Panasonic Electronic Components 的 EXB24V Spec 规格书

(a m L0H Inc-Tn Panasonic
Issue No. : 151EXB013016
Date of Issue :
Classification : New Changed
:Chip Resistor Array
:EXB24V****X
EXB24V****FX
: JAPAN, CHINA
:Standard electronic equipment
*If you approve this specification, please fill in and sign the below and return 1 copy to us.
Approval No :
Approval Date :
Executed by :
(signature)
Title :
Dept. :
Circuit Components Business Division
Automotive & Industrial Systems Company Prepared by : Morita factory Engineering group
Panasonic Corporation Contact Person :
Signature
401 Sadamasa-cho, Name(Print) H.Yabukoshi
Fukui City 910-8502 Japan Title :
Phone : +81-776-56-8034 Authorized by :
Signature
Name(Print) Y.Morimoto
Title : Manager of Engineering
May 10.2013
Digi-Key
Applications
P
RODUCT SPECIFICATION FOR APPROVA
L
Product Description
Product Part Number
Country of Origin
Part No. e 2 D l l t <>< 1="" fi="" alumina="" (4)termina="" (5)termination="" (6)="" termina="" \v="" (inner)="" (between)="" (outer)="" \="" l="" ag="" or="" ag/pd="" .="" .="" .="" .="" \="" ‘&="" sideiresin+metal="" ni="" plating="" bn="" plating="" l="" w="" t="" a="" b="" dimension(mm)="" 1.001010="" 1.001010="" 0.351010="" 0.4010.10="" 0.1810.10="" d="" p="" c="" (="" )="" 1="" reference="" dimension(mm)="" (0.30)="" (0.65)="" 02510.10="" 2.="" power="" derating="" curve="" a="" o="" 7330="" x="" 5="" nb="" so="" of="" med="" dissipation="" m="" :1="" a="" category="" temperature="" range="" '55°c="" to="" +125”c="" 125m="" '50="" 740="" 720="" o="" 20="" 40="" so="" so="" 100="" 120140="" 160="" 3.="" ratings="" ambient="" temperaturevn="" fig.="" 1="" item="" rated="" value="" (explanation)="" rated="" dissipation="" 0.063="" w="" element="" when="" used="" at="" ambient="" temperature="" over="" 70="" dc,="" the="" rated="" dissipatio="" should="" be="" reduced="" as="" shown="" in="" fig.1="" rated="" voltage="" &="" rated="" continuous="" working="" voltage="" (rcwv)="" the="" rated="" voltage="" of="" each="" resistor="" should="" be="" calculated="" from="" the="" equation="" below,="" and="" when="" the="" rated="" voltage="" exceeds="" the="" limiting="" element="" voltage,="" the="" limiting="" element="" voltage="" should="" the="" maximum="" working="" voltage.="" e="" z-vp="" x="" r="" limiting="" element="" voltage="" 1="" 50="" v="" e3="" rated="" voltage(v).="" pi="" rated="" dissipation(w).="" ri="" rated="" resistance(q="" chip="" jumper="" 1="" rated="" current="" 1="" a="" panasonic="" corporation="">
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-24V01VE
Part No.
EXB24V
8-1
Panasonic Corporation
1. Dimension
L W T A B
Dimension(mm) 1.00±0.10 1.00±0.10 0.35±0.10 0.40±0.10 0.18±0.10
D P C
Dimension(mm) (0.30) (0.65) 0.25±0.10
2. Power derating curve
100
80
60
40
20
0
20
0120100-40 -20-60 806040 140 160
-55°C70°C
125°C
Ambient Temperature(°C)
Fig. 1
% of rated dissipation
Category temperature range
-55°C to +125°C
3. Ratings
Item Rated value (Explanation)
Rated Dissipation
0.063 W / element
When used at ambient temperature over 70 °C, the rated dissipation
should be reduced as shown in Fig.1
Rated voltage
&
Rated Continuous
Working Voltage
(RCWV)
The rated voltage of each resistor should be calculated from the
equation below, and when the rated voltage exceeds the limiting
element voltage, the limiting element voltage should the maximum
working voltage.
E = P × R Limiting element voltage : 50 V
E: Rated voltage(V), P: Rated dissipation(W), R: Rated resistance(Ω))
Chip jumper : Rated current 1 A
(1)Substrate (2)Protective
coating
(3)Resistive
element
A
lumina Resin Metal glaze
(4)Termination
(Inner)
(5)Termination
(Between)
(6) Termination
(Outer)
A
g or Ag/Pd
Side:Resin+Metal Ni Plating Sn Plating
( ) : Reference
T
W
L
P
A
B
2-φD
B
C
C
(1) (2) (3) (4) (5) (6)
a
a’
a-a’ sectional
Part No. Sign Resistance Tolerance i i Sign Resistance range Series Digit 9 M9 9 M9 Q DDODDDDD Thick Film Chip 0402 sola DU Resistance Value T ranc :— 4 2 resistors w (I /‘ Packaging Code Taping K} K,
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-24V01VE
Part No.
EXB24V
8-2
Panasonic Corporation
Item Rated value (Explanation)
Resistance
Tolerance
Resistance range
* F: Part number is only by 4 digits
4. Explanation of part number
E X B 2 4 V 1 0 2 J X
Thick Film Chip
Resistor Networks
0402
Array
Convex
Terminal
Isolated
Circuit
Resistance Value Tolerance
Packaging
Number of terminals
R 0 0 0
Chip Jumper
5. Appearance & Construction
Item Explanation
Appearance &
Construction
1.The resistive element should be covered with protective coating
that
do not fade easily. The surface of coating should avoid unevenness,
flaw, pinhole and discoloration.
2.The electrode should be printed uniformly, as shown in the
dimensions. The plating should not fade easily, and should avoid
unevenness, flaw, pinhole, projection and discoloration.
3.The electrode should be connected electrically, mechanically to
resistive element.
4.Substrate should not have chipping, flaw, flash and crack.
As far as there shall not designation especially, the following tests and measurement shall
be operated under the following conditions.
Ambient temperature : 15 oC to 35 oC
Relative humidity : 25 % to 75 %
Atmospheric pressure : 86k Pa to 106k Pa
# Jumper shall be guaranteed in measuring put on upper interelectrode.
Packaging Code
Taping
(10,000pcs/reel) X
4 Terminal 2 resistors
Circuit
12
43
Sign Resistance Tolerance
F ±1%
J ±5%
0 Chip Jumper
Sign Resistance range Series Digit
*F 10 Ω to 1.0 MΩ E-24,E-96 4 digits
J 10 Ω to 1.0 MΩ E-24 3 digits
0 Less than 50 mΩ -
Part No. Resistor Jumper DC wi be Measuring Voltage: refer to JIS'C52lll-1 Resistance TCR Resistors shall be applied 2.5 times the rated No evidence of tlashnver. AC 100V between substrate and termination Insulation resistance between substrate and Resistor Jumper Less than Resistors shall be dipped in the melted solder covered shall in solder Q ° 1 ° : Resistors shall be subjected to a single 1.5 y d Hz
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-24V01VE
Part No.
EXB24V
8-3
Panasonic Corporation
6. Performance Specification
Specification
Item Resistor Jumper
Test methods
DC resistance DC resistance value shall be
within the specified tolerance
Measuring voltage: refer to JIS-C5201-1
At 20 °C, 65 % Relative humidity
Resistance TCR
10Ω to 1MΩ ±200×10-6 / °C
Temperature
coefficient
Chip jumper :
Less than 50 mΩ
Natural resistance change per temperature
degree centigrade.
R
2 - R1
R
1×(t2 - t1)
R
1 : Resistance value at reference
temperature(t
1)
R
2 : Resistance value at test
temperature(t
2)
t
2 - t1 = 100 °C, t1 = 25 °C
Overload ±(2 %+0.1 Ω) Less than
50 mΩ
Resistors shall be applied 2.5 times the rated
voltage for 5 seconds.
However, the upper limit of the voltage in the
test shall be 100V.
In addition, the current applied to the jumper
in the test shall be 2A.
Dielectric
Withstanding
No evidence of flashover,
mechanical damage, arcing or
insulation breakdown.
A
C 100V between substrate and termination
for 1 minute.
Insulation
resistance
Min. 1,000 MΩ Insulation resistance between substrate and
termination shall be measured at DC 100V.
7. Mechanical characteristic
Specification
Item Resistor Jumper
Test methods
No mechanical damage
Adhesion
±(1 %+0.05 Ω) Less than
50 mΩ
Load of 9.8N shall be applied to a side of
resistor for 10s, which is placed on printing
board
Printing board: Glass epoxy (t = 1.0 mm)
No mechanical damage
Bend strength of
the face plating ±(1 %+0.05 Ω) Less than
50 mΩ
Substrate: Glass epoxy(t = 1.0 mm)
Span: 90 mm
Bending distance: 3 mm (10 seconds)
Solderability
Termination should be covered
uniformly with solder.
(min. 95 % coverage)
Resistors shall be dipped in the melted solder
bath at 235 °C ± 5 °C for 2 s ± 0.5 s. Flux shall
be removed from the surface of termination
with clean organic solvent.
Resistance to
soldering heat ±(1 %+0.05 Ω) Less than
50 mΩ
Resistors shall be dipped in the melted solder
bath at 270 °C ± 5 °C for 10s ± 1s.
Vibration ±(1 %+0.05 Ω) Less than
50 mΩ
Resistors shall be subjected to a single
vibration having as double amplitude of 1.5
mm for 2 hours in each three mutually
perpendicular directions for total 6 hours.
The vibration frequency shall be varied
uniformly 10 Hz to 55 Hz and return to 10 Hz
traversing for 1 minute.
TCR=
Part No. Resistor Jumper Without distinct deformation in Resistor Jumper Endurance at upper 2 DC and humidity C for the 60 °C 1 2 DC and for 1000 hours Voltage 5
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-24V01VE
Part No.
EXB24V
8-4
Panasonic Corporation
Specification
Item Resistor Jumper
Test methods
Without distinct deformation in
appearance
Solvent resistance
±(0.5 %+0.05 Ω) Less than
50 mΩ
Solvent solution: Isopropyl alcohol
(1) Dipping 10 hours ± 1 hour, dry in room
condition for 30 min ± 10 min.
(2) Ultrasonic wave washing: 5 min ± 1 min
(0.3 W/cm2, 28 kHz)
Dry in room condition for 30 min ± 10 min.
8. Environmental Test
Specification
Item Resistor Jumper
Test methods
Low temperature
exposure ±(1 %+0.05 Ω) Less than
50 mΩ
Resistors shall be exposed at -55 °C ± 3 °C for
1000 hours hours
Endurance at upper
category
temperature
±(1 %+0.05 Ω) Less than
50 mΩ
Resistors shall be exposed at +125 °C±3 °C for
1000 hours hours.
Temperature
cycling ±(1 %+0.05 Ω) Less than
50 mΩ
-55 °C ± 3 °C, 30 minutes
↑↓
Nominal temp., 30minutes 25cycles
↑↓
+125 °C ± 3 °C, 30minutes
Humidity
(Steady state) ±(1 %+0.05 Ω) Less than
50 mΩ
Resistors shall be exposed at 60 °C ± 2 °C and
90 % to 95 % relative humidity in a humidity
test chamber for 1000 hours hours.
Endurance at 70 °C ±(3 %+0.1 Ω) Less than
50 mΩ
Resistors shall be exposed at 70 °C ± 2 °C for
1000 hours hours. During this time, the
rated voltage shall be applied intermittently
for 1.5 hours ON, 0.5 hour OFF.
Load life in
humidity ±(3 %+0.1 Ω) Less than
50 mΩ
Resistor shall be exposed at 60 °C ± 2 °C and
90 % to 95 % relative humidity for 1000 hours
hours. During this time, the rated voltage
shall be applied intermittently for 1.5 hours
ON, 0.5 hour OFF.
9. Resistance value marking
No marking.
+48
0
+48
0
+48
0
+48
0
+48
0
Part No. A (1) This specification shows the quality and performance of a unit component. Before adoption. be
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-24V01VE
Part No.
EXB24V
8-5
Panasonic Corporation
10. Common precautions in handling resistors
Notice for use
(1) This specification shows the quality and performance of a unit component. Before adoption, be
sure to evaluate and verify the product mounting it in your product.
(2) We take no responsibility for troubles caused by the product usage that is not specified in
this specification.
(3) In advance-notification to us is required in case you demand high reliability in the resistors
because there is a possibility that a trouble or a failure in our resistor which is used in your
transportation units (e.g. Trains, cars, ships, traffic signal equipment etc.), ocean
floor-equipment, medical equipment, aerospace equipment, electrothermal goods, combustion
and gas equipment, power station control equipment, information control equipment, rotating
equipment, disaster and crime preventive equipment, various safety devices, and the equivalent
equipment may cause critical damage occurrence such as loss of life or property.
In addition, use fail-safe design as mentioned below for preventing extensive damage and for
ensuring the safety:
*Ensure safety by the system in which the protective circuits and/or protective equipment are
installed.
*Ensure safety by the system in which a single failure does not cause unsafety by installing
such as redundant circuits.
(4) When a dogma shall be occurred about safety for this product, be sure to inform us rapidly,
operate your technical examination.
(5) The product is designed to use in general standard applications of general electric
equipment (AV products, household electric appliances, office equipment, information and
communication equipment, etc.); hence, it do not take the use under the following special
environments into consideration.
Accordingly, the use in the following special environments, and such environmental
conditions may affect the performance of the product; prior to use, verify the performance,
reliability, etc. thoroughly.
1) Use in liquids such as water, oil, chemical, and organic solvent.
2) Use under direct sunlight, in outdoor or in dusty atmospheres.
3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
4) Use in environment with large static electricity or strong electromagnetic waves or
strong radial ray.
5) Where the product is close to a heating component, or where an inflammable such as
a polyvinyl chloride wire is arranged close to the product.
6) Where the resistor is sealed or coated with resin etc.
7) Where solvent, water, or water-soluble detergent is used in cleaning free soldering and in
flux cleaning after soldering. (Pay particular attention to water-soluble flux.)
8) Use in such a place where the product is wetted due to dew condensation.
(6) If transient load (heavy load in a short time) like pulse is expected to be applied, carry out
evaluation and confirmation test with resistors actually mounted on your own board.
When the load of more than rated power is applied under the load condition at steady state, it
may impair performance and/or reliability of resistor. Never exceed the rated power and
rated voltage. Temperature of resistors may become high even with specified conditions. Please
confirm safety of heat from resistors on print circuit board and components around them.
When the product shall be used under special condition, be sure to ask us in advance.
(7) Halogen type (Chlorine type, Bromine type, etc.) or other high-activity flux is not
recommended as the residue may affect performance or reliability of resistors.
Strong acid flux, water soluble-flux and flux including fluorine ion shall not be used.
(8) When soldering with soldering iron, never touch the body of the chip resistor with a tip of
the soldering iron. When using a soldering iron with a tip at high temperature, solder for a
time as short as possible. (three seconds or less up to 350 deg.C)
(9) Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of
pliers or tweezers) as it may damage protective film or the body of resistor and may affect
resistor’s performance.
(10) Avoid immersion of chip resistor in solvent for long time. Use solvent after the effect of
immersion is confirmed.
(11)Reflow soldering method shall apply to this product in principle.
!
Part No.
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-24V01VE
Part No.
EXB24V
8-6
Panasonic Corporation
11. Storage method
If the product is stored in the following environments and conditions, the performance and
solderability may be badly affected. Avoid the storage in the following environments.
(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
(2) Storage in places exposed to direct sunlight.
(3) Storage in places outside the temperature range of 5 oC to 35 oC and humidity range of
45% relative hummidity to 85 % relative hummidity.
(4) Storage over a year after our delivery (This item also applies to the case where the
storage method specified in item (1) to (3) has been followed.).
12. Laws and Regulations
(1) This product has not been manufactured with any ozone-depleting chemical controlled
under the Montreal Protocol.
(2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment (DIRECTIVE 2002/95/EC)).
(3) All materials used in this part are registered material under the Law Concerning the
Examination and Regulation of Manufacturs, etc. of Chemical substances.
(4) All the materials used in this part contain no brominated materials of PBBOS or PBBS as
the flame-retardant.
(5) If you need the notice by letter of “A preliminary judgement on the Laws of Japan foreign
exchange and Foreign Trade control”, be sure to let us know.
13. Production Place
Production Country : Japan
Production Plant : Circuit Components Business Division, Panasonic Corporation
Production Country : China
Production Plant : Panasonic Industrial Devices (Tianjin) Co., Ltd. (PIDTJ)
¢DO P0 P2 P1
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-24V01VE
Part No.
EXB24V
8-7
Panasonic Corporation
14. Tape and Reel Package
14-1. Physical Dimensions
Structure and reel dimensions shall be as shown in the figure below.
Inaccordance with EIAJ ET-7200.
14-2. Carrier Tape Dimensions
Sprocket Hole
Chip Hole
P1
P0 P2
A
φD0
E
W
F
T
B
Chip Resistor Array
A B W F E
(mm) 1.20±0.10 1.20±0.10 8.00±0.20 3.50±0.05 1.75±0.10
P1 P2 P0 T φD0
(mm) 2.00±0.10 2.00±0.05 4.00±0.10 0.52±0.05 1.50
14-3. Specification
14-3-1. Taping
(1) When the test shall be operated with the below conditions, peel strength should be
0.049N
to 0.49N, should not have flash and tear after peeling.
<Test Method>
(2) Minimum Bending Radius
When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip
and no break of carrier tape. However minimum bending radius shall be tested for 1
times.
+0.10
0
Peeling Direction
Top Tape
10°
Carrier Tape
Carrier ta
p
e
To
ta
e
Adhesive ta
p
e Unit : mm
Min. 60.0
11.4 +/- 1.0
9.0 +/- 1.0
180.0 +0 / -3.0
13.0 +/- 1.0
Min. 60.0
Part No. Marking
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-24V01VE
Part No.
EXB24V
8-8
Panasonic Corporation
(3) Resistance to climate
When resistors shall be exposed at 60 °C ± 2 °C, 90 % to 95 % relative hummidity for 120
hours, no defection of chip and no break off carrier tape.
When the top tape shall be peeled, tape should not have flash and tear.
14-3-2. Quantity in Taping: 10,000 pcs. / reel
14-3-3. Tape packaging
(1) Resistor side shall be facing upward.
(2) Chip resistor shall not be sticking to top tape and bottom tape.
(3) Chip resistors shall be easy to take out from carrier tape and chip hole or sprocket hole
shall not have flash and break.
14-4. Outer Packaging
Quantity: 20 reels(Max.200,000 pcs.)
Tape
Marking
(1) When packaging quantity does not reach max quantity, the remaining empty space shall
be buried with buffer material.
(2) When quantity shall be few, alternative packaging methods may used. No problem must
occur during the exportation of the product..
14-5. Marking (Label)
Items listed below shall be displayed.
• Side of reel (Marking shall be on one side.)
(1)Part name (2)Part number (3)Quantity (4)Lot number (5)Maker name
(6)Production country
•Packaging box
(1)Customer name (2)Part name (3)Part number (4)Customer part number
(5)Quantity (6)Maker name (7) Production country
Resin Chipping Terminal Chipping / \ X / One pin Pin Hole / resistor %7 ¢ 3 0.2 1' ¢ 9 eA \ / Flash A S 100 I ‘X »We Pana
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
Attached Sheet
APPEARANCE QUALITY CRITERIA
1-1
Panasonic Corporation
Item Defect Criteria Appearance Criteria Remark
Resin Chipping
A ≤ W/8
B ≤ C/2
Both side chipping
shall be judged defect
Terminal Chipping A ≤ C/4
B ≤ Top terminal width
Pin Hole
One pin hole /
chip resistor
φ ≤ 0.2 mm
This item is applied to
pin holes which reach
to the resistive
materials
Flash
A ≤ 100 μm
W
A
B
C
φ
A
A
A
B
Oblique line show
chipping
C