ZSC31050

Renesas Electronics Corporation

集成电路(IC) | 专用

制造商零件编号
描述
库存
包装
状态
查看详情
16-TSSOP
ZSC31050FIG1-R
IC INTERFACE SPECIALIZED 16SSOP
IC INTERFACE SPECIALIZED 16SSOP
3,250
卷带(TR)
剪切带(CT)
Digi-Reel® 得捷定制卷带
-
16-TSSOP
ZSC31050FAG1-R
IC INTERFACE SPECIALIZED 16SSOP
IC INTERFACE SPECIALIZED 16SSOP
9,493
卷带(TR)
剪切带(CT)
Digi-Reel® 得捷定制卷带
-
16-TSSOP
ZSC31050FAG1-T
IC INTERFACE SPECIALIZED 16SSOP
IC INTERFACE SPECIALIZED 16SSOP
639
管件
-
IC INTERFACE SPECIALIZED 16SSOP
ZSC31050FEG1-R
IC INTERFACE SPECIALIZED 16SSOP
IC INTERFACE SPECIALIZED 16SSOP
2,730
卷带(TR)
剪切带(CT)
Digi-Reel® 得捷定制卷带
-
ZSC31050KITV3P1
ZSC31050KITV3P1
ZSC31050KIT EVALUATION KIT V3.1
ZSC31050KIT EVALUATION KIT V3.1
6
散装
-
IC INTERFACE SPECIALIZED 16SSOP
ZSC31050FIG1-T
IC INTERFACE SPECIALIZED 16SSOP
IC INTERFACE SPECIALIZED 16SSOP
0
管件
-
SSOP / 16 / 5,3MM G1 - TUBE
ZSC31050FEG1-T
SSOP / 16 / 5,3MM G1 - TUBE
SSOP / 16 / 5,3MM G1 - TUBE
0
管件
-
WAFER (UNSAWN) - BOX
ZSC31050FIB
WAFER (UNSAWN) - BOX
WAFER (UNSAWN) - BOX
0
托盘
-
WAFER (UNSAWN) - BOX
ZSC31050FAB
WAFER (UNSAWN) - BOX
WAFER (UNSAWN) - BOX
0
托盘
-
WAFER (UNSAWN) - BOX
ZSC31050FEB
WAFER (UNSAWN) - BOX
WAFER (UNSAWN) - BOX
0
托盘
-
DICE (WAFER SAWN) - WAFFLE PACK
ZSC31050FID
DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - WAFFLE PACK
0
托盘
-
DICE (WAFER SAWN) - WAFFLE PACK
ZSC31050FAD
DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - WAFFLE PACK
0
托盘
-
DICE (WAFER SAWN) - WAFFLE PACK
ZSC31050FED
DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - WAFFLE PACK
0
托盘
-
ZSC31050 MASS CALIBR. REF. BOARD
ZSC31050MCREFBV1P0
ZSC31050 MASS CALIBR. REF. BOARD
ZSC31050 MASS CALIBR. REF. BOARD
0
散装
-
SSC BOARD ZSC31050 V3.1 WITH SAM
ZSC31050BOARDV3P1S
SSC BOARD ZSC31050 V3.1 WITH SAM
SSC BOARD ZSC31050 V3.1 WITH SAM
0
散装
-