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stac fam
Compared to devices housed in ceramic packages, the 50 V DMOS devices housed in ST’s innovative STAC® air cavity package feature a 25% lower thermal resistance and higher MTTF combined with improved RF performances (up to 350 W) and ruggedness requirements (65:1 in all phases VSWR). This is a cost effective solution as replacement of products in standard ceramic package.
PTM Published on: 2014-03-26