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Packaging Innovations

Integration and miniaturization have helped shrink electronic devices and revolutionize how we interact with the world around us. Nexperia has been pushing the boundaries of package technology to continuously deliver the right function in the right package with the right performance.

Today that focus in on efficiency. Nexperia continue to push towards ever more space efficient packages with chip-scale and near chip scale encapsulation options. From a performance perspective, Nexperia leaded clip-bond technology also delivers real thermal and package resistance benefits. And our leadless package options with side wettable flanks meet the demand for Automated Optical Inspection (AOI) of PCBs.

LFPAK88 MOSFETs

Providing a true alternative to D²PAK, Nexperia’s LFPAK88 delivers industry leading power density in truly innovative 8mm x 8mm footprint. Delivering 2x higher continuous current rating, ultimate thermal performance and reliability, and up to 60% space saving efficiency

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LFPAK56

LFPAK56/E portfolio gives industry leading performance in a truly innovative package. 100 % compatible with industry-standard Power-SO8 footprints, the design and construction is optimized to give the best thermal and electrical performance, cost and reliability

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LFPAK56D half-bridge MOSFETs

A series of half-bridge (high side & low side) MOSFETs constructed in the space-saving LFPAK56D package format. Occupying 30% lower PCB area compared to dual MOSFETs for 3 phase motor control topologies due to the removal of PCB tracks whilst permitting simple automated optical inspection (AOI) during production

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Automotive DFN packages

AEC-Q101 qualified leadless packages with side-wettable flanks help save space and minimize weight while ensuring the performance and efficiency of these components – especially at high temperatures. Automotive DFN (Discretes Flat No-leads) options exists across the full portfolio of diodes, bipolar transistors, and MOSFETs.

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X2SON

Nexperia X2SON packages feature 4, 5, 6 or 8 pins and are available in low-power AUP, AXP, LV & LVC technology families, covering over one hundred logic functions.

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DQFN SWF

These leadless packages provide upto 76 % space saving over traditional leaded TSSOP packages. A pad pitch of 0.5 mm allows simplified PCB assembly.

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DSN0402B-2 (SOD992B)

  • Silicon, leadless tiny package
  • 2 terminals
  • 0.28 mm pitch
  • 0.43 mm x 0.23 mm x 0.12 mm body

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DFN2510D (SOT1165D)

  • Plastic
  • Leadless thin small outline package with Side-Wettable Flanks (SWF)
  • 10 terminals
  • 0.5 mm pitch; 2.5 mm x 1 mm x 0.75 mm body

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WLCSP10 (WLCSP10_4-2-4)

  • Wafer level chip-size package
  • 10 bumps (4-2-4)
  • 0.4 mm pitch
  • 1.57 x 1.17 x 0.57 mm body

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DSN0603-2 (SOD962)

  • Silicon, leadless ultra small package
  • 2 terminals
  • 0.4 mm pitch
  • 0.6 x 0.3 x 0.3 mm body

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Clip-bonded FlatPower (CFP) Packages

  • Solid copper clip for high thermal performance and power dissipation
  • Reduced package inductance for improved switching behavior
  • High reliability (2 x AEC-Q101, Board Level Reliability compliance)
  • Free from delamination
  • Junction temperature up to 175 °C
  • Small, thin and light design
  • Optimized lead form ensuring uniform solder joints for maximum flexibility in AOI Secure supply in high volumes

SOD-128/CFP5
SOD-123W
CFP15B