NXP USA Inc. 的 BB174 规格书

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1. Product profile

1.1 General description

The BB174 is a variable capacitance diode, fabricated in planar technology, and

encapsulated in the SOD523 (SC-79) ultra small SMD plastic package.

1.2 Features and benefits

Excellent linearity

Ultra small SMD plastic package

Cd(28V) = 2.1 pF; Cd(1V) to Cd(28V) ratio = 9

Low series resistance

1.3 Applications

Voltage Controlled Oscillators (VCO)

2. Pinning information

[1] The marking bar indicates the cathode.

3. Ordering information

BB174

VHF variable capacitance diode

Rev. 1 — 25 March 2013 Product data sheet

Table 1. Pinning

Pin Description Simplified outline Symbol

1 cathode [1]

2 anode

sym008

Table 2. Ordering information

Type number Package

Name Description Version

BB174 SC-79 plastic surface-mounted package; 2 leads SOD523

Product data sheet Rev. 1 — 25 March 2013 2 of 8

NXP Semiconductors BB174

VHF variable capacitance diode

4. Marking

5. Limiting values

6. Characteristics

[1] See Figure 2.

[2] See Figure 1 and Figure 3.

Table 3. Marking

Type number Marking code

BB174 CF

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRreverse voltage - 30 V

peak value in series with a 10 k resistor - 35 V

IFforward current - 20 mA

Tstg storage temperature 55 +150 C

Tjjunction temperature 55 +125 C

Table 5. Characteristics

Tj = 25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IRreverse current VR=30V [1] --10nA

VR=30V; T

j=85C[1] --200nA

rsdiode series resistance f = 470 MHz; Cd= 9 pF - 0.6 0.75 

Cddiode capacitance f = 1 MHz [2]

VR= 1 V 18.22 - 21.26 pF

VR= 28 V 1.951 2.1 2.225 pF

Cd(1V)/Cd(2V) diode capacitance ratio

(1Vto2V) f=1MHz - 1.27 -

Cd(1V)/Cd(28V) diode capacitance ratio

(1Vto28V) f = 1 MHz 8.45 9 10.9

Cd(25V)/Cd(28V) diode capacitance ratio

(25 V to 28 V) f=1MHz - 1.05 -

Product data sheet Rev. 1 — 25 March 2013 3 of 8

NXP Semiconductors BB174

VHF variable capacitance diode

f=1MHz; T

j=25C.

Fig 1. Diode capacitance as a function of reverse voltage; typical values.

Tj=0C to 85 C.

Fig 2. Reverse current as a function of junction

temperature; maximum values. Fig 3. Diode capacitance temperature coefficient as a

function of reverse voltage; typical values.

mbk440

(pF)

VR (V)

10−1102

101

001aae541

102

103

(nA)

Tj (°C)

0 1008040 6020

VR (V)

10−1102

101

001aag774

10−3

10−4

10−2

TCCd

(K−1)

10−5

S®W

Product data sheet Rev. 1 — 25 March 2013 4 of 8

NXP Semiconductors BB174

VHF variable capacitance diode

7. Package outline

Fig 4. Package outline SOD523 (SC-79)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOD523 SC-79 02-12-13

06-03-16

Plastic surface-mounted package; 2 leads SOD523

0 0.5 1 mm

scale

Ebp

vMA

UNIT bpcDEv

DIMENSIONS (mm are the original dimensions)

Note

1. The marking bar indicates the cathode.

(1) 0.34

0.26 0.17

0.11 0.1

0.85

0.75

1.25

1.15

0.65

0.58 1.65

1.55

Product data sheet Rev. 1 — 25 March 2013 5 of 8

NXP Semiconductors BB174

VHF variable capacitance diode

8. Abbreviations

9. Revision history

Table 6. Abbreviations

Acronym Description

SMD Surface Mounted Device

VHF Very High Frequency

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BB174 v.1 20130325 Product data sheet - -

Product data sheet Rev. 1 — 25 March 2013 6 of 8

NXP Semiconductors BB174

VHF variable capacitance diode

10. Legal information

10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

10.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

: hitE:I/www.nxg.com salesaddresses®nx9£0m

Product data sheet Rev. 1 — 25 March 2013 7 of 8

NXP Semiconductors BB174

VHF variable capacitance diode

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

10.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

11. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BB174

VHF variable capacitance diode

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 March 2013

Document identifier: BB174

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

12. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5

10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6

10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6

10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

10.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11 Contact information. . . . . . . . . . . . . . . . . . . . . . 7

12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

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