Texas Instruments 的 TPS61097A-33 规格书

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TPS61097A
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0.9 V to 3.3V
IN
VOUT
EN
L
GND
VIN
L1
C1
C2
V
+3.3V
OUT
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TPS61097A-33
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TPS61097A-33 Low-Input Voltage Synchronous-Boost Converter With Low Quiescent
Current
1 Features 3 Description
The TPS61097A-33 provides a power supply solution
1• Up to 93% Efficiency at Typical Operating for products powered by either a single-cell, two-cell,
Conditions or three-cell alkaline, NiCd, or NiMH, or one-cell Li-
• Connection from Battery to Load via Bypass Ion or Li-polymer battery. They can also be used in
Switch in Shutdown Mode fuel cell or solar cell powered devices where the
capability of handling low input voltages is essential.
• Typical Shutdown Current Less Than 5 nA Possible output currents depend on the input-to-
• Typical Quiescent Current Less Than 5 μAoutput voltage ratio. The devices provide output
• Operating Input Voltage Range currents up to 100 mA at a 3.3-V output while using a
From 0.9 V to 5.5 V single-cell Li-Ion or Li-Polymer battery. The boost
• Power-Save Mode for Improved Efficiency at Low converter is based on a current-mode controller using
synchronous rectification to obtain maximum
Output Power efficiency. The maximum average input current is
• Overtemperature Protection limited to a value of 400 mA. The converter can be
• Small 2.8-mm x 2.9-mm 5-Pin SOT-23 Package disabled to minimize battery drain. During shutdown,
the battery is connected to the load to enable battery
2 Applications backup of critical functions on the load. The device is
packaged in a 5-pin SOT-23 package (DBV)
• MSP430 Applications measuring 2.8 mm × 2.9 mm.
• All Single-Cell, Two-Cell, and Three-Cell Alkaline,
NiCd, NiMH, or Single-Cell Li-Battery Powered Device Information(1)
Products PART NUMBER PACKAGE BODY SIZE (NOM)
• Personal Medical Products TPS61097A-33 SOT-23 (5) 2.90 mm × 2.90 mm
• Fuel Cell and Solar Cell Powered Products (1) For all available packages, see the orderable addendum at
the end of the datasheet.
• PDAs
• Mobile Applications
• White LEDs
Typical Operating Application
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
8.3 Feature Description................................................. 10
1 Features.................................................................. 18.4 Device Functional Modes........................................ 11
2 Applications ........................................................... 19 Application and Implementation ........................ 12
3 Description ............................................................. 19.1 Application Information............................................ 12
4 Revision History..................................................... 29.2 Typical Application .................................................. 13
5 Pin Configuration and Functions......................... 310 Power Supply Recommendations ..................... 16
6 Specifications......................................................... 311 Layout................................................................... 16
6.1 Absolute Maximum Ratings ...................................... 311.1 Layout Guidelines ................................................. 16
6.2 ESD Ratings.............................................................. 311.2 Layout Example .................................................... 16
6.3 Recommended Operating Conditions....................... 312 Device and Documentation Support ................. 17
6.4 Thermal Information.................................................. 412.1 Device Support .................................................... 17
6.5 Electrical Characteristics........................................... 412.2 Trademarks........................................................... 17
6.6 Typical Characteristics.............................................. 512.3 Electrostatic Discharge Caution............................ 17
7 Parameter Measurement Information .................. 812.4 Glossary................................................................ 17
8 Detailed Description.............................................. 913 Mechanical, Packaging, and Orderable
8.1 Overview ................................................................... 9Information ........................................................... 17
8.2 Functional Block Diagram......................................... 9
4 Revision History
Changes from Original (January 2014) to Revision A Page
• Added Handling Rating table, Feature Description section, Device Functional Modes,Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
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1
2
3
5
4
L
VOUTEN
GNDGND
VIN
FIXED OUTPUT VOLTAGE
DBV PACKAGE
(TOP VIEW)
TPS61097A-33
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5 Pin Configuration and Functions
Pin Functions
PIN I/O DESCRIPTION
NO. NAME
1 VIN I Boost converter input voltage.
2 GND – Control / logic ground.
3 EN I Enable input (1 = enabled, 0 = disabled). EN must be actively terminated high or low.
4 VOUT O Boost converter output.
5 L I Connection for inductor.
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN –0.3 7
L –0.3 7
VIInput voltage range V
VOUT –0.3 7
EN –0.3 7
IMAX Maximum continuous output current 400 mA
TJJunction temperature range –40 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22- ±1000
C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN MAX UNIT
VIN Input voltage range 0.9 5.5 V
VEN Enable voltage range 0 5.5 V
TAOperating free air temperature range –40 85 °C
TJOperating junction temperature range –40 125 °C
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6.4 Thermal Information
TPS61097A-33
THERMAL METRIC(1) DBV UNIT
5 PINS
θJA Junction-to-ambient thermal resistance 208.7
θJCtop Junction-to-case (top) thermal resistance 124.5
θJB Junction-to-board thermal resistance 36.9 °C/W
ψJT Junction-to-top characterization parameter 14.7
ψJB Junction-to-board characterization parameter 36
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
Over recommended free-air temperature range and over recommended input voltage range (typical at an ambient
temperature range of 25°C) (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC/DC STAGE
VIN Input voltage 0.9 5.5 V
VOUT Output voltage VIN = 1.2 V , IOUT = 10 mA 3.20 3.30 3.40
ISW Switch current limit VOUT = 3.3 V 200 400 475 mA
Rectifying switch on resistance VOUT = 3.3 V 1.0
Main switch on resistance VOUT = 3.3 V 1.0 Ω
Bypass switch on resistance VIN = 1.2 IOUT = 100 mA 3.4
Line regulation VIN < VOUT, VIN = 1.2 V to 1.8 V, IOUT = 10 mA 0.5%
Load regulation VIN < VOUT, IOUT = 10 mA to 50 mA, VIN = 1.8 V 0.5%
VIN 2 4
IQQuiescent current IOUT = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.5 V μA
VOUT 5 8
VEN = 0 V, VIN = 1.2 V, IOUT = 0 mA 0.005 0.15
ISD Shutdown current VIN VEN = 0 V, VIN = 3 V, IOUT = 0 mA 0.005 0.15 μA
Leakage current into L VEN = 0 V, VIN = 1.2 V, VL= 1.2 V 0.01 1
CONTROL STAGE
EN input current EN = 0 V or EN = VIN 0.01 0.1 μA
VIL Logic low level, EN falling edge 0.58
V
VIN +
VIH Logic high level, EN rising edge 0.78 1.0 V
OTP Overtemperature protection 150 °C
OTPHYST Overtemperature hysteresis 20
Undervoltage lock-out threshold
VUVLO VIN decreasing 0.6 0.8 V
for turn off
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0
20
40
60
80
100
120
0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 3.6 3.9 4.2
IIN - Input Current - nA
VIN - Input Voltage -V
C004
Device Disabled
No Output Load
Temperature = 25£C
C006
C003
C004
0
10
20
30
40
50
60
70
80
90
100
1 10 100
Efficiency - %
IOUT - Output Current - mA
VIN = 0.9V
VIN = 1.2V
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.0V
C002
C2 = 10µF, ceramic
L = 10µH
C001
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6.6 Typical Characteristics
Refer to Figure 19 for reference designators.
Figure 1. Maximum Output Current vs Input Voltage Figure 2. Efficiency vs Output current
Figure 3. Efficiency vs Input Voltage Figure 4. Input Current vs Input Voltage
Figure 5. Input Current vs Input Voltage Figure 6. VIH vs Temperature
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V = 1.8 V to 2.4 V
R = 100
IN
LOAD Ω
*VIN offset of 1.8V
0
1
2
3
4
5
6
0 1 2 3 4 5 6
VOUT - Output Voltage - V
VIN - Input Voltage -V
RLOAD = 122
RLOAD = 1k
C009
Device Disabled
3.20
3.22
3.24
3.26
3.28
3.30
3.32
3.34
3.36
3.38
3.40
1 10 100 1000
VOUT - Output Voltage - V
IOUT - Output Current - mA
VIN = 0.9V
VIN = 1.2V
VIN = 1.5V
VIN = 1.8V
VIN = 2.1V
VIN = 2.5V
VIN = 3.0V
C008
C2 = 10µF, ceramic
L = 10µH
0.7
0.705
0.71
0.715
0.72
0.725
1 10 100
VIH - Logic High Level - V
IOUT - Output Current - mA
C007
VIN = 1.8V
Temperature = 25£C
TPS61097A-33
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Typical Characteristics (continued)
Figure 7. VIH vs Output Current Figure 8. Output Voltage vs Output Current
Figure 9. Output Voltage vs Input Voltage Figure 10. Output Voltage Ripple
Figure 11. Load Transient Response Figure 12. Line Transient Response
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Typical Characteristics (continued)
Figure 13. Switching Waveform, Continuous Mode Figure 14. Switching Waveform, Discontinuous Mode
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7 Parameter Measurement Information
Figure 15. Measurement Test Circuit
Table 1. List of Components
REFERENCE MANUFACTURER PART NO.
C2 Murata GRM319R61A106KE19 10μF 10V X5R 1206 20%
C3 Murata GRM319R61A106KE19 10μF 10V X5R 1206 20%
L1 Coilcraft DO3314-103MLC
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BypassSwitch
Control
P
VOUT
EN
L
Rectifying
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Overvoltage
Protection
Bypass
Switch
StartupCircuit
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ControlLogic
ThermalShutdown
Undervoltage
Lockout
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Current
Sense
GND
Main
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1.20V
TPS61097A-33
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8 Detailed Description
8.1 Overview
The TPS61097A-33 is a high performance, high efficiency switching boost converter. To achieve high efficiency
the power stage is realized as a synchronous boost topology. For the power switching, two actively controlled low
RDSon power MOSFETs are implemented.
8.2 Functional Block Diagram
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IL
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200mA
(typ.)
ContinuousCurrentOperation DiscontinuousCurrentOperation
200mA
(typ.)
TPS61097A-33
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8.3 Feature Description
8.3.1 Controller Circuit
The device is controlled by a hysteretic current mode controller. This controller regulates the output voltage by
keeping the inductor ripple current constant in the range of 200 mA and adjusting the offset of this inductor
current depending on the output load. If the required average input current is lower than the average inductor
current defined by this constant ripple the inductor current goes discontinuous to keep the efficiency high at low
load conditions.
Figure 16. Hysteretic Current Operation
The output voltage VOUT is monitored via the feedback network which is connected to the voltage error amplifier.
To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly.
8.3.2 Device Enable and Shutdown Mode
The device is enabled when EN is set high and shut down when EN is low. During shutdown, the converter stops
switching and all internal control circuitry is turned off.
8.3.3 Bypass Switch
The TPS61097A-33 contains a P-channel MOSFET (Bypass Switch) in parallel with the synchronous rectifying
MOSFET. When the IC is enabled (VEN > VIH), the Bypass Switch is turned off to allow the IC to work as a
standard boost converter. When the IC is disabled (VEN < VIL) the Bypass Switch is turned on to provide a direct,
low impedance connection from the input voltage (at the L pin) to the load (VOUT). The Bypass Switch is not
impacted by Undervoltage lockout, Overvoltage or Thermal shutdown.
8.3.4 Startup
After the EN pin is tied high, the device starts to operate. If the input voltage is not high enough to supply the
control circuit properly a startup oscillator starts to operate the switches. During this phase the switching
frequency is controlled by the oscillator and the maximum switch current is limited. As soon as the device has
built up the output voltage to about 1.8 V, high enough for supplying the control circuit, the device switches to its
normal hysteretic current mode operation. The startup time depends on input voltage and load current.
8.3.5 Operation at Output Overload
If in normal boost operation the inductor current reaches the internal switch current limit threshold the main
switch is turned off to stop further increase of the input current. In this case the output voltage will decrease since
the device can not provide sufficient power to maintain the set output voltage.
If the output voltage drops below the input voltage the backgate diode of the rectifying switch gets forward biased
and current starts flow through it. Because this diode cannot be turned off, the load current is only limited by the
remaining DC resistances. As soon as the overload condition is removed, the converter automatically resumes
normal operation and enters the appropriate soft start mode depending on the operating conditions.
8.3.6 Undervoltage Lockout
An undervoltage lockout function stops the operation of the converter if the input voltage drops below the typical
undervoltage lockout threshold. This function is implemented in order to prevent malfunctioning of the converter.
The undervoltage lockout function has no control of the Bypass Switch. If the Bypass Switch is enabled
(VEN < VIL) there is no impact during an undervoltage condition, and the Bypass Switch remains on.
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Feature Description (continued)
8.3.7 Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (OTP), the device stops operating. As soon as the IC temperature has
decreased below the programmed threshold (OTP - OTP HYST), it starts operating again. There is a built-in
hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.
8.4 Device Functional Modes
EN DEVICE STATE
H Boost Converter
L Bypass Switch
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TPS61097A
VIN
LVOUT
GND
EN
TPS22920L
VIN VOUT
EN
L1
C2
C1
V
+3.3V
OUT
GND
R1
R2
V
0.9V to 3.3V
IN
TPS61097A-33
V
0.9 V to 3.3V
IN
VOUT
EN
L
GND
VIN
L1
R2
R1
C1
C2
V
+3.3V
OUT
TPS61097A-33
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Adjustable Bypass Switching
The EN pin can be set up as a low voltage control for the bypass switch. By setting the desired ratio of R1 and
R2, the TPS61097A-33 can be set to switch on the bypass at a defined voltage level on VIN. For example,
setting R1 and R2 to 200 KΩwould set VEN to half of VIN. The voltage level of VIN engaging the bypass switch
is based on the VIL level of EN (0.58 V). If VIN is less than 1.16 V then the bypass switch will be enabled. For
VIN values above 1.56 V (50% of VIH) the bypass switch is disabled.
Figure 17. Adjustable Bypass Switching
9.1.2 Managing Inrush Current
Upon startup, the output capacitor of the boost converter can act as a virtual short circuit. The amount of inrush
current is dependent on the rate of increase of the input voltage, the inductance used with the converter, the
output capacitance and the parasitic circuit resistance. One method to reduce the inrush current is to use a load
switch with controlled turn-on. Texas Instruments has a large offering of controlled slew rate load switches which
can be found at www.ti.com/loadswitches. Below is an example circuit that has a load switch with controlled turn-
on.
Figure 18. Example Circuit with Load Switch
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l TEXAS INSTRUMENTS TP561097A V cm L1 L VOUT —l— +3.3v I c: Vw : 0.9 v lo 3.3V V'” c1 GPIO L EN F GND
´
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Application Information (continued)
9.1.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS61097A-33 devices is 125°C. Specified
regulator operation is assured to a maximum ambient temperature TAof 85°C. Therefore, the maximum power
dissipation is about 191.7 mW. More power can be dissipated if the maximum ambient temperature of the
application is lower.
9.2 Typical Application
Figure 19. Typical Application Schematic
9.2.1 Design Requirements
DESIGN PARAMETERS EXAMPLE VALUE
Input Voltage (VIN) 1.2 V to 1.8 V
Output Voltage (VOUT) 3.3 V
Output Current (IOUT) 10 mA
9.2.2 Detailed Design Procedure
9.2.2.1 Inductor Selection
To make sure that the TPS61097A-33 devices can operate, a suitable inductor must be connected between pin
VIN and pin L. Inductor values of 4.7 μH show good performance over the whole input and output voltage range .
Choosing other inductance values affects the switching frequency fproportional to 1/L as shown in Equation 1.
(1)
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OUT OUT
IN
V I 0.8 100 mA
V
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OUT OUT
IN
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V I + 100 mA; continous current operation
0.8 V
I =
200 mA; discontinuous current operation
TPS61097A-33
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Choosing inductor values higher than 4.7 μH can improve efficiency due to reduced switching frequency and
therefore with reduced switching losses. Using inductor values below 2.2 μH is not recommended.
Having selected an inductance value, the peak current for the inductor in steady state operation can be
calculated. Equation 2 gives the peak current estimate.
(2)
IL,MAX is the inductor's required minimum current rating. Note that load transient or over current conditions may
require an even higher current rating.
Equation 3 provides an easy way to estimate whether the device is operating in continuous or discontinuous
operation. As long as the equation is true, continuous operation is typically established. If the equation becomes
false, discontinuous operation is typically established.
(3)
Due to the use of current hysteretic control in the TPS61097A-33, the series resistance of the inductor can
impact the operation of the main switch. There is a simple calculation that can ensure proper operation of the
TPS61097A-33 boost converter. The relationship between the series resistance (RIN), the input voltage (VIN) and
the switch current limit (ISW) is shown in Equation 4.
RIN < VIN / ISW (4)
Examples:
ISW = 400 mA, VIN = 2.5 V (5)
In Equation 5, RIN < 2.5 V / 400 mA; therefore, RIN must be less than 6.25 Ω.
ISW = 400 mA, VIN = 1.8 V (6)
In Equation 6, RIN < 1.8 V / 400 mA; therefore, RIN must be less than 4.5 Ω.
The following inductor series from different suppliers have been used with TPS61097A-33 converters:
Table 2. List of Inductors
VENDOR INDUCTOR SERIES
Coilcraft DO3314
TDK NLC565050T
Taiyo Yuden CBC2012T
9.2.2.2 Capacitor Selection
9.2.2.2.1 Input Capacitor
The input capacitor should be at least 10-μF to improve transient behavior of the regulator and EMI behavior of
the total power supply circuit. The input capacitor should be a ceramic capacitor and be placed as close as
possible to the VIN and GND pins of the IC.
9.2.2.2.2 Output Capacitor
For the output capacitor C2, it is recommended to use small ceramic capacitors placed as close as possible to
the VOUT and GND pins of the IC. If, for any reason, the application requires the use of large capacitors which
can not be placed close to the IC, the use of a small ceramic capacitor with a capacitance value of around 2.2 μF
in parallel to the large one is recommended. This small capacitor should be placed as close as possible to the
VOUT and GND pins of the IC.
A minimum capacitance value of 4.7 μF should be used, 10 μF are recommended. If the inductor exceeds 4.7
μH, the value of the output capacitance value needs to be half the inductance value or higher for stability
reasons, see Equation 7.
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(7)
Using low ESR capacitors, such as ceramic capacitors, is recommended to minimize output voltage ripple. If
heavy load changes are expected, the output capacitor value should be increased to avoid output voltage drops
during fast load transients.
Table 3. Recommended Output Capacitors
VENDOR CAPACITOR SERIES
Murata GRM188R60J106M47D 10μF 6.3V X5R 0603
Murata GRM319R61A106KE19 10μF 10V X5R 1206
9.2.3 Application Curves
VIN = 1.2 V VIN = 1.8 V
IOUT = 10 mA IOUT = 1.8 mA
Figure 20. Startup After Enable Figure 21. Startup After Enable
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10 Power Supply Recommendations
The TPS61097A-33 DC-DC converters are intended for systems powered by a single up to triple cell Alkaline,
NiCd, NiMH battery with a typical terminal voltage between 0.9 V and 5.5 V. They can also be used in systems
powered by one-cell Li-Ion or Li-Polymer with a typical voltage between 2.5 V and 4.2 V. Additionally, any other
voltage source like solar cells or fuel cells with a typical output voltage between 0.9 V and 5.5 V can power
systems where the TPS61097A-33 is used. The TPS61097A-33 does not down-regulate VIN; therefore, if VIN is
greater than VOUT, VOUT tracks VIN.
11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, it is recommended to use short traces as well, separated from the power ground traces. This
avoids ground shift problems, which can occur due to superimposition of power ground current and control
ground current.
11.2 Layout Example
Figure 22. Layout Example
16 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated
l TEXAS INSTRUMENTS
TPS61097A-33
www.ti.com
SLVSCF2A –JANUARY 2014–REVISED DECEMBER 2014
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Trademarks
All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 17
I TEXAS INSTRUMENTS Sample: Sample:
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS61097A-33DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 (NG5F, NG5K)
TPS61097A-33DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 NG5K
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “KO '«PT» Reel Diame|er AD Dimension des‘gned to accommodate the componem wwdlh E0 Dimension damned to eccemmodam the component \ength KO Dimenslun desgned to accommodate the componem thickness 7 w Overen with loe earner cape i p1 Pitch between successwe cavuy eemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O Sprockemoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pocket Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS61097A-33DBVT SOT-23 DBV 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Mar-2021
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS61097A-33DBVT SOT-23 DBV 5 250 183.0 183.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Mar-2021
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/F 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/F 06/2021
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/F 06/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
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