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From this work, ATS manufactured the ATS-1461 and ATS-1462 heat sinks with heat pipes. Test results of the heat sinks matched with CFD simulation results well and the thermal performance of ATS-1461 and ATS-1462 heat sinks achieved the customer’s target design goals. By using the ATS solutions as seen in this case study, the junction temperature of the customer’s chips in their designs are 8˚ to 10˚C lower than the customer’s previous solution.
PTM Published on: 2016-01-04
PTM Updated on: 2016-02-05
