High Speed and fine pitch connector technologies provide a wide range of solutions for data/networking, industrial, instrumentation, medical and telecommunications. Web based tools and quick links to technical documentation increase the speed and accuracy of product selection. Updated information on new Amphenol Communications Solutions products and distributor inventory supports customer challenges from development to fulfillment.
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BergStak® Series
Versatile, high density parallel board–to–board connector system offers twelve PCB stack heights in nine sizes up to two hundred positions. Stack height flexibility supports evolving designs and emerging mechanical requirements with a common mating interface. Special housing and blade-on-beam terminal features provide easy PCB assembly, worry-free mating and long-term reliability.
Features & Benefits:
0.8mm double-row contact pitch conserves printed circuit board space
Vast range of sizes and stack heights support diverse electronic packaging schemes
Choice of gold-based and palladium-based platings provide protection in different environments and applications
Tapered PCB locator pegs increase the ease and accuracy of hand assembly
Blade-on-beam contacts allow peeling for safer, easier un-mating
Tape and Reel packaging supports high speed automated assembly
PCIe®Gen.2 high speed performance on some stack heights
Fully inter-matable with similar competitive connectors
The mezzanine system is a pin-in-socket board to board system on a 2.54mm pitch. It is part of Amphenol Communications Solutions fully modular system and includes board receptacles and headers.
Features & Benefits:
Single and double row covering 2 positions up to 72
Through hole or surface mount
Minimum stack height 9.54mm. Use of double body header allows completely variable stack heights up to 26mm
Part of Amphenol Communications Solutions Basics+ range which features easy product finders, fast samples, standard parts in stock at leading distributors and other benefits.
The Conan 1.0mm mezzanine connector system provides a mechanically secure, high density electrical interface between parallel printed circuit boards.
Conan’s mechanical features and palladium/nickel/gold plated electrical contacts qualify it for high reliability use in portable and mobile electronic equipment.
Features & Benefits:
“Snap” engagement contacts assure secure mating with an audible “click”
Blade-on-beam contact design allows "peeling" disengagement and prevents contact stubbing
Connector housings feature "lead-in" angles to assist in mating
Surface mounted metal hold-downs reinforce connector retention to the printed circuit board
Mating polarization prevents backward connections
PCB polarization prevents errors during printed circuit board assembly
Pick and place caps with tape and reel packaging support automated assembly processe
Header height options support a range of PCB stack heights: 4.15mm to 7mm
The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. Amphenol Communications Solutions long tradition as a BGA connector innovator assures expertise and reliability in the GIG-ARRAY® BGA design. The combination of multiple stack heights (15mm to 40mm) and multiple sizes (200 signals to 296 signals) utilizing a 100-Ohm differential matched impedance design allows for optimal design flexibility while yielding less than 1% cross-talk performance.
Amphenol Communications Solutions has produced BGA mezzanine connectors since 1996, shipping over 10 billion BGA contact interfaces demonstrating Amphenol Communications Solutions extensive experience as the premier BGA interconnect innovator and supplier. Amphenol Communications Solutions patented BGA design is supported by fully automated quality control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes. Multiple in-line vision systems, quality control product audits, and statistical process controls are all a part of our state-ofthe- art manufacturing facility.
Features & Benefits:
RoHS compliant (Lead-Free) options are available
Optimized design for utilization in high-density, high-speed mezzanine applications
Ball Grid Array (BGA) termination for process friendly attachment
1mm x 0.65mm BGA interface pitch optimizes routing and electrical performance
Stack Heights available from 15mm to 40mm provide mezzanine design flexibility
Connector sizes of 200 and 296 signals providing 62 signal contacts per linear cm (158 signal contacts per linear inch) allow for optimization of board space and signal requirements
The MEG-Array® connector is designed to meet the needs of 10Gb/s applications requiring up to 528 signal pins per connector. The combination of multiple stack heights (4mm to 14mm) and multiple sizes (81 signals to 528 signals) allows for optimal design flexibility while yielding less than 1% cross-talk performance when configured differentially. has produced the MEG-Array® Connector System since 1996, shipping over 10 billion BGA contact interfaces illustrating Amphenol Communications Solutions extended tradition as the premier BGA interconnect innovator and supplier. Amphenol Communications Solutions patented BGA design is supported by fully automated quality control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes. Multiple in-line vision systems, quality control product audits, and statistical process controls are all a part of our state-of-the-art manufacturing facility.
Features & Benefits:
RoHS Compliant (Lead-Free)
Ball Grid Array (BGA) termination for process friendly attachment
.050" x .050" BGA interface pitch optimizes routing and electrical performance
Stack Heights available from 4mm to 14mm (2mm increments)
Connector sizes of 81 signals to 528 signals providing 80 usable signals per linear cm (205 signals per linear inch) allow for optimization of board space and signal requirements
10 Gb/s differential pair performance at less than 1% cross-talk meets the needs of high speed mezzanine applications
Meets Telcordia GR-1217-CORE and NPS-25298-2 specifications for utilization in telecom applications
Demonstrated solder joint reliability of greater than 22 years life (per IPC-SM-785) is unmatched for a BGA mezzanine connector
Polarized design assures proper mating of the connector
Back to Back testing connector (Interposer) available upon special request
The Minitek mezzanine system is a pin-in-socket board to board system on a 2.00mm pitch. It is part of Amphenol Communications Solutions fully modular system and includes board receptacles and headers.
Features & Benefits:
Double row system coves 4 positions up to 100
Through hole or surface mount
Minimum stack height 3.8mm. Use of double body header allows completely variable stack heights up to 18mm
Part of Amphenol Communications Solutions Basics+ range which features easy product finders, fast samples, standard parts in stock at leading distributors and other benefits.
Rib-Cage™ connectors provide optimal precision and reliability at a competitive commercial cost. They meet high performance standards for use in applications with shock and vibration.
The versatile Rib-Cage™ system includes dual-row, pin-and-socket connectors for right-angle and mezzanine connections between printed circuit boards (PCB) or flexible printed circuits (FPC).
Features & Benefits:
Exclusive Rib-Cage™ multi-point, gold plated receptacle contacts provide optimal reliability in high vibration and shock-prone applications
High density 1.27mm (.050 in.) x 1.27mm (.050 in.) double row contact grid occupies only 20% of the volume of comparable .100 in. pitch systems
Multiple stack height options offer flexibility for mezzanine connection designs
MezzoStak 0.5 MM Mezzanine Connectors - Amphenol Communications Solutions' 0.5 mm mezzanine connector system features robust design and easy hermaphroditic mating.
MEG-Array® Connector - Amphenol Communications Solutions and DigiKey offer the MEG-Array board-to-board connector.
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