Vishay Beyschlag/Draloric/BC Components 的 MMA0204, MMB0207 HV-Professional 规格书

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MMA 0204 HV, MMB 0207 HV - Professional
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Professional High-Voltage Thin Film MELF Resistors
MMA 0204 HV and MMB 0207 HV professional thin film
MELF resistors are the perfect choice for most fields of
modern professional electronics where reliability and
stability are of major concern. The devices' typical
applications in the fields of lighting and medical equipment
reflect the outstanding level of proven reliability.
FEATURES
• High operating voltage, Umax. = 1000 V
• Advanced metal film technology
• Intrinsic sulfur resistance
• Excellent pulse load capability
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Lighting
• Industrial
• Medical equipment
Note
(1) Please refer to APPLICATION INFORMATION below
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
TECHNICAL SPECIFICATIONS
DESCRIPTION MMA 0204 HV MMB 0207 HV
DIN size 0204 0207
Metric size code RC3715M RC6123M
Resistance range 340 k to 10 M340 k to 10 M
Resistance tolerance ± 1 % ± 1 %
Temperature coefficient ± 50 ppm/K ± 50 ppm/K
Voltage coefficient |c| < 2 ppm/V < 2 ppm/V
Rated dissipation, P70 (1) 0.4 W 1.0 W
Operating voltage, Umax. ACRMS/DC 500 V 1000 V
Permissible film temperature,
F max. (1) 155 °C
Operating temperature range (1) -55 °C to 155 °C -55 °C to 155 °C
Permissible voltage against ambient
(insulation):
1 min, Uins 300 V 500 V
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Note
• The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to
different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the
circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please
consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for
information on the general nature of thermal resistance
Note
• Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE STANDARD POWER
Rated dissipation, P70
MMA 0204 HV 0.25 W 0.4 W
MMB 0207 HV 0.4 W 1.0 W
Operating temperature range -55 °C to 125 °C -55 °C to 155 °C
Permissible film temperature,
F max. 125 °C 155 °C
Max. resistance change at P70 for
resistance range, |R/R| after:
MMA 0204 HV 340 k to 10 M340 k to 10 M
MMB 0207 HV 340 k to 10 M340 k to 10 M
1000 h 0.25 % 0.5 %
8000 h 0.5 % 1 %
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES
MMA 0204 HV ± 50 ppm/K ± 1 % 340 k to 10 ME24; E96
MMB 0207 HV ± 50 ppm/K ± 1 % 340 k to 10 ME24; E96
PACKAGING
TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH PACKAGING
DIMENSIONS
MMA 0204 HV B3 = BL 3000 Antistatic blister tape acc.
IEC 60286-3, Type 2a 8 mm 4 mm Ø 180 mm/7"
B0 10 000 Ø 330 mm/13"
MMB 0207 HV B2 2000 Antistatic blister tape acc.
IEC 60286-3, Type 2a 12 mm 4 mm Ø 180 mm/7"
B7 7000 Ø 330 mm/13"
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: MMB0207MC3324FB200
TYPE/SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING
MMA0204
MMB0207
M = HV C = ± 50 ppm/K 3 digit value
1 digit multiplier
Multiplier
3 = *103
4 = *104
5 = *105
F = ± 1 % B3
B0
B2
B7
Product Description: MMB 0207 -50 1 % HV B2 3M32
MMB 0207 - 50 1 % HV B2 3M32
TYPE SIZE TCR TOLERANCE VERSION PACKAGING RESISTANCE
MMA
MMB
0204
0207
± 50 ppm/K ± 1 % HV = high
voltage
BL
B0
B2
B7
3M32
= 3.32 M
MB0207MC3M24FB2003
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Revision: 26-Oct-17 3Document Number: 28880
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DESCRIPTION
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic body (Al2O3) and conditioned to achieve the
desired temperature coefficient. Nickel plated steel
termination caps are firmly pressed on the metallised rods.
A special laser is used to achieve the target value by
smoothly cutting a helical groove in the resistive layer
without damaging the ceramics. The resistor elements are
covered by a protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure matte tin on nickel plating. Four or five
color code rings designate the resistance value and
tolerance in accordance with IEC 60062 (1).
The result of the determined production is verified by an
extensive testing procedure performed on 100 % of the
individual resistors. This includes full screening for the
elimination of products with a potential risk of early field
failures according to EN 140401-803, 2.1.2.2. Only
accepted products are laid directly into the blister tape in
accordance with IEC 60286-3, Type 2a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long term stability of the
whole system.
The resistors are completely lead (Pb)-free, the pure matte
tin plating provides compatibility with lead (Pb)-free and
lead containing soldering processes. Solderability is
specified for 2 years after production or requalification,
however, excellent solderability is proven after extended
storage in excess of 10 years. The permitted storage time is
20 years. The immunity of the plating against tin whisker
growth has been proven under extensive testing.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
Where applicable, the resistors are tested in accordance
with EN 140401-803 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series.
Vishay Beyschlag has achieved “Approval of
Manufacturer” in accordance with IECQ 03-1. The release
certificate for “Technology Approval Schedule” in
accordance with CECC 240001 based on IECQ 03-3-1 is
granted for the Vishay Beyschlag manufacturing process.
RELATED PRODUCTS
For products with professional specification see the
datasheet:
• “Professional Thin Film MELF Resistors”
(www.vishay.com/doc?28713)
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474.
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
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FUNCTIONAL PERFORMANCE
C
100 150
0
-50 0 50
0.5
1
W
70
Power Dissipation P
ϑ
Ambient Temperature
amb
MMB 0207 HV
MMA 0204 HV
Derating - Standard Operation
C100 150
0
-50 0 50
0.5
1
W
70
Power Dissipation
P
amb
ϑ
Ambient Temperature
MMB 0207 HV
MMA 0204 HV
Derating - Power Operation
W
1000
100
10
1
0.1
10 s1 s100 ms
10 ms
1 ms100 µs10 µs1 µs
Pulse Duration ti
Single Pulse
Maximum pulse load, single pulse; applicable if P 0 and n ≤ 1000 and U ≤ U
max.
;
for permissible resistance change ± (0.5 % R + 0.01 Ω)
Pulse Load
P
MMB 0207 HV
MMA 0204 HV
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FUNCTIONAL PERFORMANCE
W
1000
100
10
1
0.1
10 s1 s100 ms
10 ms
1 ms100 µs10 µs1 µs
Continuous Pulse
Pulse Duration ti
Maximum pulse load, continuous pulse; applicable if P ≤ P (ϑamb) and U ≤ Umax.;
for permissible resistance change ± (0.5 % R + 0.01 Ω)
Pulse Load
P
MMB 0207 HV
MMA 0204 HV
100 V
1 kV
10 V
10 kV
Pulse Voltage U
100 kΩ1 MΩ 10 MΩ
alue
R
Resistance V
1.2/50 Pulse
Pulse load rating in accordance with IEC 60 115-1, 4.27; 1.2 μs/50 μs;
5 pulses at 12 s intervals; for permissible resistance change (0.5 % R + 0.05 Ω)
MMB 0207 HV
MMA 0204 HV
340 kΩ
100 V
1 kV
10 V
10 kV
Pulse Voltage U
100 kΩ1 MΩ 10 MΩ
alue
R
Resistance V
MMB 0207 HV
MMA 0204 HV
340 kΩ
10/700 Pulse
Pulse load rating in accordance with IEC 60115-1, 4.27; 10 μs/700 μs;
10 pulses at 1 minute intervals; for permissible resistance change (0.5 % R + 0.05 Ω)
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TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60 115-1, generic specification
EN 60115-8, sectional specification
EN 140 401-803, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-803. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT/UCT/56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN 60 115-1
CLAUSE
IEC 60 068-2 (1)
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types: STABILITY CLASS
0.25 OR BETTER
STABILITY CLASS
2 OR BETTER
MMA 0204 HV -> 340 k
MMB 0207 HV 340 k to 1 M> 1 M
4.5 - Resistance - ± 1 % R± 1 % R
4.8 - Temperature
coefficient
At (20/-55/20) °C and
(20/125/20) °C ± 50 ppm/K
4.25.1
-
Endurance
at 70 °C:
Standard
operation
mode
U = or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.15 % R + 10 m) ± (0.25 % R + 10 m)
70 °C; 8000 h ± (0.3 % R + 10 m) ± (0.5 % R + 10 m)
-
Endurance
at 70 °C:
Power
operation
mode
U = or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.3 % R + 10 m) ± (0.5 % R + 10 m)
70 °C; 8000 h ± (1 % R + 10 m)± (1 % R + 10 m)
4.25.3
Endurance at
upper category
temperature
125 °C; 1000 h ±(0.15 % R + 5 m)±(0.25 % R + 5 m)
155 °C; 1000 h ±(0.3 % R + 5 m)±(0.5 % R + 5 m)
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ±(0.15 % R + 10 m)±(0.25 % R + 10 m)
- 1 (Ab) Cold -55 °C; 2 h ±(0.05 % R + 5 m)±(0.1 % R + 5 m)
4.19 14 (Na) Rapid change
of temperature
30 min at LCT;
30 min at UCT;
LCT = -55 °C;
UCT = 155 °C
1000 cycles
±(0.25 % R + 10 m)±(0.5 % R + 10 m)
P70 x R
P70 x R
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Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
4.13 -
Short time
overload:
Standard operation
mode U = 2.5 x or
U = 2 × Umax.;
whichever is the less severe;
5 s
±(0.03 % R + 5 m)±(0.15 % R + 5 m)
Short time
overload:
Power operation
mode
±(0.05 % R + 5 m)±(0.15 % R + 5 m)
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance; amplitude
1.5 mm or 200 m/s2; 7.5 h
±(0.05 % R + 5 m)±(0.1 % R + 5 m)
4.38 -
Electrostatic
discharge (Human
Body
Model)
IEC 61340-3-1 (1);
3 pos. + 3 neg. discharges
MMA 0204 HV: 2 kV
MMB 0207 HV: 4 kV
± (0.5 % R + 50 m)
4.17 58 (Td) Solderability
Solder bath method; SnPb40;
non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered); no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning ( 95 % covered); no visible damage
4.18 58 (Td) Resistance
to soldering
heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s ±(0.05 % R + 10 m)±(0.25 % R + 10 m)
Reflow method 2
(IR/forced gas convection);
(260 ± 5) °C; (10 ± 1) s ±(0.02 % R + 10 m)±(0.1 % R + 10 m)
4.29 45 (XA) Component
solvent
resistance
Isopropyl alcohol;
50 °C; method 2 No visible damage
4.30 45 (XA) Solvent
resistance
of marking
Isopropyl alcohol;
50 °C; method 1, toothbrush Marking legible; no visible damage
4.32 21 (Ue3)Shear
(adhesion) 45 N No visible damage
4.33 21 (Ue1)Substrate
bending
Depth 2 mm,
3 times
No visible damage, no open circuit in bent position
± (0.05 % R + 10 m)
4.7 - Voltage proof URMS = Uins; 60 s No flashover or breakdown
4.35 - Flammability IEC 60695-11-5 (1),
needle flame test; 10 s No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN 60 115-1
CLAUSE
IEC 60 068-2 (1)
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types: STABILITY CLASS
0.25 OR BETTER
STABILITY CLASS
2 OR BETTER
MMA 0204 HV -> 340 k
MMB 0207 HV 340 k to 1 M> 1 M
P70 x R
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DIMENSIONS
Note
• Color code marking is applied according to IEC 60062 (1) in four bands (E24 series) or five bands (E96 series). Each color band appears as
a single solid line, voids are permissible if at least 2/3 of the band is visible from each radial angle of view. The last color band for tolerance
is approximately 50 % wider than the other bands. An interrupted violet band between the 3rd and 4th full band identifies the special high
voltage type
PATTERN STYLES FOR MELF RESISTORS
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
DIMENSIONS AND MASS
TYPE / SIZE L
(mm)
D
(mm)
L1 min.
(mm)
D1
(mm)
K
(mm)
MASS
(mg)
MMA 0204 HV 3.6 + 0/- 0.2 1.4 + 0/- 0.1 1.8 D + 0/- 0.15 0.75 ± 0.1 22
MMB 0207 HV 5.8 + 0/- 0.15 2.2 + 0/- 0.2 3.2 D + 0/- 0.2 1.1 ± 0.1 80
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MMA 0204 HV 1.5 1.5 1.8 4.5 1.7 1.2 1.6 4.1
MMB 0207 HV 2.8 2.1 2.6 7.0 3.2 1.7 2.4 6.6
L
1
K
D
1
D
L
GX
Y
Z
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particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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including but not limited to the warranty expressed therein.
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