Texas Instruments 的 BQ2945xx 规格书

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BQ2945xy Overvoltage Protection For 2-Series and 3-Series Cell Li-Ion Batteries

1 Features

• 2-series and 3-series cell overvoltage monitor for

secondary protection

• Fixed programmable delay timer

• Fixed OVP threshold

– Available range from 3.85 V to 4.6 V

• Fixed OVP delay option: 4 s or 6.5 s

• High-accuracy overvoltage protection:

±10 mV

• Low power consumption ICC ≈ 1 µA

(VCELL(ALL) < VPROTECT)

• Low leakage current per cell input < 100 nA

• Small package footprint

– 6-pin SON

2 Applications

• Second-Level Protection in Li-Ion Battery Packs in:

– Tablets

– Slates

– Power Tools

– Notebook Computers

– Portable Equipment and Instrumentation

3 Description

The BQ2945xy family of products is a secondary-level

voltage monitor and protector for Li-ion battery pack

systems. Each cell is monitored independently for

an overvoltage condition. Based on the configuration,

an output is triggered after a fixed delay if any of

the two or three cells has an overvoltage condition.

This output is triggered into a high state after an

overvoltage condition satisfies the specified delay

timer.

Device Information

PART NUMBER(1) PACKAGE BODY SIZE (NOM)

BQ2945xy SON (6) 2.00 mm × 2.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

VCELL1

VCELL3

VCELL2

OUT

VDD

VSS

RIN

Pack +

Pack–

RIN

CIN

CVD

RVD

PWRPAD

Simplified Schematic

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

I TEXAS INSTRUMENTS

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................4

7 Specifications.................................................................. 5

7.1 Absolute Maximum Ratings........................................ 5

7.2 ESD Ratings............................................................... 5

7.3 Recommended Operating Conditions.........................5

7.4 Thermal Information....................................................5

7.5 Electrical Characteristics.............................................6

7.6 Typical Characteristics................................................ 7

8 Detailed Description........................................................8

8.1 Overview..................................................................... 8

8.2 Functional Block Diagram........................................... 8

8.3 Feature Description.....................................................8

8.4 Device Functional Modes............................................9

9 Layout.............................................................................13

9.1 Layout Guidelines..................................................... 13

9.2 Layout Example........................................................ 13

10 Device and Documentation Support..........................14

10.1 Device Support....................................................... 14

10.2 Receiving Notification of Documentation Updates..14

10.3 Support Resources................................................. 14

10.4 Trademarks............................................................. 14

10.5 Electrostatic Discharge Caution..............................14

10.6 Glossary..................................................................14

11 Mechanical, Packaging, and Orderable

Information.................................................................... 14

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (December 2017) to Revision I (May 2021) Page

• Changed the BQ294506 device to Production Data...........................................................................................3

Changes from Revision G (November 2017) to Revision H (December 2017) Page

• Added the BQ294506 device..............................................................................................................................3

• Added the BQ294506 device to the Electrical Characteristics .......................................................................... 6

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021 www.ti.com

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

I TEXAS INSTRUMENTS

5 Device Comparison Table

TAPART NUMBER OVP (V) DELAY TIME (s)

–40°C to +110°C

BQ294502 4.35 4

BQ294504 4.35 6.5

BQ294506 4.38 4

BQ294512 4.4 4

BQ294522 4.45 4

BQ294524 4.45 6.5

BQ294532 4.5 4

BQ294533 4.5 6.5

BQ294582 4.225 4

BQ294592 4.3 4

www.ti.com

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

I TEXAS INSTRUMENTS

6 Pin Configuration and Functions

1V3 6 OUT

2V2 5 VDD

3VSS 4 V1

Not to scale

Thermal

Pad

Figure 6-1. DRV Package 6-Pin SON Top View

Table 6-1. Pin Functions

NUMBER NAME I/O(1) DESCRIPTION

1 V3 IA Sense input for positive voltage of the third cell from the bottom of the stack.

2 V2 IA Sense input for positive voltage of the second cell from the bottom of the stack.

3 VSS P Electrically connected to IC ground and negative terminal of the lowest cell in the stack.

4 V1 IA Sense input for positive voltage of the lowest cell in the stack.

5 VDD P Power supply

6 OUT OA1Output drive for external N-channel FET.

— PWRPAD — VSS pin to be connected to the PWRPAD on the printed-circuit-board (PCB) for proper

operation.

(1) IA = Input Analog, OA = Output Analog, P = Power Connection

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021 www.ti.com

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

TEXAS INSTRUMENTS

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN MAX UNIT

Supply voltage VDD–VSS –0.3 30 V

Input voltage V1–VSS or V2–VSS or V3–VSS+ –0.3 30 V

V3–V2 or V2–V1 –0.3 8 V

Output voltage OUT–VSS –0.3 30 V

Continuous total power dissipation, PTOT See Section 7.4

Lead temperature (soldering, 10 s), TSOLDER 300 °C

Storage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2) See Figure 8-3.

7.2 ESD Ratings

VALUE UNIT

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V

Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

Supply voltage, VDD (1) 3 25 V

Input voltage V3–V2 or V2–V1 or V1–VSS 0 5 V

Operating ambient temperature, TA–40 110 °C

(1) See Section 9.2.

7.4 Thermal Information

THERMAL METRIC(1)

BQ2945xy

UNITDRV (SON)

6 PINS

RθJA Junction-to-ambient thermal resistance 186.4 °C/W

RθJC(top) Junction-to-case(top) thermal resistance 90.4 °C/W

RθJB Junction-to-board thermal resistance 110.7 °C/W

ψJT Junction-to-top characterization parameter 96.7 °C/W

ψJB Junction-to-board characterization parameter 90 °C/W

RθJC(bot) Junction-to-case(bottom) thermal resistance N/A °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

I TEXAS INSTRUMENTS

7.5 Electrical Characteristics

Typical values stated where TA = 25°C and VDD = 10.8 V, MIN/MAX values stated where TA = –40°C to +110°C and VDD =

3 V to 15 V (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOLTAGE PROTECTION THRESHOLD VCx

VOV

V(PROTECT) –

Overvoltage Detection

BQ294502, fixed delay 4 s 4.35

BQ294504, fixed delay 6.5 s 4.35

BQ294506, fixed delay 4 s 4.38

BQ294512, fixed delay 4 s 4.4

BQ294522, fixed delay 4 s 4.45

BQ294524, fixed delay 6.5 s 4.45

BQ294532, fixed delay 4 s 4.5

BQ294533, fixed delay 6.5 s 4.5

BQ294582, fixed delay 4 s 4.225

BQ294592, fixed delay 4 s 4.3

VHYS

Overvoltage Detection

Hysteresis VHYS 250 300 400 mV

VOA OV Detection Accuracy TA = 25°C, BQ2945xy –10 10 mV

TA = 25°C, BQ294506 only –7 7 mV

VOA –DRIFT

OV Detection Accuracy

due to Temperature

TA = –40°C

TA = 0°C

TA = 60°C

TA = 110°C

–40

–20

–24

–54

TA = 10°C to 45°C, BQ294506 only –15 15 mV

SUPPLY AND LEAKAGE CURRENT

ICC Supply Current

(V3–V2) = (V2–V1) = (V1–VSS) = 4 V (See Figure 8-3

for reference.) 1 2

µA

(V3–V2) = (V2–V1) = (V1–VSS) = 2.8 V with TA =

–40°C to 60°C 1.25

IIN

Input Current at Vx

Pins

Measured at V3, V2, and V1 = 4 V

(V2–V1) = (V1–VSS) = 4 V

TA = 0°C to 60°C (See Figure 8-3 for reference.)

–0.1 0.1 µA

OUTPUT DRIVE OUT

VOUT Output Drive Voltage

(V3–V2) or (V2–V1) or (V1–VSS) > VOV

VDD = 7.2 V, IOH = 100 µA, TA = –40°C to +110°C 6 V

Two of the three cells are short circuit and only one

cell is powered

(V3–V2) or (V2–V1) or (V1–VSS) > VOV

VDD = Vx (Cell voltage), IOH = 100 µA, TA = –40°C to

+110°C

VDD – 0.2 V

(V3–V2), (V2–V1), and (V1–VSS) < VOV, IOL = 100

µA, TA = 25°C

TA = –40°C to +110°C

250 400 mV

IOUT(Short)

OUT Short Circuit

Current OUT = 0 V (V3–V2) or (V2–V1) or (V1–VSS) > VOV 4.5 mA

tROutput Rise Time CL = 1 nF, VOH(OUT) = 0 V to 5 V(1) 5 µs

ZOOutput Impedance 2 5 kΩ

FIXED DELAY TIMER

tDELAY

Fault Detection Delay

Time

Fixed Delay, BQ2945xy with delay set to 4s typ 3.2 4 4.8 s

Fixed Delay, BQ2945xy with delay set to 6.5 s 5.2 6.5 7.8

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021 www.ti.com

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

I TEXAS INSTRUMENTS 13 438 325 a as

7.5 Electrical Characteristics (continued)

Typical values stated where TA = 25°C and VDD = 10.8 V, MIN/MAX values stated where TA = –40°C to +110°C and VDD =

3 V to 15 V (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

tDELAY_CTM

Fault Detection Delay

Time in Test Mode Fixed Delay (Internal settings) 15 ms

(1) Specified by design. Not 100% tested in production.

7.6 Typical Characteristics

Temperature (qC)

ICC Current (PA)

-40 -20 0 20 40 60 80 100 120

0.7

0.8

0.9

1.1

1.2

1.3

D001

Figure 7-1. ICC Current Consumption vs

Temperature

Temperature (qC)

Overvoltage Threshold (V)

-40 -20 0 20 40 60 80 100 120

4.31

4.32

4.33

4.34

4.35

4.36

4.37

4.38

D002

Min

Max

Mean

Figure 7-2. BQ294502 Overvoltage Threshold

(OVT) vs Temperature

Temperature (qC)

Hysteresis (mV)

-40 -20 0 20 40 60 80 100 120

315

316

317

318

319

320

321

322

323

324

325

D003

Figure 7-3. Hysteresis VHYS vs Temperature

Temperature (qC)

Output Current (mA)

-40 -20 0 20 40 60 80 100 120

-4.1

-4.05

-4

-3.95

-3.9

-3.85

D004

Figure 7-4. Output Current IOUT vs Temperature

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BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

TEXAS INSTRUMENTS PACK. O Copyngm Cc) 2017, Texas Instrumems Incorporated

Output Current (PA)

Output Voltage (V)

0 100 200 300 400 500 600 700 800 900 1000

4.5

5.5

6.5

7.5

D005

3-Cell Data

2-Cell Data

Figure 7-5. Output Voltage vs Output Current

8 Detailed Description

8.1 Overview

The BQ2945xy is a second-level overvoltage (OV) protector. Each cell is monitored independently by comparing

the actual cell voltage to a protection voltage threshold, VOV. The protection threshold is preprogrammed at the

factory with a range from 3.85 V to 4.65 V.

8.2 Functional Block Diagram

OUT

VSS

VDD

RVD

CVD

RIN

OSC

Delay

Timer

PACK+

Multiplexer Switch Network

PACK–

INT_EN

REG

PWRPAD

8.3 Feature Description

The voltage sensing for each cell is done independently using a multiplexer. The method of overvoltage

detection is comparing the voltage to an overvoltage protection voltage VOV. Once the voltage exceeds the

programmed fixed value, the delay timer circuit is activated. This delay (tDELAY) is fixed for either a 4-s or 6.5-s

delay. When these conditions are satisfied, the OUT terminal is transitioned to a high level. This output (OUT) is

released to a low condition if all of the cell inputs (Vx) are below the OVP threshold minus the Vhys.

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021 www.ti.com

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

INSTRUMENTS {5‘ TEXAS

OV–V

HYS

Cell Voltage (V)

(V3 V2, V2 V1,V1–VSS)

OUT (V)tDELAY

–

Figure 8-1. Timing for Overvoltage Sensing

8.3.1 Sense Positive Input for VX

This is an input to sense each single battery cell voltage. A series resistor and a capacitor across the cell for

each input is required for noise filtering and stable voltage monitoring.

8.3.2 Output Drive, OUT

The gate of an external N-channel MOSFET is connected to this terminal. This output transitions to a high level

when an overvoltage condition is detected and after the programmed delay timer. OUT will reset to a low level if

the cell voltage falls below the VOV threshold before the fixed delay timer expires.

8.3.3 Supply Input, VDD

This terminal is the unregulated input power source for the IC. A series resistor is connected to limit the current,

and a capacitor is connected to ground for noise filtering.

8.3.4 Thermal Pad, PWRPAD

For correct operation, the power pad (PWRPAD) is connected to the VSS terminal on the PCB.

8.4 Device Functional Modes

8.4.1 NORMAL Mode

When all of the cell voltages are below the overvoltage threshold, VOV, the device operates in NORMAL mode.

The device monitors the differential cell voltages connected across (V1–VSS), (V2–V1) and (V3–V2). The OUT

pin is inactive in this mode.

8.4.2 OVERVOLTAGE Mode

OVERVOLTAGE mode is detected if any of the cell voltages exceeds the overvoltage threshold, VOV for the

configured OV delay time, tDELAY. The OUT pin will pull high internally. An external FET ihen turns on, shorting

the fuse to ground, which allows the battery or charger power to blow the fuse. When all of the cell voltages fall

below (VOV–VHYS), the device returns to NORMAL mode.

8.4.3 Customer Test Mode

Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once

the circuit is implemented in the battery pack. To enter CTM, VDD should be set to at least 10 V higher than V3

(see Figure 8-2). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal

operation. To exit CTM, remove the VDD to VC3 voltage differential of 10 V so that the decrease in this value

automatically causes an exit.

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BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

w TEXAS INSTRUMENTS Vj::::::';:::::::::j:: /\ 3—-— ______| —————+

CAUTION

Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part into CTM. Also

avoid exceeding Absolute Maximum Voltages for the individual cell voltages (V3–V2), (V2–V1), and

(V1–VSS). Stressing the pins beyond the rated limits may cause permanent damage to the device.

Figure 8-2 shows the timing for CTM.

VOV

VOV –VHYS

Cell Voltage (V)

(V3)

OUT (V) tDELAY >10 ms

10 V

VDD –V3(V)

Figure 8-2. Timing for Customer Test Mode

Figure 8-3 shows the measurement for current consumption for the product for both VDD and Vx.

OUT

VDD

VSS

.63 VIIN

IIN

ICC

bq2945xx

PWRPAD

.63 V

Figure 8-3. Configuration for IC Current Consumption Test

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021 www.ti.com

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification, and

TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes. Customers should validate and test their design

implementation to confirm system functionality.

9.1 Application Information

The BQ2945xy devices are a family of second-level protectors used for overvoltage protection of the battery

pack in the application. The device, when configuring the OUT pin with active high, drives a NMOS FET that

connects the fuse to ground in the event of a fault condition. This provides a shorted path to use the battery or

charger power to blow the fuse and cut the power path.

9.2 Typical Application

VCELL1

VCELL3

VCELL2

OUT

VDD

VSS

RIN

Pack +

Pack–

RIN

CIN

CVD

RVD

PWRPAD

Figure 9-1. Application Configuration Schematic

9.2.1 Design Requirements

Changes to the ranges stated in Table 9-1 will impact the accuracy of the cell measurements. Figure 9-1 shows

each external component.

Table 9-1. Parameters

PARAMETER EXTERNAL COMPONENT MIN TYP MAX UNIT

Voltage monitor filter resistance RIN 100 1000 4700 Ω

Voltage monitor filter capacitance CIN 0.1 1 µF

Supply voltage filter resistance RVD 100 1K Ω

Supply voltage filter capacitance CVD 0.1 µF

9.2.2 Detailed Design Procedure

1. Determine the overvoltage threshold and delay time. Select the proper device from the table in Section 5, or

contact TI for a different configuration.

2. Determine the number of cell in series. The device supports 2-S to 3-S cell configuration. For 2-S

configuration, V3 pin should be shorted to V2.

3. Follow the application configuration schematic (see Figure 9-1) to connect the device.

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BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

TEXAS INSTRUMENTS Asa 325 pm A Pack .

9.2.3 Application Curves

Temperature (qC)

Overvoltage Threshold (V)

-40 -20 0 20 40 60 80 100 120

4.31

4.32

4.33

4.34

4.35

4.36

4.37

4.38

D002

Min

Max

Mean

Figure 9-2. OVT vs Temperature

Temperature (qC)

Hysteresis (mV)

-40 -20 0 20 40 60 80 100 120

315

316

317

318

319

320

321

322

323

324

325

D003

Figure 9-3. VHYS vs Temperature

9.3 System Examples

100

VCELL1

VCELL3

VCELL2

OUT

VDD

VSS 0.1 µF

0.1µF

bq2945xx

Pack +

Pack –

PWRPAD

Figure 9-4. 3-Series Cell Configuration with Fixed Delay

100

VCELL1

VCELL2

OUT

VDD

VSS

0.1

0.1µF

bq2945xx

Pack +

Pack –

PWRPAD

µF

0.1µF

Figure 9-5. 2-Series Cell Configuration with Internal Fixed Delay

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021 www.ti.com

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

I TEXAS INSTRUMENTS

Power Supply Recommendations

The maximum power of this device is 25 V on VDD.

9 Layout

9.1 Layout Guidelines

• Ensure the RC filters for the V1 and VDD pins are placed as close as possible to the target terminal, reducing

the tracing loop area.

• The VSS pin should be routed to the CELL– terminal.

• Ensure the trace connecting the fuse to the gate, source of the NFET to the Pack– is sufficient to withstand

the current during a fuse blown event.

9.2 Layout Example

VCELL

OUT

VDD

Pack +

Pack ±

VSS VSS

PWPD

Power Trace Line

Place the RC filters close to the

device terminals

Ensure trace can support sufficient current

flow for fuse blow

Connect the VSS pins to the CELL- side

Figure 9-1. Layout Schematic

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BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

l TEXAS INSTRUMENTS m

10 Device and Documentation Support

10.1 Device Support

10.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

10.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

BQ294502, BQ294504, BQ294506, BQ294512

BQ294522, BQ294524, BQ294532, BQ294533

BQ294582, BQ294592

SLUSAJ3I – SEPTEMBER 2011 – REVISED MAY 2021 www.ti.com

Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532

BQ294533 BQ294582 BQ294592

I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jun-2021

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

BQ294502DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4502

BQ294502DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4502

BQ294504DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4504

BQ294504DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4504

BQ294506DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4506

BQ294506DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4506

BQ294512DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4512

BQ294512DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4512

BQ294522DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4522

BQ294522DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4522

BQ294524DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4524

BQ294524DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4524

BQ294532DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4532

BQ294532DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4532

BQ294533DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4533

BQ294533DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4533

BQ294582DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4582

BQ294582DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4582

BQ294592DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4592

BQ294592DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4592

I TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jun-2021

Addendum-Page 2

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

l TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS Reel Dlameter Cavtty AD Dimension destgned to accommodate the component wmth Eu Dimension destgned to accommodate the componenl tengtn K0 Dtmenston destgned to accommodate the component thickness 7 w Ovevau with at the earner tape i Pt Pttch between successtve cavtty cemers i T ReelWidIh(W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE C) O O O C) O O O ispmcketHutes —> User Dtrecllnn 0' Feed \1/ Pockel Quadrams

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

BQ294502DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294502DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294504DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294504DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294506DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294506DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294512DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294512DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294522DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294522DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294524DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 12-Jun-2021

Pack Materials-Page 1

l TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

BQ294524DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294532DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294532DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294533DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294533DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294582DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294582DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294592DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

BQ294592DRVT WSON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

BQ294502DRVR WSON DRV 6 3000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 12-Jun-2021

Pack Materials-Page 2

l TEXAS INSTRUMENTS

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

BQ294502DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294502DRVT WSON DRV 6 250 210.0 185.0 35.0

BQ294504DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294504DRVT WSON DRV 6 250 210.0 185.0 35.0

BQ294506DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294506DRVT WSON DRV 6 250 210.0 185.0 35.0

BQ294512DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294512DRVT WSON DRV 6 250 210.0 185.0 35.0

BQ294522DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294522DRVT WSON DRV 6 250 210.0 185.0 35.0

BQ294524DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294524DRVT WSON DRV 6 250 210.0 185.0 35.0

BQ294532DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294532DRVT WSON DRV 6 250 210.0 185.0 35.0

BQ294533DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294533DRVT WSON DRV 6 250 210.0 185.0 35.0

BQ294582DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294582DRVT WSON DRV 6 250 210.0 185.0 35.0

BQ294592DRVR WSON DRV 6 3000 210.0 185.0 35.0

BQ294592DRVT WSON DRV 6 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 12-Jun-2021

Pack Materials-Page 3

I TEXAS INSTRUMENTS

GENERIC PACKAGE VIEW

Images above are just a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

DRV 6 WSON - 0.8 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

4206925/F

% W C :1 v _ W dﬁN g}gﬁ @ DJ

www.ti.com

PACKAGE OUTLINE

6X 0.35

0.25

1.6 0.1

6X 0.3

0.2

1.3

1 0.1

4X 0.65

0.8

0.7

0.05

0.00

B2.1

1.9 A

2.1

1.9

(0.2) TYP

WSON - 0.8 mm max heightDRV0006A

PLASTIC SMALL OUTLINE - NO LEAD

4222173/B 04/2018

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

(OPTIONAL)

PIN 1 ID

0.1 C A B

0.05 C

THERMAL PAD

EXPOSED

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 5.500

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

(1)

4X (0.65)

(1.95)

6X (0.3)

6X (0.45)

(1.6)

(R0.05) TYP

( 0.2) VIA

TYP

(1.1)

WSON - 0.8 mm max heightDRV0006A

PLASTIC SMALL OUTLINE - NO LEAD

4222173/B 04/2018

SYMM

LAND PATTERN EXAMPLE

SCALE:25X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

www.ti.com

EXAMPLE STENCIL DESIGN

6X (0.3)

6X (0.45)

4X (0.65)

(0.7)

(1)

(1.95)

(R0.05) TYP

(0.45)

WSON - 0.8 mm max heightDRV0006A

PLASTIC SMALL OUTLINE - NO LEAD

4222173/B 04/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD #7

88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:30X

SYMM

METAL

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party

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applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Texas Instruments 的 BQ2945xx 规格书

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