Microchip Technology 的 CL2 规格书

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‘ MICRQICHIP C L2

 2015 Microchip Technology Inc. DS20005448A-page 1

CL2

Features

• 5.0 to 90V operating range (VA-B)

• 20 mA ±10% at 5.0 - 90V

• 0.01%/°C typical temperature coefficient

• Available in TO-243AA (SOT-89), TO-252(D-

PAK), & TO-92 packages

• Can be paralleled for higher current

Applications

• LED driver

• Industrial lamp indicators

• Signage

• Accent lighting

• Automotive

• Constant current source

• Constant current sink

Description

CL2 is a high voltage, temperature compensated, con-

stant-current source. The device is trimmed to provide

a constant current of 20 mA ±10% at an input voltage

of 5–90V. The device can be used as a two-terminal,

constant-current source or constant-current sink.

A typical application for the CL2 is to drive LEDs with a

constant current of 20 mA. Multiple CL2s can also be

used in parallel to provide higher currents such as

40 mA, 60 mA or 80 mA. The device is available in TO-

243AA (SOT-89), TO-252 (D-PAK), and TO-92 pack-

ages.

Package Type

TO-92

See Table 2-1 for pin information

TO-252 (D-PAK) TO-243AA (SOT-89)

N/C

Simple 90V, 20mA, Temperature Compensated,

Constant-Current LED Driver IC

CL2

DS20005448A-page 2  2015 Microchip Technology Inc.

Typical Application Circuit

Up to 90V

+ VLED(total)

VLED(total)

Functional Circuit

Diagram

CL2

ILED

<20mA

Control Circuit

and Temperature

Compensation

100nF

 2015 Microchip Technology Inc. DS20005448A-page 3

CL2

1.0 ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS†

Operating voltage, VA-B ........................................................................................................................................... 100V

Operating junction temperature, Tj........................................................................................................... -40 to +125 °C

Storage Temperature, Ts.......................................................................................................................... -55 to +150 °C

Note 1: Mounted on FR4 board, 25mm x 25mm x 1.57 mm

† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at those or any other conditions above those indicated in the

operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods

may affect device reliability.

DC AND AC CHARACTERISTICS

Electrical Specifications: Unless otherwise specified, for all specifications TA = +25°C

Parameter Symbol Min Typ Max Units Conditions

Operating voltage VA-B 5.0 - 90 V ---

Current regulation IA-B 18.0 20 22 mA VA-B= 5.0V - 90V

IA-B temperature coefficient ∆IA-B/∆T - 0.01 - %/°C VA-B= 45V, Tj= -40°C to +100°C

Operating junction temperature Tj-40 - 125 °C ---

Dynamic resistance RA-B -300- kΩ---

TEMPERATURE SPECIFICATIONS

Parameter Symbol Min Typ Max Units Conditions

Temperature Ranges

Operating Junction Temperature Tj-40 – 125 °C

Storage Temperature Ts-55 – 150 °C

Package Thermal Resistances

Thermal Resistance, TO-92 θja – 132 – °C/W

Thermal Resistance, TO-252 θja –81–°C/WNote 1

Thermal Resistance, TO-243AA θja – 133 – °C/W Note 1

TABLE 1-1: THERMAL CHARACTERISTICS

Package Power Dissipation

@TA = 2.5°C (W) Conditions

TO-92 0.6

TO-252 2.0 Note 1

TO-243AA 1.3 Note 1

CL2

DS20005448A-page 4  2015 Microchip Technology Inc.

2.0 PIN DESCRIPTION

The locations of the pins are listed in Package Type

and Packaging Information.

TABLE 2-1: PIN DESCRIPTION

Pin # TO-92 Pin # TO-252 Pin # To-243AA Symbol Function

1 1 1 VA Current in

2 3 3 NC No connect

3 4 2,4 VB Current out

VB \\ \\ / \\ \\ Temperature (°C)

 2015 Microchip Technology Inc. DS20005448A-page 5

CL2

3.0 FUNCTIONAL DESCRIPTION

Figure 3-1 provides the Functional Circuit diagram and

its equivalent block diagram for CL2. Performance

information is available in Figure 3-2 and Figure 3-3.

Figure 3-4 and Figure 3-5 provide example schemat-

ics.

FIGURE 3-1: Functional Circuit Diagram and Equivalent Block Diagram

FIGURE 3-2: Temperature Characteristics

Control Circuit

and Temperature

Compensation

20mA

±10%

Functional Circuit Diagram Equivalent Block Diagram

0.98

0.99

1.00

1.01

1.02

1.03

-55 -35 -15 5 25 45 65 85 105 125 145

Temperature (°C)

Current, normalized to 25°C

5.0V

45V

90V

J) J, A "—— z%@ #9 M) ' if é: ﬁg

CL2

DS20005448A-page 6  2015 Microchip Technology Inc.

FIGURE 3-3: Output Current vs Voltage

FIGURE 3-4: CL2 for Multiple LED Strings

0 10 2030405060708090100

VA-B

IA-B (mA)

CL2

Up to 90V

LED(total)

100nF

LED

~20mA

LED

~20mA

LED

~20mA

LED

~20mA

CL2 CL2 CL2

J, A $ $22 #0 $0) #0) _‘<____ §§="" §§="" xe="">

 2015 Microchip Technology Inc. DS20005448A-page 7

CL2

FIGURE 3-5: CL2 for Higher Current

CL2

Up to 90V

+VLED(total)

ILED

~60mA

VLED(total)

100nF

CL2 CL2

3 PACKAGING IN e Markin TO-92 23? :L :L XX C 6 © NNN alor( )

CL2

DS20005448A-page 8  2015 Microchip Technology Inc.

4.0 PACKAGING INFORMATION

4.1 Package Marking Information

Legend: XX...X Product Code or Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC® designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for product code or customer-specific information. Package may or

not include the corporate logo.

3-lead TO-92

YWWNNN

XXXXXX

XXXX e3

Example

541343

CL2

N3 e3

3-lead TO-243AA *

(SOT-89)

Example

XXXXYWW

NNN

CL2541

343

TO-252 (D-PAK) Example

YYWWNNN

XXXXX

XXXX

1541343

2K4

3-Lead TO-92 Package Outline (LILLIN3) % D a Sealing Plane 1 2 3 v i L i l i i i b 4491 SW % F” *1 a i» Front View Side Wew El E i 1 3 2 Bottom View Symbol MIN .170 mm .0141 .175 .125 .000 .095 .045 .500 Dimenslcns (inches) No“ ' ' ' ' ' ' ' ' ' MAX .210 my .022! .205 155 .105 .105 .055 .510“ JEUEC Regulation T09? . ms mmensmn is not speciﬁed In me JEDEC mm 7‘ This dmnsmn Mars [mm me JEDEC lirawmg Drawing: nut in sillu.

 2015 Microchip Technology Inc. DS20005448A-page 9

CL2

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

3-Lead T0-252 (D-PAK) Package Outline (K4) E J__L l u T m l l 1 2 L J a L LT‘ L5 /' Note 1 ﬁr oz 4-1 View a H. a 4 .. 0 From \now Rear View Side View Wew B um; 1 42mm A mrmmallocalmns are saw, only 3 are functmnal Lead "0'"wa was removed um 000 000- 025 nan 105 nm 235 205 250 an :10 ms ms nﬁ' 0351 m m um.» nun 00m .240 . . . “90 _ 000 ms .020 _ _ ﬁrm-c) use REF 350 MAX .014 .005 .005 .045 .215 .035 .245 217- .265 .200- AID .070 060 040 .050 Irr 15" JEDEC Reglslranan T0452, Vansnan AA, Issue E, June 2004 - ms mmensum :5 no! spewed m the 15050 delllg 7 Thrs mm mm: [mm the JEDEC mama Dummy! ml to gut:

CL2

DS20005448A-page 10  2015 Microchip Technology Inc.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

 2015 Microchip Technology Inc. DS20005448A-page 11

CL2

3-Lead TO-243AA (SOT-89) Package Outline (N8)

Symbol A b b1 C D D1 E E1 e e1 H L

Dimensions

(mm)

MIN 1.40 0.44 0.36 0.35 4.40 1.62 2.29 2.00†

1.50

BSC

3.00

BSC

3.94 0.73†

NOM-------- --

MAX 1.60 0.56 0.48 0.44 4.60 1.83 2.60 2.29 4.25 1.20

JEDEC Registration TO-243, Variation AA, Issue C, July 1986.

† This dimension differs from the JEDEC drawing

Drawings not to scale.

bb1

EHE1

12 3

Top View Side View

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

CL2

DS20005448A-page 12  2015 Microchip Technology Inc.

APPENDIX A: REVISION HISTORY

Revision A (November 2015)

• Updated file to Microchip format

PART NO. v XX 44x 44x

 2015 Microchip Technology Inc. DS20005448A-page 13

CL2

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device: CL2 = Simple 90V, 20 mA, Temperature-Compen-

sated, Constant-Current LED Driver IC

Package: N3 = TO-92, 3-lead

K4 = TO-252 (D-PAK), 3-lead

N8 = TO-243AA (SOT-89), 3-lead

Environmental G = Lead (Pb)-free/ROHS-compliant package

Media Type: (blank) = 1000/Bag for N3 packages

= 2000/Reel for K4 packages

= 2000/Reel for N8 packages

P002 = 2000/Reel for N3

Examples:

a) CL2N3-G TO-92 package,

1000/Bag

b) CL2K4-G TO-252 package,

2000/Reel

c) CL2N8-G TO-243AA package,

2000/Reel

d) CL2N3-G-P002 TO-92 package,

2000/Reel

PART NO. X

Device

Environmental

Package

Options

Media

Type

YSTEM

DS20005448A-page 14  2015 Microchip Technology Inc.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,

LANCheck, MediaLB, MOST, MOST logo, MPLAB,

OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,

SST, SST Logo, SuperFlash and UNI/O are registered

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

The Embedded Control Solutions Company and mTouch are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,

CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit

Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,

KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB

Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,

Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,

PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,

Total Endurance, TSHARC, USBCheck, VariSense,

ViewSpan, WiperLock, Wireless DNA, and ZENA are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip

Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

ISBN: 978-1-5224-0014-1

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

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and manufacture of development systems is ISO 9001:2000 certified.

QUALITYMANAGEMENTS

YSTEM

CERTIFIEDBYDNV

== ISO/TS16949==

6‘ ‘MICROCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE

DS20005448A-page 15  2015 Microchip Technology Inc.

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