Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Slide 12 Slide 13 Slide 14 Slide 15 Slide 16 Product List
IC Photocoupler Overview Slide 6

In contrast with MFSOP6 package, SO6 package is 20% thinner and is excellent for height constrained designs. It can also be used to reduce overall board space by mounting thinner components on the reverse side of the PCB.

PTM Published on: 2013-01-22