Analog Devices Inc. 的 20-TSSOP Pkg Drawing 规格书

COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX 0.20
0.09 0.75
0.60
0.45
8°
0°
COPLANARITY
0.10
a20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters