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Product List
Shown on this slide are the four package options for SLLIMM Gen2 devices based on two variations of lead frame and two variations of thermal interface. FM stands for Full Molded epoxy packaging and DBC stands for Direct Bonded Copper substrate. The FM package is good for low cost solutions but not as effective at conducting heat away from the IGBTs inside as the higher cost DBC package is.
PTM Published on: 2015-03-31
