SUNON Cooling: Powering Tomorrow's AI
SUNON Cooling: Powering Tomorrow's AI
Letter of Authorization

DigiKey is an authorized distributor and product reseller of UTD / EVER Semiconductor.

UMW
Letter of Authorization

DigiKey is an authorized distributor and sales partner for YS TECH USA INC products.

Image of DigiKey Sponsors ElectronicWings Design Contest 2024 DigiKey 赞助 2024 ElectronicWings 设计大赛

DigiKey 很荣幸能成为 ElectronicWing Project Challenge 2024 的主要赞助商，这是一项针对技术解决方案的全球设计大赛。

How-To: Read and Understand Technical Datasheets How-To: Read and Understand Technical Datasheets

Learn essential skills for interpreting electronic component documentation. Explore pin configurations, operating conditions, truth tables, and timing diagrams.

Temperature Cycling Application Note

This paper addresses engineers and developers, that are building a PCR test apparatus or any other device, that periodically performs temperature curves, with TEC Controllers.

Using the RS485 Interface of a TEC Controller Application Note

This paper documents the use of the RS485 Interface of a Meerstetter TEC Controller. Additionally, the use of a Serial Server to connect over Ethernet is also described.

TEC Controller Temperature Ramp Optimization Application Note

This paper describes how the rate of temperature change can be improved by increasing the parameter “Coarse Temp Ramp” when using the Meerstetter Engineering TEC Controllers.

Image of Bergquist's SIL PAD® TSP 3500 SIL PAD® TSP 3500 发布日期：2024-04-11

Bergquist 的 SIL PAD TSP 3500 是一种有机硅弹性体，其配方可最大程度地提高介电性能和热性能。

Image of Bergquist's GAP FILLER TGF 3600 间隙填充材料 TGF 3600 发布日期：2024-04-11

Bergquist 的 GAP FILLER TGF 3600 是一种双组分液体间隙填充材料，具有超高的热性能。

Bergquist / Henkel

Bergquist Company 是热管理材料开发与制造的领域的全球领导者，产品包括 Sil-Pad® 导热绝缘层和各种特种材料、Gap Pad® 间隙填充材料、Hi-Flow® 相变材料以及 Softface® 和 Bond-Ply®。

Rittal

Rittal LLC is built on a strong tradition of innovation and takes pride in a progressive approach to engineering comprehensive and effective solutions that supports our customers in the pursuit of their goals..

Image of Understanding Thermal Challenges in EV Charging Applications 了解电动汽车充电应用中的发热挑战 发布日期：2024-03-13

随着电动汽车成为主要的交通工具，电池续航能力和更快的充电速度等因素将在全球经济中发挥关键作用。

Authorized Reseller Certificate

DigiKey is an authorized reseller of StarTech.com products.

Image of Parker Chomerics THERM-A-GAP GEL 60HF THERM-A-GAP GEL 60HF 发布日期：2024-02-26

Parker Chomerics 的 THERM-A-GAP GEL 60HF 是一种非常适合大容量点胶应用的“高流量”凝胶。

Image of Shiu Li Technology's T Series High Thermal Conductivity Gap Pad T 系列高导热间隙垫 发布日期：2024-02-22

Shiu Li Technology 提供 LiPOLY T 系列高导热间隙垫，旨在应用于 CPU/组件与散热器之间。

Image of Shiu Li Technology's N Series Non-Silicone High Thermal Conductivity Gap Pad N 系列无硅高导热间隙垫 发布日期：2024-02-22

Shiu Li Technology 的 N 系列无硅胶导热间隙垫专为硬盘驱动器、光学设备、电动汽车等应用而设计。

Image of Parker Chomerics' THERM-A-GAP PAD 80 Thermally Conductive Gap Filler Pads THERM-A-GAP PAD 80 导热间隙填充垫 发布日期：2024-02-13

Parker Chomerics 的 THERM-A-GAP PAD 80 是一款 8.3 W/m-K 高性能导热间隙填充垫。

Image of High-Performance Cooling: How Diagonal Compact Fans are Changing the Game 高性能冷却：紧凑型对角线风扇是如何改变游戏规则的 发布日期：2024-02-08

具有离心风扇特性的紧凑型轴流风扇是热管理领域的一项创新。

Image of Parker Chomerics' THERM-A-GAP GEL 75 Thermally Conductive Gel THERM-A-GAP™ GEL 75 导热凝胶 发布日期：2024-02-06

Parker Chomerics 的 THERM-A-GAP GEL 75 设计为一种具有自动分配功能的单组分完全固化系统。