Littelfuse Inc. 的 ZEN056V230A16LS Spec 规格书

% Littelfuse‘ |
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V230A16LS
DOCUMENT: SCD27327
REV LETTER: F
REV DATE: JULY 26, 2016
PAGE NO.: 1 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
Specification Status: Released
GENERAL DESCRIPTION
Littelfuse PolyZen devices are polymer
enhanced, precision Zener diode micro-
assemblies. They offer resettable
protection against multi-Watt fault events
without the need for multi-Watt heat sinks.
The Zener diode used for voltage clamping
in a PolyZen micro-assembly was selected
due to its relatively flat voltage vs current
response. This helps improve output voltage clamping, even
when input voltage is high and diode currents are large.
An advanced feature of the PolyZen micro-assembly is that the
Zener diode is thermally coupled to a resistively non-linear,
polymer PTC (positive temperature coefficient) layer. This PTC
layer is fully integrated into the device, and is electrically in
series between VIN and the diode clamped VOUT.
This advanced PTC layer responds to either extended diode
heating or overcurrent events by transitioning from a low to
high resistance state, also known as” tripping”. A tripped PTC
will limit current and generate voltage drop. It helps to protect
both the Zener diode and the follow on electronics and
effectively increases the diode’s power handling capability.
The polymer enhanced Zener diode helps protect sensitive
portable electronics from damage caused by inductive voltage
spikes, voltage transients, incorrect power supplies and
reverse bias. These devices are particularly suitable for
portable electronics and other low-power DC devices.
BENEFITS
Stable Zener diode helps shield
downstream electronics from overvoltage
and reverse bias
Trip events shut out overvoltage and
reverse bias sources
Analog nature of trip events minimizes
upstream inductive spikes
Minimal power dissipation requirements
Single component placement
FEATURES
Overvoltage transient suppression
Stable VZ vs fault current
Time delayed, overvoltage trip
Time delayed, reverse bias trip
Multi-Watt power handling capability
Integrated device construction
RoHS Compliant
TARGET APPLICATIONS
DC power port protection in portable
electronics
DC power port protection for systems
using barrel jacks for power input
Internal overvoltage & transient
suppression
DC output voltage regulation
TYPICAL APPLICATION BLOCK DIAGRAM
GND
VIN
VOUT
Regulated
Output RLoad
Protected downstream
electronics
1
2
3
+
Power Supply
(External or Internal) PolyZen Protected Electronics
PolyZen
Device
GND
VIN
VOUT
Regulated
Output RLoad
Protected downstream
electronics
1
2
3
+
Power Supply
(External or Internal) PolyZen Protected Electronics
GND
VIN
VOUT
Regulated
Output RLoad
Protected downstream
electronics
1
2
3
+
Power Supply
(External or Internal) PolyZen Protected Electronics
PolyZen
Device
% Littelfuse“ | I E Polymer PTC
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V230A16LS
DOCUMENT: SCD27327
REV LETTER: F
REV DATE: JULY 26, 2016
PAGE NO.: 2 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
CONFIGURATION INFORMATION
Recommended Pad Dimensions
2
3
VIN
GND
VOUT
1
PIN DESCRIPTION
Pin Number
Pin Name
Pin Function
1
VIN
VIN. Protected input to Zener diode.
2
GND
GND
3
VOUT
VOUT. Zener regulated voltage output
BLOCK DIAGRAM
DEFINITION of TERMS
IPTC
Current flowing through the PTC portion of the
circuit
IFLT
RMS fault current flowing through the diode
IOUT
Current flowing out the VOUT pin of the device
Trip Event
A condition where the PTC transitions to a high
resistance state, thereby significantly limiting IPTC
and related currents, and significantly increasing
the voltage drop between VIN and VOUT.
Trip
Endurance
Time the PTC portion of the device remains both
powered and in a tripped state.
2.21 mm
(0.087”)
0.94 mm
(0.037”)
0.33 mm
(0.013”)
0.56 mm
(0.022”)
2.88 mm
(0.1135”)
0.56 mm
(0.022”)
0.94 mm
(0.037”)
2.21 mm
(0.087”)
0.94 mm
(0.037”)
0.33 mm
(0.013”)
0.56 mm
(0.022”)
2.88 mm
(0.1135”)
0.56 mm
(0.022”)
0.94 mm
(0.037”)
GND
VIN
VOUT
Zener
Diode
Polymer PTC
GND
VIN
VOUT
Zener
Diode
Polymer PTC
GND
IFLT
VIN
IOUT
IPTC
VOUT
GND
IFLT
VIN
IOUT
IPTC
VOUT
% Littelfuse“ |
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V230A16LS
DOCUMENT: SCD27327
REV LETTER: F
REV DATE: JULY 26, 2016
PAGE NO.: 3 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
GENERAL SPECIFICATIONS
Operating Temperature
-40º to +85ºC
Storage Temperature
-40º to +85ºC
ELECTRICAL CHARACTERISTICS1-3, 11 (Typical unless otherwise specified)
VZ4
(V)
Izt4
(A)
IHOLD5
@20ºC
(A)
Leakage Current
R Typ6
(Ohms)
R1Max7
(Ohms)
VInt Max8
(V)
IFLT Max9
Tripped Power
Dissipation10
Max
VINT
Max
(V)
Test
Current
(A)
IFLT
Max
(A)
Test
Voltage
(V)
Value
(W)
Test
Voltage
(V)
Min
Typ
Max
Test
Voltage
Max
Current
(mA)
5.45
5.6
5.75
0.1
2.3
5.25
10
0.04
0.06
16V
5A
+5
-40
+16
-12V
1.0
16
Note 1: Electrical characteristics determined at 25ºC unless otherwise specified.
Note 2:This device is intended for limited fault protection. Repeated trip events or extended trip endurance can degrade the
device and may affect performance to specifications. Performance impact will depend on multiple factors including, but not
limited to, voltage, trip current, trip duration, trip cycles, and circuit design. For details or ratings specific to your application
contact Littelfuse Circuit Protection directly.
Note 3:Specifications developed using 1.0 ounce 0.045” wide copper traces on dedicated FR4 test boards. Performance in
your application may vary.
Note 4:Izt is the current at which Vz is measured (VZ = VOUT). Additional VZ values are available on request.
Note 5:IHOLD : Maximum steady state IPTC (current entering or exiting the VIN pin of the device) that will not generate a trip
event at the specified temperature. Specification assumes IFLT (current flowing through the Zener diode) is sufficiently
low so as to prevent the diode from acting as a heat source. Testing is conducted with an “open” Zener.
Note 6:R Typ: Resistance between VIN and VOUT pins during normal operation at room temperature.
Note 7:R1Max: The maximum resistance between VIN and VOUT pins at room temperature, one hour after 1st trip or after reflow
soldering.
Note 8:VINT Max: VINT Max relates to the voltage across the PPTC portion of the PolyZen device (VIN-VOUT). VINT Max is
defined as the voltage (VIN-VOUT) at which typical qualification devices (98% devices, 95% confidence) survived at least 100
trip
cycles and 24 hours trip endurance at the specified voltage (VIN-VOUT) and current (IPTC). VINT Max testing is conducted
using a "shorted" load (VOUT = 0V). VINT Max is a survivability rating, not a performance rating.
Note 9:IFLT Max: IFLT Max relates to the stead state current flowing through the diode portion of the PolyZen device in a fault
condition, prior to a trip event. IFLT Max is defined as the current at which typical qualification devices (12 parts per lot from
3 lots) survived 100 test cycles. RMS fault currents above IFLT Max may permanently damage the diode portion of the PolyZen
device. Testing is conducted with NO load connected to VOUT, such that IOUT = 0. “Test voltage” is defined as the voltage
between VIN to GND and includes the PolyZen Diode drop. Specification is dependent on the direction of current flow through
the diode.
IFLT Max is a survivability rating, not a performance rating.
Note 10:The power dissipated by the device when in the “tripped” state, as measured on Littelfuse test boards (see note 3).
Note 11:Specifications based on limited qualification data and subject to change.
% Littelfuse‘ | \‘ W 7,, Ld Ld I o» l 02 T i“ H L‘ SOLDER REFLOW RECOMMENDATIONS: Classification Reflow Profiles Profile Feature Pb-Free Assembly Preheat - Temperature Min (Tsmin) 150 °C - Temperature Max (Tsmax) 200 °C Time maintained abnve: - Temperature (TL) 217 °C - Time (tL) 60-150 seconds (Tp) 260 °c Time within 5 °C of actual Peak Temperature (tp) 20-40 seconds Time 25 °C to Peak Temperature 8 minutes max.
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V230A16LS
DOCUMENT: SCD27327
REV LETTER: F
REV DATE: JULY 26, 2016
PAGE NO.: 4 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
MECHANICAL DIMENSIONS
SOLDER REFLOW RECOMMENDATIONS:
Classification Reflow Profiles
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
3° C/second max.
Preheat
• Temperature Min (Tsmin)
150 °C
• Temperature Max (Tsmax)
200 °C
• Time (tsmin to tsmax)
60-180 seconds
Time maintained above:
• Temperature (TL)
217 °C
• Time (tL)
60-150 seconds
Peak/Classification Temperature
(Tp)
260 °C
Time within 5 °C of actual Peak
Temperature (tp)
20-40 seconds
Ramp-Down Rate
6 °C/second max.
Time 25 °C to Peak Temperature
8 minutes max.
Min
Typical
Max
Length
L
3.85 mm
(0.152”)
4 mm
(0.16”)
4.15
mm
(0.163")
Width
W
3.85 mm
(0.152”)
4 mm
(0.16”)
4.15
mm
(0.163")
Height
H
1.4mm
(0.055”)
1.7 mm
(0.067”)
2.0 mm
(0.081”)
Length
Diode
Ld
-
3.0 mm
(0.118”)
-
Height
Diode
Hd
-
1.0 mm
(0.039”)
-
Offset
O1
-
0.6 mm
(0.024”)
-
Offset
O2
-
0.7 mm
(0.028”)
-
% Littelfuse‘ | PACKAGING w m AH A u 21 2 MW . .35 ”3712 23.4; um“ cm In m :uusum H mm) W: (msum M M) AH U‘mmmmvh m Mmmm
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V230A16LS
DOCUMENT: SCD27327
REV LETTER: F
REV DATE: JULY 26, 2016
PAGE NO.: 5 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
PACKAGING
Packaging
Tape & Reel
Standard Box
ZENXXXVXXXAXXLS
3,000
15,000
Reel Dimensions for PolyZen Devices
Amax = 330
Nmin = 102
W1 = 8.4
W2 = 11.1
Matte Finish These Area
Amax
Nmin
Matte Finish These Area
Amax
Nmin
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PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V230A16LS
DOCUMENT: SCD27327
REV LETTER: F
REV DATE: JULY 26, 2016
PAGE NO.: 6 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
Taped Component Dimensions for PolyZen Devices
TYPICAL CHARACTERISTICS
% Littelfuse‘ |
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V230A16LS
DOCUMENT: SCD27327
REV LETTER: F
REV DATE: JULY 26, 2016
PAGE NO.: 7 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
Typical Fault Response:
ZEN056V230A16LS
16V, 5.0A Current Limited Source (IOUT = 0)
0
5
10
15
20
0.00 0.04 0.08 0.12 0.16 0.20
Time (s)
V (V) or I (A)
Vin (V)
Vout (V)
I FLT (A)
Pulse IV (300uSec Pulse)
2
3
4
5
6
7
8
0.00001
0.0001
0.001
0.01
0.1
1
Current: IFLT (A)
Voltage: VOUT (V)
ZEN056VxxxAxxLS
Pulse IV (300uSec Pulse)
-10
-5
0
5
10
-2 0 2 4 6 8
Voltage: VOUT (V)
Current: IFLT (A)
ZEN056VxxxAxxLS
VOUT Peak Vs IFLT RMS (IOUT = 0)
4.0
4.5
5.0
5.5
6.0
6.5
7.0
0 1 2 3 4 5
IFLT RMS(A)
VOUT Peak (V)
ZEN056V230A16LS
Time to Trip Vs IFLT RMS (IOUT = 0)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 1 2 3 4 5
IFLT RMS (A)
Time To Trip (Sec)
ZEN056V230A16LS
% Littelfuse‘ |
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V230A16LS
DOCUMENT: SCD27327
REV LETTER: F
REV DATE: JULY 26, 2016
PAGE NO.: 8 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
VOUT Peak Vs IFLT (IOUT = 0)
-1.20
-1.00
-0.80
-0.60
-0.40
-0.20
0.00
-50 -40 -30 -20 -10 0
IFLT RMS(A)
VOUT (V)
ZENxxxV230A16LS
Time to Trip Vs IFLT (IOUT = 0)
0.00
0.01
0.10
1.00
10.00
100.00
-50 -40 -30 -20 -10 0
IFLT RMS (A)
Time To Trip (Sec)
ZENxxxV230A16LS
Temperature Effect on IHold (IFLT = 0)
0.0
1.0
2.0
3.0
4.0
-40 -20 0 20 40 60 80 100
Ambient Temperature (C)
IHold (A)
ZENxxxV230A16LS
Linear
(ZENxxxV230A16LS)
Time to Trip Vs IPTC (IFLT = 0)
0.001
0.01
0.1
1
10
100
1000
010 20 30 40
IPTC RMS (A)
Time To Trip (Sec)
ZEN056V230A16LS
% Littelfuse“ | ogen Fr Directive 2002195IEC Direclive 2000/53/50 H F Compliant Complianl
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V230A16LS
DOCUMENT: SCD27327
REV LETTER: F
REV DATE: JULY 26, 2016
PAGE NO.: 9 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
Temperature Effect on RTyp
0.00
0.03
0.05
0.08
0.10
20 40 60 80
Ambient Temperature (C)
RTyp (Ohms)
ZEN056V230A16LS
Materials Information
ROHS Compliant ELV Compliant Pb-Free Halogen Free*
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-
sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of
the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties
granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for
any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and
use of Littelfuse products is subject to Littlefuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse
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