Murata Electronics 的 BLM15 SN1 Series Spec 规格书

SDec.No.JEN F243A70018AL701 M151“; BLMTSAG1DOSN1D BLMTSAG7DOSN1 D BLMTSAG1ZTSN1D BLM15A62218N1D BLMTSAGSDT SN1 D BLMTSAG1DZSN1D BLMTSAXT DOSN1 D BLMTSAXSDOSN1 D BLMTSAX7DOSN1 D BLMTSAX121SN1D BLMTSAX221SN1 D BLMTSAX601SN1 D BLMTSAXT DZSN1 D BLMTSEAOSOSN1 D BLMT SEBOSOSN1 D BLMTSEAT DOSN1 D BLMTSBBTDOSN1D BLMTSEAZZOSN1 D BLMT SEBZZOSN1 D BLMTSEASSOSN1 D 100
Spec.No.JENF243A-0018AL-01 P1/11
MURATA MFG.CO.,LTD.
Reference Only
Chip Ferrite Bead BLM15□□□□□SN1□ REFERENCE SPECIFICATION
1.Scope
This reference specification applies to Chip Ferrite Bead BLM15_SN series.
2.Part Numbering
(ex.) BL M 15 AG 100 S N 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz,Under Standard
Testing Condition
)
Rated Current
(mA)
DC Resistance
(Ω max.) Remark
Initial
Values Values
After
Testing
Typical
BLM15AG100SN1D
5～15 10 1000 0.025 0.05
For
general
use
BLM15AG100SN1B
BLM15AG700SN1D
40～100 70 600 0.15 0.20
BLM15AG700SN1B
BLM15AG121SN1D
120±25% 120 550 0.19 0.29
BLM15AG121SN1B
BLM15AG221SN1D
220±25% 220 450 0.29 0.39
BLM15AG221SN1B
BLM15AG601SN1D 600±25% 600 300 0.52 0.62
BLM15AG601SN1B
BLM15AG102SN1D 1000±25% 1000 300 0.65 0.75
BLM15AG102SN1B
BLM15AX100SN1D 5～15 10 1740 0.015 0.025
BLM15AX100SN1B
BLM15AX300SN1D 30±25％ 30 1100 0.06 0.11
BLM15AX300SN1B
BLM15AX700SN1D 70±25％ 70 780 0.10 0.15
BLM15AX700SN1B
BLM15AX121SN1D 120±25％ 120 700 0.13 0.18
BLM15AX121SN1B
BLM15AX221SN1D 220±25％ 220 600 0.18 0.23
BLM15AX221SN1B
BLM15AX601SN1D 600±25% 600 500 0.34 0.39
BLM15AX601SN1B
BLM15AX102SN1D 1000±25% 1000 350 0.49 0.54
BLM15AX102SN1B
BLM15BA050SN1D
5±25% 5 300 0.10 0.15
For
high speed
signal line
BLM15BA050SN1B
BLM15BB050SN1D
5±25% 5 500 0.08 0.15
BLM15BB050SN1B
BLM15BA100SN1D
10±25% 10 300 0.20 0.25
BLM15BA100SN1B
BLM15BB100SN1D
10±25% 10 300 0.10 0.15
BLM15BB100SN1B
BLM15BA220SN1D
22±25% 22 300 0.30 0.35
BLM15BA220SN1B
BLM15BB220SN1D
22±25% 22 300 0.20 0.30
BLM15BB220SN1B
BLM15BA330SN1D
33±25% 33 300 0.40 0.45
BLM15BA330SN1B
SQec.No.JEN F243A70018AL701 BLM1SBA47OSN1 D BLM1SBB47OSN1 D BLM1SBA7SOSN1 D BLM1SBB7SOSN1 D BLMTSED7SOSN1 D BLM1SBE1218N1D BLMTSED121SN1 D BLMTSBC121SN1 D BLM1SBBZZTSN1 D BLMTSED221SN1 D BLMT SBC241SN1 D BLMT SBD471SN1 D BLMTSEDSO1SN1D BLMTSED1OZSN1 D BLMTSED1528N1D BLM1SBX7SOSN1 D BLM1SBX1218N1D BLM1SBX2218N1D BLM1SBX47TSN1D BLM1SBXBOTSN1D BLM1SBX1 OZSNT D BLM1SBX1 BZSNT D
Spec.No.JENF243A-0018AL-01 P2/11
MURATA MFG.CO.,LTD.
Reference Only
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz,Under Standard
Testing Condition
)
(Note)
Rated Current
(mA)
DC Resistance
(Ω max.) Remark
Initial
Values Values
After
Testing
Typical
BLM15BA470SN1D
47±25% 47 200 0.60 0.65
For
high speed
signal line
BLM15BA470SN1B
BLM15BB470SN1D
47±25% 47 300 0.35 0.45
BLM15BB470SN1B
BLM15BA750SN1D
75±25% 75 200 0.80 0.85
BLM15BA750SN1B
BLM15BB750SN1D
75±25% 75 300 0.40 0.50
BLM15BB750SN1B
BLM15BD750SN1D
75±25% 75 300 0.20 0.30
BLM15BD750SN1B
BLM15BB121SN1D
120±25% 120 300 0.55 0.65
BLM15BB121SN1B
BLM15BD121SN1D
120±25% 120 300 0.30 0.4
BLM15BD121SN1B
BLM15BC121SN1D 120±25％ 120 350 0.45 0.50
BLM15BC121SN1B
BLM15BB221SN1D 220±25% 220 200 0.80 0.90
BLM15BB221SN1B
BLM15BD221SN1D
220±25% 220 300 0.40 0.50
BLM15BD221SN1B
BLM15BC241SN1D 240±25％ 240 250 0.70 0.75
BLM15BC241SN1B
BLM15BD471SN1D 470±25% 470 200 0.60 0.70
BLM15BD471SN1B
BLM15BD601SN1D 600±25% 600 200 0.65 0.75
BLM15BD601SN1B
BLM15BD102SN1D 1000±25% 1000 200 0.90 1.0
BLM15BD102SN1B
BLM15BD152SN1D 1500±25% 1500 190 1.0 1.1
BLM15BD152SN1B
BLM15BD182SN1D 1800±25% 1800 100 1.4 1.5
BLM15BD182SN1B
BLM15BX750SN1D 75±25% 75 600 0.15 0.20
BLM15BX750SN1B
BLM15BX121SN1D 120±25% 120 600 0.17 0.22
BLM15BX121SN1B
BLM15BX221SN1D 220±25% 220 450 0.27 0.32
BLM15BX221SN1B
BLM15BX471SN1D 470±25% 470 350 0.41 0.46
BLM15BX471SN1B
BLM15BX601SN1D 600±25% 600 350 0.46 0.51
BLM15BX601SN1B
BLM15BX102SN1D 1000±25% 1000 300 0.65 0.75
BLM15BX102SN1B
BLM15BX182SN1D 1800±25% 1800 250 0.90 1.0
BLM15BX182SN1B
SQec.No.JEN F243A70018AL701 (a DC Re ((2 1 25°C BLM15PGTODSN1D B_LM15F'D3_00_SN1 D BLMTSPDSOOSNT D BLMTSPD8OOSN1D BLMTSPD1218N1D BLM15PXSSDSN1 D B_LM15PX6_00$N1 D BLM15PXBODSN1 D BLM15PX121SN1D BLM15PX181SN1D BLM15PX221SN1D B_LM15PX3_31$N1D BLM15PX471SN1D BLM15PX601SN1D BLMT 5KD200$N1 D BLMT SKDSDOSN1 D BLMTSKD121SN1D
Spec.No.JENF243A-0018AL-01 P3/11
MURATA MFG.CO.,LTD.
Reference Only
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz,Under Standard
Testing Condition
)
(Note)
Rated Current
(mA)
DC Resistance
(Ω max.) Remark
Initial
Values Values
After
Testing
Typical at 85℃ at 125
℃
BLM15PG100SN1D
5～15 10 1000 0.025 0.05
For DC
power line
BLM15PG100SN1B
BLM15PD300SN1D
30±25% 30
2200*1 1400*1 0.035 0.05
BLM15PD300SN1B
BLM15PD600SN1D
60±25% 60
1700*1 1100*1 0.06 0.075
BLM15PD600SN1B
BLM15PD800SN1D
80±25% 80
1500*1 1000*1 0.07 0.085
BLM15PD800SN1B
BLM15PD121SN1D
120±25% 120
1300*1 900*1 0.09 0.105
BLM15PD121SN1B
BLM15PX330SN1D
33±25％ 33 3000*1 1700*1 0.022 0.037
BLM15PX330SN1B
BLM15PX600SN1D
60±25％ 60 2500*1 1400*1 0.032 0.047
BLM15PX600SN1B
BLM15PX800SN1D
80±25％ 80 2300*1 1300*1 0.038 0.053
BLM15PX800SN1B
BLM15PX121SN1D
120±25％ 120 2000*1 1100*1 0.055 0.070
BLM15PX121SN1B
BLM15PX181SN1D
180±25％ 180 1500*1 800*1 0.090 0.105
BLM15PX181SN1B
BLM15PX221SN1D
220±25％ 220 1400*1 800*1 0.10 0.115
BLM15PX221SN1B
BLM15PX331SN1D
330±25％ 330 1200*1 700*1 0.15 0.165
BLM15PX331SN1B
BLM15PX471SN1D
470±25％ 470 1000*1 600*1 0.20 0.22
BLM15PX471SN1B
BLM15PX601SN1D
600±25％ 600 900*1 500*1 0.23 0.25
BLM15PX601SN1B
BLM15KD200SN1D
20±25% 20 3800*1 2350*1 0.011 0.016
BLM15KD200SN1B
BLM15KD300SN1D
30±25% 30 3100*1 1900*1 0.017 0.022
BLM15KD300SN1B
BLM15KD121SN1D
120±25% 120 1500*1 930*1 0.070 0.085
BLM15KD121SN1B
■Operating Temperature : -55°C to +125°C ■Storage Temperature : -55°C to +125°C
(Note) As for the Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
Operating Temperature (°C)
85 125
0
Rated Current (A)
at 85°C
Rated current
at 125°C
Rated current
Reference Onl Sgec.No.JENF243A70018AL701 \ I \ WWW?” Tab‘e 1
Spec.No.JENF243A-0018AL-01 P4/11
MURATA MFG.CO.,LTD.
Reference Onl
y
4.Style and Dimensions
■ Equivalent Circuit
■ Unit Mass(Typical value)
0.001g
5.Marking
No marking.
6.Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
7-2.Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance
And
Dimensions
Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
7-2-3 Bending
Strength It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
:Electrode
1.0±0.05 0.5±0.05
0.25±0.1
0.5±0.05
(in mm)
Resistance element becomes
dominant at high frequencies.
()
Appearance No damage
Impedance
Change
(at 100MHz) Within ±30%
DC
Resistance Meet item 3.
R0.5
Ｆ
Substrate
Ｆ
Side view
45mm
R340
F
Deflection
45mm Product
Pressure jig
SQeC.No.JEN F243A70018AL701 Table 2 Within 140%)
Spec.No.JENF243A-0018AL-01 P5/11
MURATA MFG.CO.,LTD.
Reference Only
No. Item Specification Test Method
7-2-4 Vibration Meet Table 1. It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-5 Resistance
to Soldering
Heat
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room conditionfor 48h±4h.
7-2-6 Drop Products shall be no failure
after tested. It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction(Total 9 times)
7ｰ2-7 Solderability The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle Meet Table 1. 1 cycle :
1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for
48h±4h.
7-3-2 Humidity Temperature : 40°C±2°C
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
7-3-3 Heat Life Meet Table 2.
Table 2
Temperature : 125°C±3°C
Applying Current : Rated Current(at 125°C)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
7-3-4 Cold
Resistance Meet Table 1. Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
(for BLM15PD
Within ±40%)
DC
Resistance Meet item 3.
SQeC.No.JEN F243A70018AL701 ||]:D|11| Top :ape % ber( -1 0000 ><><><>
Spec.No.JENF243A-0018AL-01 P6/11
MURATA MFG.CO.,LTD.
Reference Only
8.Specification of Packaging
8-1.Appearance and Dimensions (8mm-wide paper tape)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Top tape 5N min.
Bottom tape
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel 10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc)
∗1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking » ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is sticked on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(∗2) ,Quantity, etc)
F
165 to 180 degree Top tape
Bottom tape Base tape
0.8max.
0.65(Typ.)
1.15(Typ.)
(in mm)
2.0±0.05
2.0±0.05 4.0±0.1
φ
1.5
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.3
Direction of Feed
Reference Onl Sgec.No.JENF243A70018AL701
Spec.No.JENF243A-0018AL-01 P7/11
MURATA MFG.CO.,LTD.
Reference Onl
y
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
(in mm)
8-4.
Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
∗ Above Outer Case size is typical. It depends on a quantity of an order.
9. ！ Caution
9-1.
Surge current
Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
10.Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
• Standard land dimensions (Reflow soldering)
< For BLM15 series (except BLM15P
□
,
BLM15AX, BLM15KD type) >
(in mm)
Soldering a b c
Reflow 0.4 1.2 0.5
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Top tape
+1
-0
Label
W
D
Label
H
Chip Ferrite Bead
Solder Resist
Pattern
c
b
a
SQec.No.JEN F243A70018AL701
Spec.No.JENF243A-0018AL-01 P8/11
MURATA MFG.CO.,LTD.
Reference Only
< For BLM15P
□
,
BLM15AX, BLM15KD type >
Rated
Current
(A) a b c
Land pad thickness
and dimension d
18µm 35µm 70µm
1.5 Max 0.4 1.2 0.5 0.5 0.5 0.5
2.2 Max 1.2 0.7 0.5
3.0 Max 2.4 1.2 0.5
(in mm)
∗The excessive heat by land pads may cause
deterioration at joint of products with substrate.
10-2.Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) Soldering profile
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
10-3. Reworking with soldering iron
• Pre-heating: 150°C, 1 min • Soldering iron output: 80W max.
• Tip temperature: 350°C max. • Tip diameter:φ3mm max.
• Soldering time : 3(+1,-0) seconds. • Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
ｄ
Chip Ferrite Bead
Solder Resist
Pattern
ｃ
ａ
ｂ
Sgec.N0.JEN F243A70018AL701 NE“? l loooot )0000( BTU m ‘1 A > D is valtd when slvess ts added vemcally to (he perlorahcn If a Cuflmg Dtsc ts used‘ stress th be dtagonal lo the PCB, th (3) Mounhng Components Neal Screw Hotes When a componem is mounted near a screw hate, it may be the tightening of the screw. Mount the componenl m a posm @EEIJ-MJZI] 10a6.Mounting density Add speeiat attenhon Io radtating heat cl products when mountm The excesswe heat by other pvoducts may cause deteneratton a MURATA MFG.CO.,LT
Spec.No.JENF243A-0018AL-01 P9/11
MURATA MFG.CO.,LTD.
Reference Onl
y
10-4.Solder Volume
Solder shall be used not to be exceed as shown below.
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3)
Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
10-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
Recommendable
Upper Limit
t
〈
Poor example
〉〈
Good example
〉
b
a
Perforation
Slit
A
B
C
D
Screw Hole
Recommended
SQeC.N0.JEN F243A70018AL701
Spec.No.JENF243A-0018AL-01 P10/11
MURATA MFG.CO.,LTD.
Reference Only
10-7.Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8.Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
10-9.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
•Isopropyl alcohol (IPA)
2.Aqueous agent
•PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
10-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
• Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
SQec.No.JEN F243A70018AL701 A
Spec.No.JENF243A-0018AL-01 P11/11
MURATA MFG.CO.,LTD.
Reference Only
11. ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.