltage from 0.7 V to 4.5 V
• Selectable output voltages up to 4.3 V
• Minimum 350-mA switch peak current limit
• Integrated LDO/load switch
• Two modes controlled by MODE pin
– Active mode: dual outputs at set values
– Low power mode: LDO/load switch off; boost
keeps on
• Automatic pass-through
• Up to 88% efficiency at 10-µA load from 2 V to 3.3
V conversion (low power mode)
• Up to 93% efficiency at 5-mA to 100-mA load from
2-V to 3.3-V conversion
• 1.5-mm × 1.5-mm WSON package
2 Applications
• Smart remote control
• BLE tag
•Wearable applications
• Low-power wireless applications
•Portable consumer or medical products
• Single-coin cell, single- or two-cell alkaline-
powered applications
3 Description
The TPS61098x is an ultra-low power solution for
products powered by either a one-cell or two-cell
alkaline, NiCd or NiMH, one-cell coin cell or one-cell
Li-Ion or Li-polymer battery. It integrates either a Low-
dropout Linear Regulator (LDO) or a load switch with
a boost converter and provides two output rails. The
boost output V(MAIN) is designed as an always-on
supply for a main system, and the LDO or load switch
output V(SUB) is to power peripheral devices.
The TPS61098x has two modes controlled by the
MODE pin: Active mode and Low Power mode. In
Active mode, both outputs are enabled with enhanced
response performance. In Low Power mode, the LDO
or load switch is disabled to disconnect peripherals.
The TPS61098x consumes only 300-nA quiescent
current and can achieve up to 88% efficiency at 10-µA
load in Low Power mode.
The TPS61098x supports automatic pass-through
function. When input voltage is higher than a pass-
through threshold, the boost converter stops switching
and passes the input voltage to the VMAIN rail; when
input voltage is lower than the threshold, the boost
works in Boost mode and regulates the output at
the target value. The TPS61098x provides different
versions for different output set values.
The TPS61098x can provide up to 50-mA total output
current at 0.7-V input to 3.3-V output conversion. The
boost is based on a hysteretic controller topology
using a synchronous rectifier to obtain maximum
efficiency at minimal quiescent current.
The TPS61098x is available in 1.5-mm × 1.5-mm
WSON package to enable small circuit layout size.
Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
TPS61098x 6 Pin WSON 1.50 mm × 1.50 mm
(1) For all available packages, see the orderable addendum at
the end of this document.
SW
MODE
VMAIN
VSUB
VIN
CBAT
10µF
CO2
10µF
CO1
10µF
BOOST
CTRL
LDO / LS
CTRL
GND
CIN
0.1µF
RIN
400
0.7 V to 4.5 V
L
4.7µH
Copyright © 2016, Texas Instruments Incorporated
Simplified Schematic
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 Recommended Operating Conditions.........................4
7.4 Thermal Information....................................................4
7.5 Electrical Characteristics.............................................5
7.6 Typical Characteristics................................................ 7
8 Detailed Description......................................................16
8.1 Overview................................................................... 16
8.2 Functional Block Diagrams....................................... 16
8.3 Feature Description...................................................17
8.4 Device Functional Modes..........................................19
9 Applications and Implementation................................ 21
9.1 Application Information............................................. 21
9.2 Typical Applications.................................................. 21
10 Power Supply Recommendations..............................33
11 Layout........................................................................... 34
11.1 Layout Guidelines................................................... 34
11.2 Layout Example...................................................... 34
12 Device and Documentation Support..........................35
12.1 Device Support....................................................... 35
12.2 Documentation Support.......................................... 35
12.3 Receiving Notification of Documentation Updates..35
12.4 Support Resources................................................. 35
12.5 Trademarks............................................................. 35
12.6 Electrostatic Discharge Caution..............................35
12.7 Glossary..................................................................35
13 Mechanical, Packaging, and Orderable
Information.................................................................... 35
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (December 2016) to Revision F (September 2021) Page
• Updated the numbering format for tables, figures, and cross-references throughout the document. ................1
Changes from Revision D (April 2016) to Revision E (November 2016) Page
• Changed the HBM value From: ±1000 To: ±2000 in Section 7.2 .......................................................................4
• Changed the CDM value From: ±250 To: ±750 in Section 7.2 .......................................................................... 4
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5 Device Comparison Table
PART NUMBER INTEGRATED LDO OR
LOAD SWITCH
VMAIN
(ACTIVE MODE)
VMAIN
(LOW POWER MODE)
VSUB
(ACTIVE MODE)
VSUB
(LOW POWER MODE)
VSUB ACTIVE
DISCHARGE IN LOW
POWER MODE
TPS61098DSE(1) LDO 4.3 V 2.2 V 3.1 V OFF No
TPS610981DSE LDO 3.3 V 3.3 V 3.0 V OFF Yes
TPS610982DSE LDO 3.3 V 3.3 V 2.8 V 2.8 V No
TPS610985DSE Load Switch 3.0 V 3.0 V ON OFF Yes
TPS610986DSE Load Switch 3.3 V 3.3 V ON OFF Yes
TPS610987DSE LDO 4.3 V 2.2 V 3.1 V OFF Yes
(1) The DSE package is available taped and reeled. Add R suffix to device type (for example, TPS61098DSER) to order quantities of 3000
devices per reel. Add T suffix to device type (for example, TPS61098DSET) to order quantities of 250 devices per reel. For detailed
ordering informationm, please check the package option addendum at the end of this data sheet.
6 Pin Configuration and Functions
VMAIN
VIN
SW
GND
MODE
VSUB
Figure 6-1. DSE Package 6-Pin WSON Top View
Table 6-1. Pin Functions
PIN I/O DESCRIPTION
NAME NO.
VMAIN 1 PWR Boost converter output
SW 2 PWR Connection for inductor
VIN 3 I IC power supply input
MODE 4 I Mode selection pin. 1: Active mode; 0: Low Power mode. Must be actively tied high or low. Do not leave
floating.
VSUB 5 PWR LDO or load switch output
GND 6 PWR IC ground
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN, SW, VMAIN, VSUB –0.3 4.7 V
MODE –0.3 5.0 V
Operating junction temperature, TJ–40 150 °C
Storage temperature range, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE UNIT
V(ESD) Electrostatic discharge
Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged Device Model (CDM), per JEDEC specification JESD22-
C101, all pins(2)
±750
(1) JEDEC document JEP155 states that 500V HBM rating allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM rating allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN NOM MAX UNIT
VIN Input voltage range 0.7 4.5 V
V(MAIN) Boost converter output voltage range 2.2 4.3 V
V(SUB) Load switch / LDO outut voltage range 1.8 3.7 V
L Effective inductance range 1.54 4.7 6.11 µH
CBAT Effective input capacitance range at input(1) 5 µF
CO1 Effective output capacitance range at VMAIN pin for boost converter output(1) 5 10 22 µF
CO2
Effective output capacitance range at VSUB pin for LDO output(1) 1(2) 5 10 µF
Effective output capacitance range at VSUB pin for load switch output(1) (3) 1 2.2 µF
TJOperating virtual junction temperature –40 125 °C
(1) Effective value. Ceramic capacitor’s derating effect under bias should be considered. Choose the right nominal capacitance by
checking capacitor DC bias characteristics.
(2) If LDO output current is lower than 20 mA, the minimum effective output capacitance value can be lower to 0.5 µF.
(3) With load switch version, the output capacitor at VSUB pin is only required if smaller voltage ripple is needed.
7.4 Thermal Information
THERMAL METRIC(1) TPS61098x UNIT
DSE 6 PINS
RθJA Junction-to-ambient thermal resistance 207.3 °C/W
RθJCtop Junction-to-case (top) thermal resistance 118.9 °C/W
RθJB Junction-to-board thermal resistance 136.4 °C/W
ψJT Junction-to-top characterization parameter 8.3 °C/W
ψJB Junction-to-board characterization parameter 136.4 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see theSemiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
TJ = –40°C to 125°C and VIN = 0.7 V to 4.5 V. Typical values are at VIN = 1.5 V, TJ = 25°C, unless otherwise noted.
PARAMETER VERSION TEST CONDITIONS MIN TYP MAX UNIT
Power Supply
VIN Input voltage range TPS61098x 0.7 4.5 V
VIN(start) Minimum input voltage at start-up TPS61098x RLoad ≥ 3 kΩ (1) 0.7 V
IQ(VIN)
Quiescent current into the VIN pin
in Active mode TPS61098x
MODE = High, Boost or Pass-through
no load, no switching
TJ = –40°C to 85°C
2 4 µA
Quiescent current into the VIN pin
in Low Power mode TPS61098x MODE = Low, Boost or Pass-through
no load, no switching 5 90 nA
IQ(VMAIN)
Quiescent current into the VMAIN pin
in Active mode
TPS61098/1/5/6/7
MODE = High, Boost or Pass-through
no load, no switching
TJ = –40°C to 85°C
15 23 µA
TPS610982
MODE = High, Boost or Pass-through
no load, no switching
TJ = –40°C to 85°C
18 23 µA
Quiescent current into the VMAIN pin
in Low Power mode
TPS61098/1/7
MODE = Low, Boost or Pass-through
no load, no switching
TJ = 25°C
300 400 nA
TPS61098/1/5/6/7
MODE = Low, Boost or Pass-through
no load, no switching
TJ = –40°C to 85°C
300 800 nA
TPS610982
MODE = Low, Boost or Pass-through
no load, no switching
TJ = –40°C to 85°C
4 10 µA
ILKG(SW)
Leakage current of the SW pin
(from the SW pin to GND pin) TPS61098x V(MAIN) = V(SW) = 4.7 V, no load
TJ = –40°C to 85°C 5 100 nA
ILKG(MAIN)
Leakage current of the VMAIN pin
(from the VMAIN pin to SW pin) TPS61098x V(MAIN) = 4.7 V, V(SW) = 0 V, no load
TJ = –40°C to 85°C 10 200 nA
ILKG(SUB)
Leakage current of the VSUB pin
(from the VMAIN pin to VSUB pin) TPS61098/1/5/6/7 MODE = Low, V(MAIN) = 4.7 V, V(SUB) = 0 V
TJ = –40°C to 85°C 10 150 nA
ILKG(MODE) Leakage current into the MODE pin TPS61098x V(MODE) = 5 V
TJ = –40°C to 85°C 5 30 nA
Power Switch
RDS(on)_LS Low-side switch on resistance
TPS61098/7 MODE = Low 600 1000 mΩ
MODE = High 300 600 mΩ
TPS610981/2/6 MODE = Low / High 350 650 mΩ
TPS610985 MODE = Low / High 400 700 mΩ
RDS(on)_HS Rectifier on resistance
TPS61098/7 MODE = Low 700 1000 mΩ
MODE = High 450 700 mΩ
TPS610981/2/6 MODE = Low / High 500 700 mΩ
TPS610985 MODE = Low / High 550 750 mΩ
R(LS) Load switch on resistance TPS610985/6 1.2 2 Ω
V(Dropout) LDO dropout voltage TPS61098/1/2/7 ISUB = 50 mA 60 100 mV
ILH Inductor current ripple TPS61098x 100 mA
ILIM(BST) Boost switch current limit TPS61098x 0.7 V < VIN < V(MAIN) 350 500 650 mA
ILIM(SUB) VSUB output current limit TPS61098x TJ = –20°C to 125°C 200 mA
I(DISCH)
Discharge current from the VSUB pin to
GND pin TPS610981/5/6/7 MODE = Low, V(SUB) = 3 V 5 8 mA
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TJ = –40°C to 125°C and VIN = 0.7 V to 4.5 V. Typical values are at VIN = 1.5 V, TJ = 25°C, unless otherwise noted.
PARAMETER VERSION TEST CONDITIONS MIN TYP MAX UNIT
Output
V(MAIN) Boost converter output voltage
TPS61098/7
MODE = High, VIN < V(PSTH), Burst mode,
open loop 4.45 V
MODE = High, VIN < V(PSTH), PWM mode,
open loop 4.142 4.27 4.398 V
MODE = Low, VIN < V(PSTH), Burst mode,
open loop 2.3 V
MODE = Low, VIN < V(PSTH), PWM mode,
open loop 2.163 2.23 2.297 V
TPS610981
MODE = High / Low, VIN < V(PSTH), Burst
mode, open loop 3.4 V
MODE = High / Low, VIN < V(PSTH), PWM
mode, open loop 3.201 3.3 3.399 V
TPS610982
MODE = High / Low, VIN < V(PSTH), Burst
mode, open loop 3.4 V
MODE = High / Low, VIN < V(PSTH), PWM
mode, open loop 3.201 3.3 3.399 V
TPS610985
MODE = High / Low, VIN < V(PSTH), Burst
mode, open loop 3.1 V
MODE = High / Low, VIN < V(PSTH), PWM
mode, open loop 2.91 3.0 3.09 V
TPS610986
MODE = High / Low, VIN < V(PSTH), Burst
mode, open loop 3.4 V
MODE = High / Low, VIN < V(PSTH), PWM
mode, open loop 3.201 3.3 3.399 V
V(SUB)
LDO output voltage
(LDO version)
TPS61098/7 MODE = High 3.038 3.1 3.162 V
TPS610981 MODE = High 2.94 3.0 3.06 V
TPS610982 MODE = High / Low 2.744 2.8 2.856 V
V(PSTH) Pass-through mode threshold
TPS61098/7
MODE = High, VIN rising 4.4 V
MODE = High, Hysteresis 0.1 V
MODE = Low, VIN rising 2.25 V
MODE = Low, Hysteresis 0.1 V
TPS610981 MODE = High / Low, VIN rising 3.35 V
MODE = High / Low, Hysteresis 0.1 V
TPS610982 MODE = High / Low, VIN rising 3.35 V
MODE = High / Low, Hysteresis 0.1 V
TPS610985 MODE = High / Low, VIN rising 3.05 V
MODE = High / Low, Hysteresis 0.1 V
TPS610986 MODE = High / Low, VIN rising 3.35 V
MODE = High / Low, Hysteresis 0.1 V
PSRR Power-supply rejection ratio from LDO
input to output
TPS61098/1/2/7 f = 1kHz, CO2 = 10 µF, ISUB = 10 mA
MODE = High 40 dB
TPS610982 f = 1kHz, CO2 = 10 µF, ISUB = 10 mA
MODE = Low 28 dB
tstup_LDO
VSUB start-up time
(LDO version and load switch version) TPS61098x No load
time from MODE high to 90% of V(SUB)
1 ms
Control Logic
VIL MODE input low voltage TPS61098x 0.4 V
VIH MODE input high voltage TPS61098x 1.2 V
Overtemperature protection TPS61098x 150 °C
Overtemperature hysteresis TPS61098x 25 °C
(1) TPS61098x is able to drive RLoad > 150 Ω after VMAIN is established over 1.8 V.
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7.6 Typical Characteristics
Temperature (qC)
Quiescent Current (µA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
2
4
6
8
10
12
14
16
18
20
D001
TPS61098, '1, '5, '6 MODE = High
Figure 7-1. IQ into VMAIN Pin at Active Mode vs
Temperature
Temperature (qC)
Quiescent Current (µA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
0.2
0.4
0.6
0.8
1
1.2
D002
TPS61098, '1, '5, '6 MODE = Low
Figure 7-2. IQ into VMAIN Pin at Low Power Mode
vs Temperature
Temperature (°C)
Quiescent Current (µA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
5
10
15
20
25
30
D035
TPS610982 MODE = High
Figure 7-3. IQ into VMAIN Pin at Active Mode vs
Temperature
Temperature (°C)
Quiescent Current (µA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
1
2
3
4
5
6
7
8
9
D036
TPS610982 MODE = Low
Figure 7-4. IQ into VMAIN Pin at Low Power Mode
vs Temperature
Temperature (qC)
Rds(on) (m:)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
600
700
D021
TPS61098, '7 MODE = High
Figure 7-5. Rectifier On Resistance vs Temperature
TPS61098, '7 MODE = High
Figure 7-6. Low Side Switch On Resistance vs
Temperature
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Temperature (qC)
Rds(on) (m:)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
600
700
800
900
D023
TPS61098, '7 MODE = Low
Figure 7-7. Rectifier On Resistance vs Temperature
Temperature (qC)
Rds(on) (m:)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
600
700
800
900
1000
D024
TPS61098, '7 MODE = Low
Figure 7-8. Low Side Switch On Resistance vs
Temperature
Temperature (qC)
Rds(on) (m:)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
600
700
D003
TPS610981 MODE = High / Low
Figure 7-9. Rectifier On Resistance vs Temperature
Temperature (qC)
Rds(on) (m:)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
600
D004
TPS610981 MODE = High / Low
Figure 7-10. Low Side Switch On Resistance vs
Temperature
Temperature (°C)
Rds(on) (m:)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
600
700
D037
TPS610982 MODE = High / Low
Figure 7-11. Rectifier On Resistance vs
Temperature
TPS610982 MODE = High / Low
Figure 7-12. Low Side Switch On Resistance vs
Temperature
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Temperature (°C)
RDS(on) (m:)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
600
700
D039
TPS610985 MODE = High / Low
Figure 7-13. Rectifier on Resistance vs
Temperature
Temperature (°C)
RDS(on) (m:)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
600
700
D040
TPS610985 MODE = High / Low
Figure 7-14. Low Side Switch On Resistance vs
Temperature
Temperature (°C)
RDS(on) (m:)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
600
700
D041
TPS610986 MODE = High / Low
Figure 7-15. Rectifier on Resistance vs
Temperature
TPS610986 MODE = High / Low
Figure 7-16. Low Side Switch on Resistance vs
Temperature
TPS61098x VIN < V(MAIN)
Figure 7-17. Current Limit vs Temperature
TPS61098, '7 MODE = Low V(MAIN) = 2.2 V
Figure 7-18. Boost Efficiency vs Output Current
(Low Power Mode)
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Boost Output Current (mA)
Boost Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10
D007
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.5 V
VIN = 3 V
VIN = 3.6 V
VIN = 4.3 V
TPS61098, '7 MODE = High V(MAIN) = 4.3 V
Figure 7-19. Boost Efficiency vs Output Current
(Active Mode)
TPS610981 MODE = Low V(MAIN) = 3.3 V
Figure 7-20. Boost Efficiency vs Output Current
(Low Power Mode)
Boost Output Current (mA)
Boost Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10 200
D009
VIN = 0.7 V
VIN = 1.2 V
VIN = 2 V
VIN = 3 V
TPS610981 MODE = High V(MAIN) = 3.3 V
Figure 7-21. Boost Efficiency vs Output Current
(Active Mode)
TPS610982 MODE = Low V(MAIN) = 3.3 V
Figure 7-22. Boost Efficiency vs Output Current
(Low Power Mode)
TPS610982 MODE = High V(MAIN) = 3.3 V
Figure 7-23. Boost Efficiency vs Output Current
(Active Mode)
Boost Output Current (mA)
Boost Efficiency (%)
20
30
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10 200
D043
VIN = 0.7 V
VIN = 1.2 V
VIN = 2 V
VIN = 2.5 V
TPS610985 Mode = Low V(MAIN) = 3 V
Figure 7-24. Boost Efficiency vs Output Current
(Low Power Mode)
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TEXAS INSTRUMENTS mu mu mu
Boost Output Current (mA)
Boost Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10 200
D044
VIN = 0.7 V
VIN = 1.2 V
VIN = 2 V
VIN = 2.5 V
TPS610985 Mode = High V(MAIN) = 3 V
Figure 7-25. Boost Efficiency vs Output Current
(Active Mode)
TPS610986 Mode = Low V(MAIN) = 3.3 V
Figure 7-26. Boost Efficiency vs Output Current
(Low Power Mode)
TPS610986 MODE = High V(MAIN) = 3.3 V
Figure 7-27. Boost Efficiency vs Output Current
(Active Mode)
Boost Output Current (mA)
Boost Output Voltage (V)
1.9
2
2.1
2.2
2.3
2.4
2.5
0.001 0.01 0.1 1 10 100
D010
VIN = 0.7 V
VIN = 1.2 V
VIN = 2 V
TPS61098, '7 MODE = Low V(MAIN) = 2.2 V
Figure 7-28. Boost Load Regulation (Low Power
Mode)
Boost Output Current (mA)
Boost Output Voltage (V)
4
4.1
4.2
4.3
4.4
4.5
4.6
0.001 0.01 0.1 1 10 200
D011
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.5 V
VIN = 3 V
VIN = 3.6 V
VIN = 4.3 V
TPS61098, '7 MODE = High V(MAIN) = 4.3 V
Figure 7-29. Boost Load Regulation (Active Mode)
Boost Output Current (mA)
Boost Output Voltage (V)
3
3.1
3.2
3.3
3.4
3.5
3.6
0.001 0.01 0.1 1 10 200
VIN = 0.7 V
VIN = 1.2 V
VIN = 2 V
VIN = 3 V
TPS610981 MODE = Low V(MAIN) = 3.3 V
Figure 7-30. Boost Load Regulation (Low Power
Mode)
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TEXAS INSTRUMENTS
Boost Output Current (mA)
Boost Output Voltage (V)
3
3.1
3.2
3.3
3.4
3.5
3.6
0.001 0.01 0.1 1 10 200
D013
VIN = 0.7 V
VIN = 1.2 V
VIN = 2 V
VIN = 3 V
TPS610981 MODE = High V(MAIN) = 3.3 V
Figure 7-31. Boost Load Regulation (Active Mode)
Boost Output Current (mA)
Boost Output Voltage (V)
3
3.1
3.2
3.3
3.4
3.5
3.6
0.001 0.01 0.1 1 10 200
D027
VIN = 0.7 V
VIN = 1.2 V
VIN = 2 V
VIN = 3 V
TPS610982 MODE = Low V(MAIN) = 3.3 V
Figure 7-32. Boost Load Regulation (Low Power
Mode)
Boost Output Current (mA)
Boost Output Voltage (V)
3
3.1
3.2
3.3
3.4
3.5
3.6
0.001 0.01 0.1 1 10 200
D028
VIN = 0.7 V
VIN = 1.2 V
VIN = 2 V
VIN = 3 V
TPS610982 MODE = High V(MAIN) = 3.3 V
Figure 7-33. Boost Load Regulation (Active Mode)
Boost Output Current (mA)
Boost Output Voltage (V)
2.7
2.8
2.9
3
3.1
3.2
3.3
0.001 0.01 0.1 1 10 200
D047
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.5 V
VIN = 2.5 V
TPS610985 MODE = Low V(MAIN) = 3 V
Figure 7-34. Boost Load Regulation (Low Power
Mode)
Boost Output Current (mA)
Boost Output Voltage (V)
2.7
2.8
2.9
3
3.1
3.2
3.3
0.001 0.01 0.1 1 10 200
D048
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.5 V
VIN = 2.5 V
TPS610985 MODE = High V(MAIN) = 3 V
Figure 7-35. Boost Load Regulation (Active Mode)
Boost Output Current (mA)
Boost Output Voltage (V)
3
3.1
3.2
3.3
3.4
3.5
3.6
0.001 0.01 0.1 1 10 200
D049
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.5 V
VIN = 3 V
TPS610986 MODE = Low V(MAIN) = 3.3 V
Figure 7-36. Boost Load Regulation (Low Power
Mode)
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TEXAS INSTRUMENTS «no 286 286
Boost Output Current (mA)
Boost Output Voltage (V)
3
3.1
3.2
3.3
3.4
3.5
3.6
0.001 0.01 0.1 1 10 200
D050
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.5 V
VIN = 3 V
TPS610986 MODE = High V(MAIN) = 3.3 V
Figure 7-37. Boost Load Regulation (Active Mode)
LDO Output Current (mA)
LDO Output Voltage (V)
3.04
3.06
3.08
3.1
3.12
3.14
3.16
0.001 0.01 0.1 1 10 200
D014
TA = -40qC
TA = 25qC
TA = 85qC
TPS61098, '7 MODE = High VIN = 3.6 V
Figure 7-38. LDO Load Regulation
LDO Output Current (mA)
LDO Output Voltage (V)
2.94
2.96
2.98
3
3.02
3.04
3.06
0.001 0.01 0.1 1 10 200
D015
TA = -40qC
TA = 25qC
TA = 85qC
TPS610981 MODE = High VIN = 2.5 V
Figure 7-39. LDO Load Regulation
LDO Output Current (mA)
LDO Output Voltage (V)
2.7
2.72
2.74
2.76
2.78
2.8
2.82
2.84
2.86
0.001 0.01 0.1 1 10 200
D029
TA = -40°C
TA = 25°C
TA = 85°C
TPS610982 MODE = Low VIN = 2.5 V
Figure 7-40. LDO Load Regulation (Low Power
Mode)
LDO Output Current (mA)
LDO Output Voltage (V)
2.7
2.72
2.74
2.76
2.78
2.8
2.82
2.84
2.86
0.001 0.01 0.1 1 10 200
D030
TA = -40qC
TA = 25qC
TA = 85qC
TPS610982 MODE = High VIN = 2.5 V
Figure 7-41. LDO Load Regulation (Active Mode)
Input Voltage (V)
Input Current (µA)
0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
D016
TA = -40qC
TA = 25qC
TA = 85qC
TPS61098, '7 MODE = Low No Load
Figure 7-42. Input Current vs Input Voltage (Low
Power Mode)
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TEXAS INSTRUMENTS 1&0 16!)
Input Voltage (V)
Input Current (µA)
0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3
0
1
2
3
4
5
6
7
8
9
10
D017
TA = -40qC
TA = 25qC
TA = 85qC
TPS610981 MODE = Low No Load
Figure 7-43. Input Current vs Input Voltage (Low
Power Mode)
TPS610981 MODE = High No Load
Figure 7-44. Input Current vs Input Voltage (Active
Mode)
Input Voltage (V)
Input Current (µA)
0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3
0
10
20
30
40
50
60
D031
TA = -40°C
TA = 25°C
TA = 85°C
TPS610982 MODE = Low No Load
Figure 7-45. No Load Input Current vs Input
Voltage (Low Power Mode)
TPS610982 MODE = High No Load
Figure 7-46. No Load Input Current vs Input
Voltage (Active Mode)
Input Voltage (V)
Input Current (µA)
0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9
0
1
2
3
4
5
6
7
8
9
10
D051
TA = -40°C
TA = 25°C
TA = 85°C
TPS610985 MODE = Low V(MAIN) = 3 V
Figure 7-47. Input Current vs Input Voltage (Low
Power Mode)
Input Voltage (V)
Input Current (µA)
0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3
0
1
2
3
4
5
6
7
8
9
10
D053
TA = -40°C
TA = 25°C
TA = 85°C
TPS610986 MODE = Low V(MAIN) = 3.3 V
Figure 7-48. Input Current vs Input Voltage (Low
Power Mode)
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I TEXAS INSTRUMENTS mu mu NM w l \
Frequency (Hz)
PSRR (dB)
0
20
40
60
80
100
10 100 1k 10k 100k 1M 10M
D019
IOUT = 10 mA
IOUT = 100 mA
TPS61098. '7 MODE = High CO2 = 10 µF
VIN - VOUT = 4.3 V - 3.1 V = 1.2 V
Figure 7-49. LDO PSRR vs Frequency
Frequency (Hz)
PSRR (dB)
0
20
40
60
80
100
10 100 1k 10k 100k 1M 10M
D020
IOUT = 10 mA
IOUT = 100 mA
TPS610981 MODE = High CO2 = 10 µF
VIN - VOUT = 3.3 V - 3 V = 0.3 V
Figure 7-50. LDO PSRR vs Frequency
Frequency (Hz)
PSRR (dB)
0
10
20
30
40
50
60
10 100 1k 10k 100k 1M 10M
D033
IOUT = 10 mA
IOUT = 100 mA
TPS610982 MODE = Low CO2 = 10 µF
VIN - VOUT = 3.3 V - 2.8 V = 0.5 V
Figure 7-51. LDO PSRR vs Frequency (Low Power
Mode)
Frequency (Hz)
PSRR (dB)
0
10
20
30
40
50
60
70
80
10 100 1k 10k 100k 1M 10M
D034
IOUT = 10 mA
IOUT = 100 mA
TPS610982 MODE = High CO2 = 10 µF
VIN - VOUT = 3.3 V - 2.8 V = 0.5 V
Figure 7-52. LDO PSRR vs Frequency (Active
Mode)
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I TEXAS INSTRUMENTS LJ F7 l_l 2
8 Detailed Description
8.1 Overview
The TPS61098x is an ultra-low power solution optimized for products powered by either a one-cell or two-cell
alkaline, NiCd or NiMH, one-cell coin cell battery or one-cell Li-Ion or Li-polymer battery. To simplify system
design and save PCB space, the TPS61098x integrates an LDO or load switch with a boost converter (different
configurations for different versions) to provide two output rails in a compact package. The boost output V(MAIN)
is designed as an always-on supply to power a main system, and the LDO or load switch output V(SUB) is
designed to power peripheral devices and can be turned off.
The TPS61098x features two modes controlled by MODE pin: Active mode and Low Power mode. In Active
mode, both outputs are enabled, and the transient response performance of the boost converter and LDO/load
switch are enhanced, so it is able to respond load transient quickly. In Low Power mode, the LDO/load switch
is disabled, so the peripherals can be disconnected to minimize the battery drain. Besides that, the boost
consumes only 300 nA quiescent current in Low Power mode, so up to 88% efficiency at 10 µA load can be
achieved to extend the battery run time. The TPS610982 is an exception. Its LDO is always on in both Active
mode and Low Power mode. The main differences between the two modes of the TPS610982 are the quiescent
current and performance. Refer to Section 8.4.1 for details.
The TPS61098x supports automatic pass-through function in both Active mode and Low Power mode. When VIN
is detected higher than a pass-through threshold, which is around the target V(MAIN) voltage, the boost converter
stops switching and passes the input voltage through inductor and internal rectifier switch to V(MAIN), so V(MAIN)
follows VIN; when VIN is lower than the threshold, the boost works in boost mode and regulates V(MAIN) at the
target value. The TPS61098x can support different V(MAIN) target values in Active mode and Low Power mode to
meet various requirements. For example, for TPS61098, the set value of V(MAIN) is 4.3 V in Active mode but 2.2
V in Low Power mode.
8.2 Functional Block Diagrams
Current
Sense
Boost
Gate Driver
Pulse
Modulator
12
3
Logic
Control
4
REF
SW
MODE
VMAIN
VIN
6GND
Startup
Thermal
Shutdown
5
VREF
LDO/Load Switch
Gate Driver
VSUB
1) LDO Version
ILIM_SUB
OCP_SUB
Pass_Through
VPSTH
OCP
Softstart
Copyright © 2016, Texas Instruments Incorporated
A. Implemented in versions with LDO configuration.
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NSTRUMENTS
8.3 Feature Description
8.3.1 Boost Controller Operation
The TPS61098x boost converter is controlled by a hysteretic current mode controller. This controller regulates
the output voltage by keeping the inductor ripple current constant in the range of 100 mA and adjusting the
offset of this inductor current depending on the output load. Since the input voltage, output voltage and inductor
value all affect the rising and falling slopes of inductor ripple current, the switching frequency is not fixed and
is decided by the operation condition. If the required average input current is lower than the average inductor
current defined by this constant ripple, the inductor current goes discontinuous to keep the efficiency high under
light load conditions. Figure 8-1 illustrates the hysteretic current operation. If the load is reduced further, the
boost converter enters into Burst mode. In Burst mode, the boost converter ramps up the output voltage with
several pulses and it stops operating once the output voltage exceeds a set threshold, and then it goes into a
sleep status and consumes less quiescent current. It resumes switching when the output voltage is below the
set threshold. It exits the Burst mode when the output current can no longer be supported in this mode. Refer to
Figure 8-2 for Burst mode operation details.
To achieve high efficiency, the power stage is realized as a synchronous boost topology. The output voltage
V(MAIN) is monitored via an internal feedback network which is connected to the voltage error amplifier. To
regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly.
Continuous Current Operation
100mA
(typ.)
100mA
(typ.)
Discontinuous Current Operation
IL
t
Figure 8-1. Hysteretic Current Operation
Continuous Current Operation at
Heavy Load
Burst Mode Operation at
Light Load
Output Voltage of
Boost Converter
t
VOUT_NOM
VOUT_BST
Figure 8-2. Burst Mode Operation
8.3.2 Pass-Through Operation
The TPS61098x supports automatic pass-through function for the boost converter. When the input voltage is
detected higher than the pass-through threshold V(PSTH), which is around V(MAIN) set value, the boost converter
enters into pass-through operation mode. In this mode, the boost converter stops switching, the rectifier is
constantly turned on and the low side switch is turned off. The input voltage passes through external inductor
and the internal rectifier to the output. The output voltage in this mode depends on the resistance between the
input and the output, calculated as Equation 1:
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I TEXAS INSTRUMENTS VMAIN VIN (IMAIN ISLE) (RL RDSonJ—is) VSUB : VMAIN ’ISUE X RLS
)RR()II(VV HS_DSonLSUBMAININMAIN u
(1)
where
• RL is the DCR of external inductor
• RDS(on)_HS is the resistance of internal rectifier
When the input voltage is lower than V(PSTH), the boost converter resumes switching to regulate the output at
target value.
The TPS61098x can support automatic pass-through function in both Active mode and Low Power mode.
8.3.3 LDO / Load Switch Operation
The TPS61098x uses a PMOS as a pass element of its integrated LDO / load switch. The input of the PMOS is
connected to the output of the boost converter. When the MODE pin is pulled logic high, the PMOS is enabled to
output a voltage on VSUB pin.
For load switch version, the PMOS pass element is fully turned on when enabled, no matter the boost converter
works in boost operation mode or pass-through operation mode. So the output voltage at VSUB pin is decided
by the output voltage at VMAIN pin and the current passing through the PMOS as Equation 2:
LSSUBMAINSUB RIVV u
(2)
where
• I(SUB) is the load of VSUB rail
• RLS is the resistance of the PMOS when it is fully turned on
For LDO version, the output voltage V(SUB) is regulated at the set value when the voltage difference between
its input and output is higher than the dropout voltage V(Dropout), no matter the boost converter works in boost
operation mode or pass-through operation mode. The V(SUB) is monitored via an internal feedback network
which is connected to the voltage error amplifier. To regulate V(SUB), the voltage error amplifier compares the
feedback voltage to the internal voltage reference and adjusts the gate voltage of the PMOS accordingly. When
the voltage drop across the PMOS is lower than the dropout voltage, the PMOS will be fully turned on and the
output voltage at V(SUB) is decided by Equation 2.
When the MODE pin is pulled low, the LDO or load switch is turned off to disconnect the load at VSUB pin.
For some versions, active discharge function at VSUB pin is offered, which can discharge the V(SUB) to ground
after MODE pin is pulled low, to avoid any bias condition to downstream devices. For versions without the active
discharge function, the VSUB pin is floating after MODE pin is pulled low, and its voltage normally drops down
slowly due to leakage. Refer to the Section 5 for version differences.
When MODE pin is toggled from low to high, soft-start is implemented for the LDO versions to avoid inrush
current during LDO startup. The start up time of LDO is typically 1 ms. For load switch versions, the load switch
is turned on faster, so the output capacitor at VSUB pin is suggested 10X smaller than the output capacitor at
VMAIN pin to avoid obvious voltage drop of V(MAIN) during load switch turning on process.
8.3.4 Start Up and Power Down
The boost converter of the TPS61098x is designed always-on, so there is no enable or disable control of it.
The boost converter starts operation once input voltage is applied. If the input voltage is not high enough, a
low voltage startup oscillator operates the switches first. During this phase, the switching frequency is controlled
by the oscillator, and the maximum switch current is limited. Once the converter has built up the output voltage
V(MAIN) to approximately 1.8 V, the device switches to the normal hysteretic current mode operation and the
VMAIN rail starts to supply the internal control circuit. If the input voltage is too low or the load during startup is
too heavy, which makes the converter unable to build up 1.8 V at V(MAIN) rail, the boost converter can't start up
successfully. It will keep in this status until the input voltage is increased or removed.
The TPS61098x is able to startup with 0.7 V input voltage with ≥ 3 kΩ load. The startup time depends on
input voltage and load conditions. After the V(MAIN) reaches 1.8 V to start the normal hysteretic current mode
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I TEXAS INSTRUMENTS
operation, an internal ramp-up reference controls soft-start time of the boost converter until V(MAIN) reaches its
set value.
The TPS61098x does not support undervoltage lockout function. When the input voltage drops to a low voltage
and can't provide the required energy to the boost converter, the V(MAIN) drops. When and to what extent V(MAIN)
drops are dependent on the input and load conditions. When the boost converter is unable to maintain 1.8 V at
VMAIN rail to supply the internal circuit, the TPS61098x powers down and enters into startup process again.
8.3.5 Over Load Protection
The boost converter of the TPS61098x supports a cycle-by-cycle current limit function in boost mode operation.
If the peak inductor current reaches the internal switch current limit threshold, the main switch is turned off to
stop a further increase of the input current. In this case the output voltage will decrease since the device cannot
provide sufficient power to maintain the set output voltage. If the output voltage drops below the input voltage,
the backgate diode of the rectifying switch gets forward biased and current starts to flow through it. Because this
diode cannot be turned off, the load current is only limited by the remaining DC resistance. After the overload
condition is removed, the converter automatically resumes normal operation.
The overload protection is not active in pass-through mode operation, in which the load current is only limited by
the DC resistance.
The integrated LDO / load switch also supports over load protection. When the load current of VSUB rail reaches
the ILIM_SUB, the V(SUB) output current will be regulated at this limit value and will not increase further. In this case
the V(SUB) voltage will decrease since the device cannot provide sufficient power to the load.
8.3.6 Thermal Shutdown
The TPS61098x has a built-in temperature sensor which monitors the internal junction temperature in boost
mode operation. If the junction temperature exceeds the threshold (150°C typical), the device stops operating.
As soon as the junction temperature has decreased below the programmed threshold with a hysteresis, it starts
operating again. There is a built-in hysteresis (25°C typical) to avoid unstable operation at the overtemperature
threshold. The over temperature protection is not active in pass-through mode operation.
8.4 Device Functional Modes
8.4.1 Operation Modes by MODE Pin
The TPS61098x features two operation modes controlled by MODE pin: the Active mode and Low Power mode.
It can provide quick transient response in Active mode and ultra-low quiescent current in Low Power mode. So
a low power system can easily use the TPS61098x to get high performance in its active mode and meantime
minimize its power consumption to extend the battery run time in its sleep mode.
The MODE pin is usually controlled by an I/O pin of a controller, and should not be left floating.
8.4.1.1 Active Mode
The TPS61098x works in Active mode when MODE pin is logic high. In Active mode, both of the boost
converter and the integrated LDO/load switch are enabled, and the TPS61098x can provide dual outputs
simultaneously. The transient response performance of the boost converter is enhanced in Active mode, and the
device consumes around 15 µA quiescent current. It is able to respond load transient quickly.
When MODE pin is toggled from low to high, soft-start is implemented for the LDO versions to avoid inrush
current during startup. For load switch versions, the load switch is turned on faster, so the output capacitor at
VSUB pin is suggested 10X smaller than the output capacitor at VMAIN pin to avoid obvious voltage drop of
V(MAIN) during turning on process.
8.4.1.2 Low Power Mode
The TPS61098x works in Low Power mode when MODE pin is logic low. In Low Power mode, the LDO/load
switch is turned off, so the peripherals can be disconnected to minimize the battery drain. The VSUB pin
either outputs high impedance or is pulled to ground by internal active discharge circuit, depending on different
versions. The boost converter consumes only 300 nA quiescent current typically, and can achieve up to 88%
efficiency at 10 µA load.
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I TEXAS INSTRUMENTS vW W W». (Active Mode vuw (Amive Made a Power Mode)
The Low Power mode is designed to keep the load device powered with minimum power consumption. For
example, it can be used to keep powering the main system, like an MCU, in a system's sleep mode even under
< 0.7 V input voltage condition.
Figure 8-3 and Figure 8-4 illustrate the outputs of the TPS61098 and TPS610981 under different input voltages
in Active mode and Low Power mode.
VMAIN (Active Mode)
4.3
4.5
t
0.7
2.2
0
Voltage (V)
VIN
VMAIN (Low Power Mode)
3.1
VSUB (Active Mode)
Figure 8-3. TPS61098 Output under Different Input
Voltages
VMAIN (Active Mode & Low
Power Mode)
3.3
4.5
t
0.7
2.2
0
Voltage (V)
VIN
3.0 VSUB (Active Mode)
Figure 8-4. TPS610981 Output under Different
Input Voltages
The TPS610982 is an exception. Its LDO is always on in both Active mode and Low Power mode with higher
quiescent current consumption than other versions. The TPS610982 can be used to replace discrete boost and
LDO solutions where the LDO output is always on, and its two modes provide users two options of different
quiescent current consumption and performance. Refer to Section 8.4.1, Section 7 and Section 7.6 for details.
8.4.2 Burst Mode Operation under Light Load Condition
The boost converter of TPS61098x enters into Burst Mode operation under light load condition. Refer to Section
8.3.1 for details.
8.4.3 Pass-Through Mode Operation
The boost converter of TPS61098x automatically enters into pass-through mode operation when input voltage is
higher than the target output voltage. Refer to Section 8.3.2 for details.
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9 Applications and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and
TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
9.1 Application Information
The TPS61098x is an ultra low power solution for products powered by either a one-cell or two-cell alkaline,
NiCd or NiMH, one-cell coin cell or one-cell Li-Ion or Li-polymer battery. It integrates either a Low-dropout Linear
Regulator (LDO) or a load switch with a boost converter and provides dual output rails. The V(MAIN) rail is the
output of the boost converter. It is an always-on output and can only be turned off by removing input voltage. The
V(SUB) rail is the output of the integrated LDO or load switch, and it can be turned off by pulling the MODE pin
low.
9.2 Typical Applications
9.2.1 VMAIN to Power MCU and VSUB to Power Subsystem
The TPS61098x suits for low power systems very well, especially for the system which spends the most of time
in sleep mode and wakes up periodically to sense or transmit signals. For this kind of application, the boost
output V(MAIN) can be used as an always-on supply for the main system, such as an MCU controller, and the
LDO or load switch output V(SUB) is used to power peripheral devices or subsystem.
As shown in Figure 9-1, the MCU can control both of the subsystem and the TPS61098x. When the system
goes into sleep mode, the MCU can disable the subsystem first, and then force the TPS61098x enter into Low
Power mode, where the VSUB rail is disconnected but the V(MAIN) rail still powers the MCU with only 300 nA
quiescent current. When the system wakes up, the MCU pulls the MODE pin of TPS61098x high first to turn
on the VSUB rail, and then enables the subsystem. In this way, the system can benefit both of the enhanced
transient response performance in active mode and the ultra-low quiescent current in sleep mode.
SW
MODE
VMAIN
VSUB
VIN
CBAT
10µF
CO2
10µF
CO1
10µF
BOOST
CTRL
LDO
CTRL
GND
CIN
0.1µF
RIN
400
MCU
Subsystem
3.3 V
3.0 V
0.7 V to 1.65 V
L
4.7µH
Copyright © 2016, Texas Instruments Incorporated
Figure 9-1. Typical Application of TPS610981 to Power Low Power System
9.2.1.1 Design Requirements
• 3.3 V V(MAIN) rail to power MCU with 15 mA load current, 3 V V(SUB) rail to power subsystem with 10 mA load
current
• Power source, single-cell alkaline battery (0.7 V to 1.65 V range)
• Greater than 90% conversion efficiency
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9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Device Choice
In the TPS61098x family, different versions are provided. Refer to Section 5 for version details and select the
right version for target applications. It is OK to use only one output rail, either V(MAIN) or V(BUS), as long as it suits
the application.
In this example, dual rails of 3.3 V and 3 V are required to power both MCU and subsystem, so the TPS610981
is selected.
9.2.1.2.2 Maximum Output Current
For the boost converter, it provides output current for both V(MAIN) and V(SUB) rails. Its maximum output capability
is determined by the input to output ratio and the current limit of the boost converter and can be estimated by
Equation 3.
MAIN
BST_LIMIN
(max)OUT V
)mA50I(V
IKuu
(3)
where
• η is the boost converter power efficiency estimation
• 50 mA is half of the inductor current ripple value
Minimum input voltage, maximum boost output voltage and minimum current limit ILIM_BST should be used as the
worst case condition for the estimation.
Internal current limit is also implemented for the integrated LDO/load switch. So the maximum output current of
VSUB rail should be lower than ILIM_SUB, which has 200 mA minimum value. For LDO version, the maximum
output current is also limited by its input to output headroom, that is V(MAIN) - V(SUB). Make sure the headroom
voltage is enough to support the load current. Please refer to Section 7.5 for the dropout voltage information.
In this example, assume the power efficiency is 80% (lower than typical value for the worst case estimation),
so the calculated maximum output current of the boost converter is 50.9 mA, which satisfies the application
requirements (15 mA + 10 mA). The load of VSUB rail is 10 mA, which is well below the V(SUB) rail current limit
and the dropout voltage is also within the headroom.
9.2.1.2.3 Inductor Selection
Because the selection of the inductor affects steady state operation, transient behavior, and loop stability,
the inductor is the most important component in power regulator design. There are three important inductor
specifications, inductor value, saturation current, and dc resistance (DCR).
The TPS61098x is designed to work with inductor values between 2.2 µH and 4.7 µH. The inductance values
affects the switching frequency ƒ in continuous current operation, which is proportional to 1/L as shown in
Equation 4.
MAIN
INMAININ
V
)VV(V
mA100L
1
fKuu
u
u
(4)
The inductor current ripple is fixed to 100mA typical value by internal design, but it can be affected by the
inductor value indirectly. Normally when a smaller inductor value is applied, the inductor current ramps up and
down more quickly, so the current ripple becomes bigger because the internal current comparator has some
delay to respond. So if smaller inductor peak current is required in applications, a higher inductor value can be
tried. However, the TPS61098x is optimized to work within a range of L and C combinations. The LC output
filter inductance and capacitance must be considered together. The output capacitor sets the corner frequency
of the converter while the inductor creates a Right-Half-Plane-Zero degrading the stability of the converter.
Consequently with a larger inductor, a bigger capacitor normally should be used to ensure the same L/C ratio
thus a stable loop.
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I TEXAS INSTRUMENTS IL‘MAX mA operation
Having selected an inductance value, the peak current for the inductor in steady-state operation varies as a
function of the load, the input and output voltages and can be estimated using Equation 5.
operation current ousdiscontinu ;mA100I
operation current continuous ;mA50
V
IIV
I
MAX,L
IN
SUBMAINMAIN
MAX,L
Ku
u
(5)
where, 80% can be used for the boost converter power efficiency estimation, 100 mA is the typical inductor
current ripple value and 50mA is half of the ripple value, which may be affected a little bit by inductor value.
Equation 5 provides a suitable inductor current rating by using minimum input voltage, maximum boost output
voltage and maximum load current for the calculation. Load transients and error conditions may cause higher
inductor currents.
Equation 6 provides an easy way to estimate whether the device will work in continuous or discontinuous
operation depending on the operating points. As long as the Equation 6 is true, continuous operation is typically
established. If Equation 6 becomes false, discontinuous operation is typically established.
 
mA50
V
IIV
IN
SUBMAINMAIN !
Ku
u
(6)
Selecting an inductor with insufficient saturation performance can lead to excessive peak current in the
converter. This could eventually harm the device and reduce it's reliability.
In this example, the maximum load for the boost converter is 25 mA, and the minimum input voltage is 0.7 V,
and the efficiency under this condition can be estimated at 80%, so the boost converter works in continuous
operation by the calculation. The inductor peak current is calculated as 197 mA. To leave some margin, a 4.7 µH
inductor with at least 250 mA saturation current is recommended for this application.
Table 9-1 also lists the recommended inductor for the TPS61098x device.
Table 9-1. List of Inductors
INDUCTANCE [µH] ISAT [A] IRMS [A] DC RESISTANCE [mΩ] PART NUMBER MANUFACTURER
4.7 0.86 1.08 168 VLF302510MT-4R7M TDK
4.7 0.57 0.95 300 VLF252010MT-4R7M TDK
2.2 1.23 1.5 84 VLF302510MT-2R2M TDK
2.2 0.83 0.92 120 VLF252010MT-2R2M TDK
9.2.1.2.4 Capacitor Selection
For best output and input voltage filtering, low ESR X5R or X7R ceramic capacitors are recommended.
The input capacitor minimizes input voltage ripple, suppresses input voltage spikes and provides a stable system
rail for the device. An input capacitor value of at least 10 μF is recommended to improve transient behavior of
the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor placed as close as possible
to the VIN and GND pins of the IC is recommended. For applications where line transient is expected, an input
filter composed of 400-Ω resistor and 0.1-µF capacitor as shown in Figure 9-1 is mandatory to avoid interference
to internal pass-through threshold comparison circuitry.
For the output capacitor of VMAIN pin, small ceramic capacitors are recommended, placed as close as possible
to the VMAIN and GND pins of the IC. If, for any reason, the application requires the use of large capacitors
which cannot be placed close to the IC, the use of a small ceramic capacitor with a capacitance value of around
2.2 μF in parallel to the large one is recommended. This small capacitor should be placed as close as possible
to the VMAIN and GND pins of the IC. The recommended typical output capacitor values are 10 μF and 22 µF
(nominal values).
For LDO version, like all low dropout regulators, VSUB rail requires an output capacitor connected between
VSUB and GND pins to stabilize the internal control loop. Ceramic capacitor of 10 µF (nominal value) is
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recommended for most applications. If the V(SUB) drop during load transient is much cared, higher capacitance
value up to 22 µF is recommended to provide better load transient performance. Capacitor below 10 µF is only
recommended for light load operation. For load switch version, capacitor of 10x smaller value than capacitor at
VMAIN pin is recommended to minimize the voltage drop caused by charge sharing when the load switch is
turned on.
When selecting capacitors, ceramic capacitor’s derating effect under bias should be considered.
Choose the right nominal capacitance by checking capacitor's DC bias characteristics. In this example,
GRM188R60J106ME84D, which is a 10 µF ceramic capacitor with high effective capacitance value at DC biased
condition, is selected for both VMAIN and VSUB rails. The load transient response performance is shown in
Section 9.2.1.3.
For load switch version, VSUB rails requires an output capacitor connected between VSUB and GND pins.
Ceramic capacitor of 1 µF (nominal value) is recommended for most applications.
9.2.1.2.5 Control Sequence
In this example, the MCU is powered by the boost output V(MAIN) and the subsystem is powered by the LDO
V(SUB). MCU controls both of the TPS610981 and subsystem. The control sequence as shown in Figure 9-2 is
recommended.
Subsystem
Load
VMAIN
3.3V
3.0V
0V
VSUB
MODE
Logic
Low
Logic
High
System
status
Sleep Mode Active Mode
Figure 9-2. System Control Sequence
When the system is waking up, the MCU wakes up itself first, and it then pulls the MODE pin of TPS610981 to
high to turned on the V(SUB) rail. TPS610981 enters into Active mode and gets ready to provide power to the
subsystem. Then the MCU enables the subsystem.
When the system is entering into sleep mode, the MCU disables the subsystem first and then pulls the MODE
pin to low to turn off the V(SUB), so the subsystem is disconnected from the supply to minimize the current drain.
TPS610981 enters into Low Power mode and the VMAIN rail still powers the MCU with only 300 nA quiescent
current. The MCU enters into sleep mode itself finally.
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TEXAS INSTRUMENTS WW 74,77 vmm 10c nflsen 20 mV/dw mm Imunmr Currem mu mmw va“ ”WAN (DC omen IO mwmv memw Inductor Cunenl 100 mA/dw .“W .W mm mm" .mW .WW .W um um" .mW 4,7 MW figi VMNN 1pc arisen 2n mvmw ”W N’N’NWWWN’M \nducwr Currem mo mA/mv VMNN 10:: 911520 20 mwaw $$$$$®$ vsua (Dc aflse| m mV/dlv a H . M W . um um" . I W . M W . . . um" . I v W ‘W W ‘37 VMNN 10:: mm 20 mV/mv VWVNWWNJNW VMAIN (DC when 10 mV/dw wwwwmm ‘W vsus (DC mm 10 mV/dlv WWW um \nduclor Currem «no mA/dN vsua “as men n) mV/mv MWWww/wmmwww N‘Yl‘mudor Current mo mA/dw
9.2.1.3 Application Curves
TPS610981 I(MAIN) = 1 mA I(SUB) = 0 mA
MODE = L VIN = 1.5 V
Figure 9-3. Switching Waveforms
TPS610981 I(MAIN) = 10 mA I(SUB) = 0 mA
MODE = L VIN = 1.5 V
Figure 9-4. Switching Waveforms
TPS610981 I(MAIN) = 100 mA I(SUB) = 0 mA
MODE = L VIN = 1.5 V
Figure 9-5. Switching Waveforms
TPS610981 I(MAIN) = 0 mA I(SUB) = 1 mA
MODE = H VIN = 1.5 V
Figure 9-6. Switching Waveforms
TPS610981 I(MAIN) = 0 mA I(SUB) = 10 mA
MODE = H VIN = 1.5 V
Figure 9-7. Switching Waveforms
TPS610981 I(MAIN) = 0 mA I(SUB) = 100 mA
MODE = H VIN = 1.5V
Figure 9-8. Switching Waveforms
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TEXAS INSTRUMENTS vmm [DC mum) 2n mVMlv “MAX \‘ VMAIN (DC WEI) "I mVIfliv 1 1 1 1\1 1 1 1 1 1 VSUB (DC 0M“ 10 "WNW 1‘ 1 1 ‘ "‘“' 1 1 1 1 1 1 1 1 Inductor cum“ m "IN-1w Indum cumm mo mum mm 7 7 my. - mun VMAIN (3,3V olfsei) 200 mV/div VMAIN (no and) an "IV/div —————.___—J-—-—— M... vsu: (no cum) 1o mV/dlv Inducwr Cuvreni 100 mA/div IMAIN 20 mA/div Imumrcumm m mAIdiv “ ' W ‘ main... Hum. ‘11 I 3-... W ‘ ‘ 3.5.1.411.11 .1 _ 7.1.1 u VMAIN (3,311 oflse!) 2m mV/dlv VMA1N (3.3V offset) 200 mV/div W— 0M Vsua (3.0V offset) 500 "IV/div lnducmr Currem 100 mA/div lnducmr current 100 mva IMAIN 20 mA/div ISUB 20 mA/div "’ ”M“ 3TR.1.41.111153:";1..511 "’ ”M“ 3wm.411.111153:"é1m11
TPS610986 I(MAIN) = 0 mA I(SUB) = 1 mA
MODE = H VIN = 1.5V
Figure 9-9. Switching Waveforms
TPS610986 I(MAIN) = 0 mA I(SUB) = 10 mA
MODE = H VIN = 1.5V
Figure 9-10. Switching Waveforms
TPS610986 I(MAIN) = 0 mA I(SUB) = 100 mA
MODE = H VIN = 1.5V
Figure 9-11. Switching Waveforms
TPS610981 VIN = 2.5 V I(SUB) = 0 mA
MODE = L I(MAIN) = 0 mA to 50 mA, 5 µs rising/falling
edge
Figure 9-12. Load Transient Response
TPS610981 VIN = 2.5 V I(SUB) = 0 mA
MODE = H I(MAIN) = 0 mA to 50 mA, 5 µs rising/falling
edge
Figure 9-13. Load Transient Response
TPS610981 VIN = 2.5 V I(MAIN) = 0 mA
MODE = H I(SUB) = 0 mA to 50 mA, 5 µs rising/falling
edge
Figure 9-14. LDO Load Transient Response
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TEXAS INSTRUMENTS mm Mun VIN sun mvmw VMAIN (lav cum) to mV/dw W VIN 500 mV/drv VMAIN (lav omen 1o mV/dw W m m . Mm Mm AWN, \ ‘1 AWN, \ ‘1 WW 7 WW II .. VMAIN 13 3V affsek) 200 mV/div VSUB (3 0V olfset) 10 mV/dlv VMAIN 13.3v anseu 10 mV/div MW my. “human“ ’ 2 W \nducmr Current 200 mA/dw m- \MAIN 50 mA/div w mm mm": H mm :1 VMAIN (3,3V onset) 200 mV/dlv VSUB (3,0V olfset) 50 mV/div Dunn m Inducmr Cum-2m 200 mva Isua 50 mA/div w "M .isrrm. mm“ H mm It VMAIN 2 V/mv /—\ MW VIN 2 WW Mun Inductor Currem 100 mAldiv a.“ vsua 13 oflsell 10 "IV/div
TPS610981 I(MAIN) = 20 mA I(SUB) = 0 mA
MODE = L VIN = 2 V to 2.5 V, 10 µs rising/falling edge
Figure 9-15. Line Transient Response
TPS610981 I(MAIN) = 20 mA I(SUB) = 0 mA
MODE = H VIN = 2 V to 2.5 V, 10 µs rising/falling edge
Figure 9-16. Line Transient Response
TPS610981 I(MAIN) = 0 mA I(SUB) = 20 mA
MODE = H VIN = 2 V to 2.5 V, 10 µs rising/falling edge
Figure 9-17. Line Transient Response
TPS610981 VIN = 1.5 V I(SUB) = 0 mA
MODE = L I(MAIN) = 0 mA to 120 mA to 0 mA, ramp
up and down
Figure 9-18. Load Regulation
TPS610981 VIN = 1.5 V I(MAIN) = 0 mA
MODE = H I(SUB) = 0 mA to 120 mA to 0 mA, ramp
up and down
Figure 9-19. Load Regulation
TPS610981 I(MAIN) = 0 mA I(SUB) = 30 mA
MODE = H VIN = 0.7 V to 4.5 V, ramp up and down
Figure 9-20. Line Regulation
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Mum. ~ m . VMAIN 1 V/div _———___— VSUB 2 V/dw WW Wu. MODE 2 Vldiv mm. mm VMAIN 2 V/dw . mm VIN 500 mV/dw W _ Inducmr Cunem 200 mA/dlv swzwmv W—u nauwmj ~..n.,,.n,.u,m,H1 Wm Wm . n VMAINZV/dlv VMAIN 2 V/div M.“ W” VIN 1 V/div vln1vlnw . w w v. W...__J ‘ WM H1“ u” [m m.» lew mm, mm ‘1 1 mm mm. Hm 9mm»
TPS610981 R(MAIN) = 1 kΩ R(SUB) = open load
MODE pin toggling
Figure 9-21. Mode Toggling
TPS610981 R(MAIN) = 3 kΩ VIN = 0.7 V
MODE connected to GND
Figure 9-22. Startup
TPS610981 R(MAIN) = 1 kΩ R(SUB) = 1 kΩ
VIN = 1.5 V MODE connected to VMAIN
Figure 9-23. Startup
TPS610986 R(MAIN) = 1 kΩ R(SUB) = 1 kΩ
VIN = 1.5 V C(SUB) = 1 µF
MODE connected to VMAIN
Figure 9-24. Startup
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{5‘ TEXAS INSTRUMENTS iiL | iiL _,_
9.2.2 VMAIN to Power the System in Low Power Mode
If only one power supply is needed for the whole system, users can easily leave the VSUB pin float and only
use the VMAIN rail as the power supply. In this case, the TPS61098x functions as a standard boost converter.
If enhanced load transient performance is needed when the system works in Active mode, the controller can
control the MODE pin to switch the TPS61098x between the Active mode and Low Power mode. If the ultra-low
Iq is critical for the application, users can connect the MODE pin to GND so the TPS61098x keeps working in
Low Power mode with only 300 nA quiescent current. Below shows a typical application where the TPS61098 is
used in Low Power mode to generate 2.2 V with only 300 nA Iq to power the whole system.
SW
MODE
VMAIN
VSUB
VIN
CBAT
10µF
CO1
10µF
BOOST
CTRL
LDO
CTRL
GND
CIN
0.1µF
RIN
400
System
2.2 V
0.7 V to 1.65 V
L
4.7µH
Copyright © 2016, Texas Instruments Incorporated
Figure 9-25. Typical Application of TPS61098 VMAIN to Power the System in Low Power Mode
9.2.2.1 Design Requirements
• 2.2 V V(MAIN) to power the whole system
• Power source, single-cell alkaline battery (0.7 V to 1.65 V range)
• ≥ 80% conversion efficiency at 10 µA load
9.2.2.2 Detailed Design Procedure
Refer to Section 9.2.1.2 for the detailed design steps.
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Wm mm 7 u I V ‘ “mm N (2 2V onset) 50 mV/dw VIN 500 "Md“ W \nducmr Currem 100 mA/div m \MAIN 50 mix/aw __.J——"'T_ D. ‘ WW 5 WM WNW mm. mm H1 1 MM. "mm“. Hmwm ___..__/—\____ VMA‘N 12 2v onset in mvmw ; W n ; mm m m ., mm H1 I ‘m ; my. MW mm, VMAIN 1 vmw m...“
9.2.2.3 Application Curves
TPS61098 VIN = 1.5 V
MODE = L I(MAIN) = 50 mA to 100 mA, 5 µs rising/falling
edge
Figure 9-26. Load Transient Response
TPS61098 I(MAIN) = 100 mA I(SUB) = 0 mA
MODE = L VIN = 1.2 V to 1.8 V, 10 µs rising/falling
edge
Figure 9-27. Line Transient Response
TPS61098 R(MAIN) = 3 kΩ
MODE connected to GND VIN = 0.7 V
Figure 9-28. Startup
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L L H. iii. T :{E L L i
9.2.3 VSUB to Power the System in Active Mode
In some applications, the system controller can be powered by the battery directly, but a buck-boost or a boost
converter with an LDO is needed to provide a quiet power supply for a subsystem like a sensor. In this type
of application, the TPS61098x can be used to replace the discrete boost converter and the LDO, providing a
compact solution to simplify the system design and save the PCB space. The LDO can be turned on and off
by the MODE pin. When the MODE pin is pulled low, the LDO is turned off to disconnect the load, and the
TPS61098x also enters into Low Power mode to save power consumption. Figure 9-29 shows an application
where the VSUB of the TPS61098 is used to supply the 3.1 V for a sensor in a system. The boost converter of
the TPS61098 outputs 4.3 V and provides enough headroom for the LDO operation.
SW
MODE
VMAIN
VSUB
VIN
CBAT
10µF
CO2
10µF
CO1
10µF
BOOST
CTRL
LDO
CTRL
GND
CIN
0.1µF
RIN
400
Sensor
3.1 V
0.7 V to 1.65 V
L
4.7µH
Copyright © 2016, Texas Instruments Incorporated
Figure 9-29. Typical Application of TPS61098 VSUB to Power the System in Active Mode
9.2.3.1 Design Requirements
• 3.1 V rail to power a sensor
• Power source, single-cell li-ion battery (2.7 V to 4.3 V range)
9.2.3.2 Detailed Design Procedure
Refer to Section 9.2.1.2 for the detailed design steps.
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TPS61098, TPS610981, TPS610982, TPS610985, TPS610986, TPS610987
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I TEXAS INSTRUMENTS n VMAIN 1A.3V aflsel) soc mV/dlv LN VIN 50o mV/div VSUB (3.1V alfsel) 500 mV/div “Mm Induclol Cunenl 100 mA/dlv “la-W - VMA‘N (4 3V uflseD 20 "IV/div WM "“vsua (3 1v oflsel) w mV/dw .nwumnww, —-m_ w M VMAIN 13 3V uflsen 50 "IV/div VMAIN (13v offset) so mvlmv V‘N 550 '"V/dlv ' x ‘ V‘N sno mV/dlv ‘ —v-.-———-d —-———- r, m— .____. vsua (2 av may 10 mV/flw vsua (2 av Dflsel) 1o mV/dlv K K A. Mm V . gm, » . m » minw 533m . , A. Mm V . gm, » . m » $31.35me 533m . , u m: .. i fl 3112: .. i VMAIN (3 3v MW) in mV/dlv VMNN 4 av men so mV/dw vsua 12 av oflsel) 2m mV/mv vsua (2 av may 2m) mV/dw A u A —_ —— ISUB 50 MM“, ISUBSOmA/dw .._.___J |__..__.‘ ..____.J s...__.__.._ Imuuor current 200 mA/dlv Inaucwr cunem zoo mAldw
9.2.3.3 Application Curves
TPS61098 VIN = 3.6 V I(MAIN) = 0 mA
MODE = H I(SUB) = 0 mA to 50 mA , 5 µs rising/falling
edge
Figure 9-30. LDO Load Transient Response
TPS61098 I(MAIN) = 0 mA I(SUB) = 100 mA
MODE = H VIN = 2.7 V to 3.2 V, 5 µs rising/falling edge
Figure 9-31. Line Transient Response
TPS610982 I(MAIN) = 0 mA I(SUB) = 100 mA
MODE = L VIN = 2 V to 2.5 V, 10 µs rising/falling edge
Figure 9-32. Line Transient Response
TPS610982 I(MAIN) = 0 mA I(SUB) = 100 mA
MODE = H VIN = 2 V to 2.5 V, 10 µs rising/falling edge
Figure 9-33. Line Transient Response
TPS610982 VIN = 2.5 V I(MAIN) = 0 mA
MODE = L I(SUB) = 50 mA to 100 mA , 5 µs rising/falling
edge
Figure 9-34. LDO Load Transient Response
TPS610982 VIN = 2.5 V I(MAIN) = 0 mA
MODE = H I(SUB) = 50 mA to 100 mA , 5 µs rising/falling
edge
Figure 9-35. LDO Load Transient Response
TPS61098, TPS610981, TPS610982, TPS610985, TPS610986, TPS610987
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TEXAS INSTRUMENTS Mum. ~ m , VMAIN 1 V/d'w mm a M VMAIN 2 V/dw ‘ mum—— -——————- vsuazwdw VIN 2 V/flw ‘ Wm W um. vsuszvmw MODEZV/div . m— —— ‘ " swzwdw ‘ w— nwwmj nwmmj Wm Wm VMAIN 2 V/dw zd—v my...“ VIN 1 Vldw ‘ ‘ % A sw 2 Vldw My...“ vsUB 2 Vldw Em. VMAIN 2 wmv _._./ my...“ VIN 1 Vldw ‘ fink ‘ sw 2 Vldw \vau—‘l vsua 2 View mu. W" “. rum. WWW» ‘1’ M” mm ‘11 MN um“. Hm 9mm»
TPS61098 R(MAIN) = 10 kΩ R(SUB) = 3 kΩ
MODE pin toggling
Figure 9-36. MODE Toggling
TPS61098 R(MAIN) = 1 kΩ R(SUB) = 1 kΩ
MODE connected to VMAIN VIN = 3.6 V
Figure 9-37. Startup
TPS610982 R(MAIN) = 1 kΩ R(SUB) = 1 kΩ
MODE connected to GND VIN = 1.5 V
Figure 9-38. Startup
TPS610982 R(MAIN) = 1 kΩ R(SUB) = 1 kΩ
MODE connected to VMAIN VIN = 1.5 V
Figure 9-39. Startup
10 Power Supply Recommendations
The TPS61098x family is designed to operate from an input voltage supply range between 0.7 V to 4.5 V. The
power supply can be either a one-cell or two-cell alkaline, NiCd or NiMH, one-cell coin cell or one-cell Li-Ion or
Li-polymer battery. The input supply should be well regulated with the rating of TPS61098x.
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11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
11.2 Layout Example
The bottom layer is a large GND plane connected by vias.
VIN
SW
VMAIN
MODE
VSUB
GND
Top Layer
INPUT
GROUND GROUND
VMAIN
VSUBMODE
Figure 11-1. Layout
TPS61098, TPS610981, TPS610982, TPS610985, TPS610986, TPS610987
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I TEXAS INSTRUMENTS m
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Documentation Support
12.2.1 Related Documentation
• Texas Instruments, Performing Accurate PFM Mode Efficiency Measurements Application Report
• Texas Instruments, Accurately Measuring Efficiency Of Ultra Low-IQ Devices Technical Brief
• Texas Instruments, IQ: What It Is, What It Isn’t, And How To Use It Techanical Brief
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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TPS61098, TPS610981, TPS610982, TPS610985, TPS610986, TPS610987
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I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS610981DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 GM
TPS610981DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 GM
TPS610982DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 G8
TPS610982DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 G8
TPS610985DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 1G
TPS610985DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 1G
TPS610986DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 1H
TPS610986DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 1H
TPS610987DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 3X
TPS610987DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 3X
TPS61098DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 GL
TPS61098DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 GL
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I‘KO '«Pt» Reel DlameIer A0 Dimension designed to accommodate the component Width ED Dimension designed to accommodate the component Iength K0 Dimension designed to accommodate the component thickness 7 w Overau Width onhe carrier Iape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE QOODOOOO ,,,,,,,,,,, ‘ User DIreCIIDn 0' Feed SprockeI Hoies Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS610981DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS610981DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS610982DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS610982DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS610985DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS610985DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS610986DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS610986DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS610987DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS610987DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS61098DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TPS61098DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS610981DSER WSON DSE 6 3000 205.0 200.0 33.0
TPS610981DSET WSON DSE 6 250 205.0 200.0 33.0
TPS610982DSER WSON DSE 6 3000 205.0 200.0 33.0
TPS610982DSET WSON DSE 6 250 205.0 200.0 33.0
TPS610985DSER WSON DSE 6 3000 205.0 200.0 33.0
TPS610985DSET WSON DSE 6 250 205.0 200.0 33.0
TPS610986DSER WSON DSE 6 3000 205.0 200.0 33.0
TPS610986DSET WSON DSE 6 250 205.0 200.0 33.0
TPS610987DSER WSON DSE 6 3000 205.0 200.0 33.0
TPS610987DSET WSON DSE 6 250 205.0 200.0 33.0
TPS61098DSER WSON DSE 6 3000 205.0 200.0 33.0
TPS61098DSET WSON DSE 6 250 205.0 200.0 33.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
MECHANICAL DATA DSE (S—PDSO—N6) PLASTIC SMALL OUTLINE / PW I INDEX AREA 7;; 0,20 ¥EF F I I 0,05 a (A o p N o SEATING FLARE 4207810/A 03/06 NOTES: AII Ihco' cImcns'ons are In mIIrrcIcrs SmuII om‘nc MiLeac (50M package conflquuiIon Ihs package IS IeuciIree A R ’m drowmg 's snbjecI In change Wan ranae c D {I} TEXAS INSrRUMEm-s www.1i.com
www.ti.com
PACKAGE OUTLINE
C
0.05
0.00
5X 0.6
0.4
(0.2) TYP
0.8 MAX
6X 0.3
0.2
0.7
0.5
2X 1
4X 0.5
B1.55
1.45 A
1.55
1.45
WSON - 0.8 mm max heightDSE0006A
PLASTIC SMALL OUTLINE - NO LEAD
4220552/A 04/2021
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
34
6
0.1 C A B
0.05 C
PIN 1 ID
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
SCALE 6.000
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EXAMPLE BOARD LAYOUT
(0.8)
4X 0.5
(1.6)
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
6X (0.25)
(R0.05) TYP
5X (0.7)
WSON - 0.8 mm max heightDSE0006A
PLASTIC SMALL OUTLINE - NO LEAD
4220552/A 04/2021
PKG
1
34
6
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
PADS 1-3
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
PADS 4-6
NON SOLDER MASK
DEFINED
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EXAMPLE STENCIL DESIGN
(0.8) 5X (0.7)
4X (0.5)
(1.6)
6X (0.25)
(R0.05) TYP
WSON - 0.8 mm max heightDSE0006A
PLASTIC SMALL OUTLINE - NO LEAD
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:40X
PKG
1
34
6
SYMM
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