Multilater Ceramic Capacitors (MLCCs)

Discover TDK's extensive lineup of multilayer ceramic capacitors (MLCCs), designed to meet the diverse needs of consumer, industrial, and automotive applications. From general purpose components to specialized product like mid & high voltage, high temperature, MEGAcap, and soft termination options, many series are available in AEC-Q200 compliant version for automotive use. With a long history in advanced materials science, TDK leads the way in component miniaturization, while ensuring high reliability through-cutting edge processing technologies. Experience the innovation and reliability of TDK's MLCCs, engineered to power the future of electronic devices.

Featured MLCC products

CGA Series 100 V Automotive MLCCs

TDK offers MLCCs with a high capacitance of 10 μF at 100 V for automotive applications in the 3225 case size

C3225/CGA6P*C0G3B MLCCs

TDK Corporation MLCCs have 10 nF and C0G characteristics at 1,250 V in 3225 size for automotive and commercial applications

CA Series Inline Mega-Capacitor

TDK higher capacitance MLCCs feature superior mechanical strength and greater ripple current capability

MLCC Sample Kits

Simplify component selection with TDK's extensive range of sample kits, featuring high-quality components tailored to your specific design needs.

MLCC product family

General up to 75 V

Features

  • TDK's proprietary internal electrode structure
  • Wide capacitance range up to 100 µF
  • Available voltage rating of 2.5 V to 75 V
  • Superior mechanical strength and reliability
  • Easy mounting due to no polarity

Applications

  • IC, data center

Mid Voltage 100 V to 630 V

Features

  • Advanced dieletric materials
  • Wide capacitance range up to 22 µF
  • Higher voltage rating in smaller case size
  • Voltage rating from 100 V to 630 V
  • High mechanical strength
  • Excellent DC bias properties

Applications

  • Inverter, converter, and charging unit for xEV

High Voltage 1,000 V to 3,000 V

Features

  • Up to 3000 V rated voltage
  • Improved withstnading voltage characteristics
  • Low ESR at high frequency
  • Low dielectric constant
  • Complies with ISO-8802-3 required for LAN

Applications

  • Snubber, Resonant Circuit, Surge Protection

High Temperature 150°C

Features

  • Up to 3000 V rated voltage
  • Improved withstnading voltage characteristics
  • Low ESR at high frequency
  • Low dielectric constant
  • Complies with ISO-8802-3 required for LAN

Applications

  • Snubber, Resonant Circuit, Surge Protection

MEGACAP with Metal Frame

Features

  • Stable temperature characteristics (15%) up to 150°C
  • Highly precise temperature characteristics (±7.5%) up to 125°C
  • Available in both Class 1 NP0 and Class 2 X8R/X8L

Applications

  • Ignition Coil, TCM, ABS, Gear Tooth Sensor, IGBT or SiC switching device unit for xEV

MEGACAP Low Resistance, Inline

Features

  • Multi-stack configuration: two or three
  • Available for +260°C lead-free reflow
  • Lower ESL and ESR than SMD ALU capacitors, low resistnace achieved by optimizing metal frame materials
  • Superior capacitance and rated voltage offering
  • Lineup includes 99 nF/1000 V with Class 1 and 47 µF/100 V with Class 2 dielectric

Applications

  • LC resonant circuit, Smoothing, decoupling

Soft Termination

Features

  • Improved board bending resistance, drop impact resistance, thermal shock resistance, and heat cycle properties
  • Conductive resin absorb external stress to protect solder joint parts and capacitor body
  • RoHS, WEE, and REACH compliant

Applications

  • Smoothing, decoupling, LC resonant circuit

Soft Termination Low Resistance

Features

  • Conductive resin soft termination
  • Directs stress away from ceramic body
  • Superior board flex performance
  • Low ESR, low ESL, low heat generation
  • AEC-Q200 compliant product available for automotive applications

Applications

  • Smoothing, decoupling

Serial Design Soft Termination

Features

  • Improved bending resistance (Board Flex Resistance)
  • Improved temperature cycle performance
  • Allow space reduction on PCB
  • Ultra high reliability (series cap + soft termination)
  • RoHS, WEE, and REACH compliant

Applications

  • High frequency decoupling, Surge protection, ESD

Conductive Epoxy

Features

  • AgPdCu termination for conductive glue mounting
  • Reduced risk of silver migration
  • Improved mechanical/thermal strength when used with conductive glue
  • AECQ-200 compliant
  • RoHS, WEE, and REACH compliant

Applications

  • For applications requiring conductive glue mounting method, ABS, Transmission control, Engine sensor modules

Low ESL Reverse Geometry

Features

  • Flipped geometry provides low inductance (less than 400 pH)
  • Allows adequate high frequency current to IC
  • Provides stabilization of power line voltage
  • High frequency noise suppression

Applications

  • IC, Decoupling for high frequency, Die side capacitor, Land side capacitor

ESD Protection Low Resistance

Features

  • Compliant with the IEC 61000-4-2 standard for ESD immunity
  • Available with C0G and NP0 thermal characteristics
  • Stable capacitance values regardless of DC bias, temperature, or aging effects
  • AEC-Q200 compliant

Applications

  • For I/O such as battery lines in ECUs (Engine ECU, EPS, TCM, ABS, etc.) that need ESD protection

3-Terminal Filters

Features

  • Small and high-performance EMC components
  • Good attenuation characteristics in a wide bandwidth
  • Operating temperature ranges up to +125°C
  • AEC-Q200 compliant type available for automotive applications

Applications

  • lIVI (In-Vehicle Infotainment), car-navigation, In-vehicle camera, measures for power supply noise of in-vehicle radar

Low Profile

Features

  • Available in five cases sizes - 0201, 0402, 0204 and as thin as 0.22 mm
  • Capacitance offering from 0.1µF to 1 µF
  • Ideal for height-restricted applications such as mobile phones and BGA under mounting

Applications

  • IC

Low ESL, Ultra Inductance

Features

  • Unique internal structure with inductance less than 150 pH
  • Ultra-low ESL is created by aternating the flow of current so the magnetic fields cancel out
  • Contains no lead and supports lead-free soldering

Applications

  • IC, Decoupling for high frequency

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