Alpha & Omega Semiconductor Inc. 的 SO8-EP1 Pkg Drawing 规格书
ALPHA & OMEGA Document No. 130—00088
SEMICONDUCTOR Version C
808_EP1 PACKAGE OUTLINE
Gauge plane
D0 0.2500
_. C
W
4 _
¢ 7' 4
N
111
W :
NEITE 5 1.1L
WW 5 mums 1\ 01111011110 mums 1x mums
VIIN NOVI MAX MIV \IOM VIAX
170 A 1.40 1 55, 1.70 0 055 0,051 0 007
41 0.00 0 05 0 10 0.000 0.002 0 004
1 AZ 140 1 50 1.00 0 055 0 050 0 003
8 H, H 0 031 0401» 051 0012 0010 0020
N 1 LJ 6 017 WW 0.25 0.007 WW 0 010
‘ 1: 4 00 4.96 5.00 0.139 0195 0197
E DU 3.20 3 40 3.00 0.120 0.134 0142
1 D1 310 330 3.50 0.122 0130 0.130
E 5.80 0 00 6.20 0.220 0 230 0 244
I c 1 27 WW WW 0 050 W
1 K 5 E1 3 80 390 4.00 0.150 0,153 0,157
—— — ‘— — — N ’\. 1—12 2.21 241 2.01 0.027 0095 0.103
“'3 1.3 0.40 REF 0.016 REF
1 L 040 0.95 127 0010 0037 0050
I?) ‘ 3, WW 7’ [1 III 77 7, (I ""4
N~ 0 0» 3° 11“ 0“ 3= x»
127 1 ILIVLI'I 7* 004 0.12 WW 0002 0005
M» ‘ H} {3| L1 104REF 004mg:
I 0.80
0.535
NOTE UNIT: mm
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND
GATE BURRS
2. DIMENSION L IS MEASURED I,\I GAGE PLANE
3. TOLERANCE 0.10 mm UNLESS OTHERWISE SPECIFIED
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED
INCH DIMENSIONS ARE NOT NECESSARILY EXACT.
5. DIE PAD EXPOSURE SIZE IS ACCORDING TO LEAD FRAME
DESIGN.
6. FOLLOWED FROM JEDEC MSWOIZ