Murata Electronics 的 DSS1NB3 Series Ref Sheet 规格书

Spec No. JENF243F-0031C-01 Tame 1 risfics 100V \1/ n9 D381NB32A2200558 D381NB32A220091A D381NB32A220092A D381 NB32A220093A D381NB32A3300558 D381NB32A330091A D381NB32A330092A D381NB32A330093A D381NB32A47OQSSB D381NB32A47OQQ1A D381NB32A470092A 5331N332A470093'A"
Spec No. JENF243F-0031C-01 P1/10
MURATA MFG.CO., LTD
Reference Only
EMIFIL (Three-terminal capacitor)
DSS1NB3□□□□□□□□□ Reference Specification
1. Scope
This reference specification applies to DSS1NB3 series.
2. Part Numbering
(Ex.) DS S 1 N B3 2A 220 Q55 B
① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨
Product ID (Disc-Type EMIFIL
Structure S : Built-in Ferrite Beads Type
Style
Features
Temperature Characteristics B3:±10%-40+85at 20℃)
Rated Voltage 2A :2A100VDC1H50VDC
Capacitance □□□
Marked three digits system.(Ex. 22pF→22022000pF→223)
Lead Type
Q55 : Bulk
Lead Type :Straight Lead
Lead Length(l) 25.0 mm min.See item 9.
Q91: Taping
Lead Type :Straight Lead
Dimension H: Q9120.0±1.0 mm
Q9216.5±1.0 mm
Q9318.5±1.0 mm See item 9.
Packaging Code A : Ammo Pack / B : Bulk
3. Rating
Operating temperature : -40 to +85°C
Storage Temperature : -40 to +85°C
Insulation Resistance : 1000MΩ min.
Rated Current : 6A(DC)
Equivalent Circuit :
Others : See Table 1
Table 1
Customer
Part Number
Murata
Part Number Capacitance Temperature
Characteristics
Rated
Voltage
W
ithstanding
Voltage
Unit Mass
(Typical
value)
DSS1NB32A220Q55B
22 pF±10%
±10% 100VDC 250VDC 0.45g
DSS1NB32A220Q91A
DSS1NB32A220Q92A
DSS1NB32A220Q93A
DSS1NB32A330Q55B
33 pF±10%
DSS1NB32A330Q91A
DSS1NB32A330Q92A
DSS1NB32A330Q93A
DSS1NB32A470Q55B
47 pF±10%
DSS1NB32A470Q91A
DSS1NB32A470Q92A
DSS1NB32A470Q93A
GND
1
3
3
1
2
GND
1
3
3
1
2
5W0. me E "9 Uni‘ Mass D551NBSZA680Q55B D551NBSZA680Q91A D551NBSZA680Q92A D551 NBSZAGSOQQSA D551NBSZA101Q55B D551NBSZA101Q91A D551NBSZA101Q92A D551NBSZA101Q93A D551NBSZA121Q92A D551NBSZA121Q93A D551NBSZA151Q92A D551NBSZA151Q93A D551NBSZA221Q93A D551NBSZA271Q92A D551NBSZA271Q93A D551NBSZA331Q92A D551NBSZA331Q93A D551NBSZA471Q92A D551NBSZA471Q93A D551NBSZA681Q92A D551NBSZA681Q93A D551 N BSZA102Q92A D551 N BSZA102Q93A D551 N BSZA152Q92A D551 N BSZA152Q93A D551 N BSZA222Q92A D551 N BSZAZZZQQSA D551 N BSZASSZQQQA D551 N BSZASSZQQSA D551 N BSZA472Q92A D551 N BSZA472Q93A
Spec No. JENF243F-0031C-01 P2/10
MURATA MFG.CO., LTD
Reference Only
Customer
Part Number
Murata
Part Number Capacitance Temperature
Characteristics
Rated
Voltage
W
ithstanding
Voltage
Unit Mass
(Typical
value)
DSS1NB32A680Q55B
68 pF±10%
±10%
100VDC
250VDC
0.45g
DSS1NB32A680Q91A
DSS1NB32A680Q92A
DSS1NB32A680Q93A
DSS1NB32A101Q55B
100 pF±10%
DSS1NB32A101Q91A
DSS1NB32A101Q92A
DSS1NB32A101Q93A
DSS1NB32A121Q55B
120 pF±10%
DSS1NB32A121Q91A
DSS1NB32A121Q92A
DSS1NB32A121Q93A
DSS1NB32A151Q55B
150 pF±10%
DSS1NB32A151Q91A
DSS1NB32A151Q92A
DSS1NB32A151Q93A
DSS1NB32A221Q55B
220 pF±10%
DSS1NB32A221Q91A
DSS1NB32A221Q92A
DSS1NB32A221Q93A
DSS1NB32A271Q55B
270 pF±10%
DSS1NB32A271Q91A
DSS1NB32A271Q92A
DSS1NB32A271Q93A
DSS1NB32A331Q55B
330 pF±10%
DSS1NB32A331Q91A
DSS1NB32A331Q92A
DSS1NB32A331Q93A
DSS1NB32A471Q55B
470 pF±10%
DSS1NB32A471Q91A
DSS1NB32A471Q92A
DSS1NB32A471Q93A
DSS1NB32A681Q55B
680 pF±10%
DSS1NB32A681Q91A
DSS1NB32A681Q92A
DSS1NB32A681Q93A
DSS1NB32A102Q55B
1000 pF±10%
DSS1NB32A102Q91A
DSS1NB32A102Q92A
DSS1NB32A102Q93A
DSS1NB32A152Q55B
1500 pF±10%
DSS1NB32A152Q91A
DSS1NB32A152Q92A
DSS1NB32A152Q93A
DSS1NB32A222Q55B
2200 pF±10%
DSS1NB32A222Q91A
DSS1NB32A222Q92A
DSS1NB32A222Q93A
DSS1NB32A332Q55B
3300 pF±10%
DSS1NB32A332Q91A
DSS1NB32A332Q92A
DSS1NB32A332Q93A
DSS1NB32A472Q55B
4700 pF±10%
DSS1NB32A472Q91A
DSS1NB32A472Q92A
DSS1NB32A472Q93A
Sgec No. JENF243F-0031C-01 E ”9 Uml Mass D331N332A682092A D331N332A682093A D331 N 332A103092A D331 N 332A103093A “/n D331 N 332A153092A D331 N 332A153093A “/n D331N332A223092A D331N332A223093A “/n DSS1N331H333Q92A DSS1N331H333Q93A “/n DSS1N331H473Q92A DSS1 N331 H473Q93A “/n DSS1N331H104Q92A DSS1N331H104Q93A “A: 7. Performance Table 2 Mil
Spec No. JENF243F-0031C-01 P3/10
MURATA MFG.CO., LTD
Reference Only
4. Style and Dimension
See item 9.
5. Marking
Trade Mark Marked as
CapacitanceMarked three digits system. (Ex.221)
Rated VoltageMarked voltage value.(100V)
6. Testing Conditions
<Unless otherwise specified> <In case of doubt>
Temperature : Ordinary Temperature 15 to 35°C Perform a heat treatment at 150+0/-10°C for one hour
Humidity : Ordinary Humidity 25 to 85 %(RH) and then set at room temperature for 24±2 hours.
Temperature : 20 ± 2°C
Humidity : 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
7. Performance
No. Item Specification Test Method
7.1 Appearance and
Dimensions
Meet item 9. Visual Inspection and measured with Slide
Calipers.
7.2 Marking Marking is able to be read easily. Visual Inspection.
7.3 Capacitance and
Tolerance
Meet item 3. Table 2
Frequency Test Voltage Capacitance
1±0.1MHz 1±0.2Vrms 22pF150pF
1±0.1kHz 1±0.2Vrms 220pF100000pF
7.4 Insulation
Resistance(I.R.)
Meet item 3. Test Voltage : Rated Voltage
Time : 1 minute through a suitable resistor 1MΩ.
Customer
Part Number
Murata
Part Number Capacitance Temperature
Characteristics
Rated
Voltage
Withstanding
Voltage
Unit Mass
(Typical
value)
DSS1NB32A682Q55B
6800 pF±10%
±10%
100VDC 250VDC
0.45g
DSS1NB32A682Q91A
DSS1NB32A682Q92A
DSS1NB32A682Q93A
DSS1NB32A103Q55B
10000 pF±10%
DSS1NB32A103Q91A
DSS1NB32A103Q92A
DSS1NB32A103Q93A
DSS1NB32A153Q55B
15000 pF±10%
DSS1NB32A153Q91A
DSS1NB32A153Q92A
DSS1NB32A153Q93A
DSS1NB32A223Q55B
22000 pF±10%
DSS1NB32A223Q91A
DSS1NB32A223Q92A
DSS1NB32A223Q93A
DSS1NB31H333Q55B
33000 pF±10%
50VDC 125VDC
DSS1NB31H333Q91A
DSS1NB31H333Q92A
DSS1NB31H333Q93A
DSS1NB31H473Q55B
47000 pF±10%
DSS1NB31H473Q91A
DSS1NB31H473Q92A
DSS1NB31H473Q93A
DSS1NB31H104Q55B
100000pF±10%
DSS1NB31H104Q91A
DSS1NB31H104Q92A
DSS1NB31H104Q93A
599m. me E Tab‘eS Table 4 Table 5
Spec No. JENF243F-0031C-01 P4/10
MURATA MFG.CO., LTD
Reference Only
No. Item Specification Test Method
7.5 Withstanding
Voltage
Products shall not be damaged. Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 10 mA max.
It shall be applied between input / output terminal
and ground terminal.
7.6 Temperature
Characteristics
Meet item 3. Capacitance shall be measured at each step specified
in Table 3 after reaching the thermal equilibrium.
The capacitance change against the capacitance at
step 3 shall be calculated.
Table3
Step 1 2 3 4 5
Temp.
(°C)
+20±2
-
40±2 +20±2 +85±2 +20±2
7.7 Solderability Along the circumference of terminal
shall be covered with new solder at least
75%.
Flux : Ethanol solution of rosin,25(wt)%
(dipped for 5 to 10 seconds)
Pre-heat : 150±10, 6090 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature 245±5
Immersion Time : 2 ± 0.5 seconds
Immersion Depth :
2 to 2.5 mm from the bottom of the body.
7.8 Resistance to
Soldering Heat
Meet Table 4.
Table 4
Appearance No damaged.
Capacitance
Change within ± 30%
Withstanding
Voltage
No damaged.
Flux : Ethanol solution of rosin,25(wt)%
(dipped for 5 to 10 seconds)
Pre-heat : 150±10, 6090 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5 °C
Immersion Time : 3± 0.5 seconds
Immersion Depth :
1.6 ± 0.7 mm from the bottom of the body.
Then measured after exposure in the room
condition for 4 to 24hours.
Resistance to
Soldering Heat
Soldering iron output: 30W
Tip temperature : 370±10°C
Soldering time : 5s(+0/-1s)
7.9 Humidity Meet Table 5.
Table 5
Temperature : 60°C
Humidity : 90 to 95 %(RH)
Time : 500 hours(+24-0 hours)
Then measured after exposure in the room
condition for 4 to 24hours.
7.10 Humidity Life Temperature : 40 ± 2°C
Humidity : 90 to 95 %(RH)
Time : 500 hours(+24-0 hours)
Applying Voltage : 1H/ Rated Voltage 50VDC
2A/ Rated Voltage 100VDC
Then measured after exposure in the room
condition for 4 to 24hours.
7.11 Heat Life Temperature : 85 ± 3°C
Applying Voltage : 1H/ Rated Voltage 50VDC
2A/ Rated Voltage 100VDC
Time : 500 hours(+24-0 hours)
Then measured after exposure in the room
condition for 4 to 24hours.
Appearance No damaged.
Capacitance
Change within ± 30%
Inslation
Resistance
10MΩ min.
s m. mmmmm E .2 ,9-u ———>
Spec No. JENF243F-0031C-01 P5/10
MURATA MFG.CO., LTD
Reference Only
8. Mounting Hole
Bulk Taping
9. Style and Dimension
9.1 Bulk(Straight Lead Type) : Q55B
(
in mm)
1.Bottom of dielectric may be exposed.
2.There should not be the exposure of the ferrite bead if a hole is on the top of ferrite bead.
2.5±0.2
φ
0.8 - 3
2.5±0.2 2.5±0.2
φ
1.0 - 3
2.5±0.2
単位
mm
(in mm)
Markin g side
8.5 max 3.5 max
7.5 max
25.0 min
F1=2.5±0.5
123
(3) (1)
φ0.56
+0.8
-0.2
5.0
φ0.6
8960 No. JENF243F-0031C-01 w x2 1 Table 4 Deviafion across Ta .fronl 20.0110 16.5110 5.0 +0.8,»0.2
Spec No. JENF243F-0031C-01 P6/10
MURATA MFG.CO., LTD
Reference Only
9.2 Taping(Straight Lead Type) : Q9A
(All symbols in the illustrations below are described in Table 4)
3.5max
1.Bottom of dielectric may be exposed.
2.There should not be the exposure of the ferrite bead if a hole is on the top of ferrite bead.
Table 4
Code Description Dimensions Remark
P Pitch of Component 12.7 Product Inclination
ΔS Determines Crossing
P0 Pitch of Sprocket Hole 12.7±0.2
P1 Length from Hole Center to Lead 3.85±0.7
P2 Length from Hole Center
to Component Center 6.35±1.3
D Width of Body 8.5 max.
ΔS Deviation along tape, Left or Right 0±1.0
W Carrier Tape Width 18.0±0.5
W1 Position of Sprocket Hole 9.0 +0,-0.5 Tape Widthwise Shift
l Protrusion Length +0.5 -1.0
D0 Diameter of Sprocket Hole φ 4.0±0.1
d Lead Diameter φ 0.6
t1 Total Tape Thickness 0.7±0.2 Includes Thickness of
Bonding Tape
t2 Total Thickness,Tape and Lead Wire 1.5 max.
Δh1 Deviation across Tape,front 1.0 max.
Δh2 Deviation across Tape,rear 1.0 max.
L Portion to Cut in Case of Defect 11.0 +0,-1.0
W0 Hold Down Tape Width 12.0±0.5
W2 Hold Down Tape Position 1.5±1.5
H Lead length between sprocket
hole and forming position
Q91 20.0±1.0
Q92 16.5±1.0
Q93 18.5±1.0
F Lead Spacing 5.0 +0.8,-0.2
F1 2.5 +0.4,-0.2
(in mm)
7.5max
5W0. me E Mxmmun Packmg Form and Quanmy MURA
Spec No. JENF243F-0031C-01 P7/10
MURATA MFG.CO., LTD
Reference Only
10. Taping
(1) A maximum of 0.3% of the components quantity per Ammo pack may be missing without consecutive
missing components.
(2) The adhesive power of the tape shall have over 2.94N at the following condition.
(3) Splicing method of tape
1. Carrier tape
Carrier tape shall be spliced by cellophane tape.
Overall thickness shall be less than 1.05 mm.
(in mm)
2. Hold down tape
Hold down tape shall be spliced with overlapping.
Overall thickness shall be less than 1.05 mm.
(in mm)
3. Both carrier tape and hold down tape
Both tapes shall be cut zigzag and spliced with splicing tape.
11. Packing
11.1 Packing quantity
The standard packing quantity is as follows.
(The packing quantity may be changed due to a fraction of order.)
Minimun Packing Form and Quantity
Terminal Configuration A Unit Quantity Packing Form
Standard Quantity
in a container
(corrugated cardboard box)
Bulk 250 pcs. In a plastic bag 5000pcs.
Taping 1500 pcs. In an Ammo pack 7500pcs.
A quantity in a container is depending on a quantity of an order.
11.2 Packing Form
(1) Bulk
<A plastic bag pack>
1.Products are packed into a plastic bag. 2.The plastic bags are put into a container
(corrugated cardboard box) depending on a
quantity of an order.
Hold down tape Carrier tape
F2.94 N
30 to 50
Hold down tape
Carrier tape
Cellophane tape
Direction of feed
Overall thickness
Direction of feed
20 to 30
Hold down tape
Hold down tape
Carrier tape
Overall thickness
a plastic bag
container label
a container
the plastic bag with products
5W0. W001 E number(*1)‘ 0000 XXX
Spec No. JENF243F-0031C-01 P8/10
MURATA MFG.CO., LTD
Reference Only
(2) Taping
<An ammo pack>
1 .Folding the tape per 25 pitches,products are packed into an ammo package so that each product of each
layer wound zigzag is put on top of one another. [Fig 3]
2. The dimensions of the ammo package are indicated in [Fig 4].
3. The ammo packages are put into a container (corrugated cardboard box) depending on a quantity of an
order.
4. Not less than 3 consecutive of component shall be missing on both edge of tape.
[Fig 3] [Fig 4]
The unloading direction : Right
The hold down tape : Upper (in mm)
The product body : Left along the unloading direction
12. Marking on package
12.1 Unit Package
Bulk : Marked on a plastic bag.
Taping : Marked on a label stuck on an ammo package.
Marking on a unit package consists of :
Customer part number, MURATA part number, Inspection number(1), RoHS marking (2), Quantity, etc
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
12.2 Container
Marking on the label stuck on a container consists of :
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (2), Quantity, etc
13.
!Caution
13.1 Mounting holes
Mounting holes should be designed as specified in this specifications.
Or different design from this specifications may cause cracks in ceramics which may lead to smoking / firing.
13.2 Caution for the product angle adjust work
Take care not to apply any mechanical stress to product body at the lead terminal bending process for product
angle adjustment after insertion.
13.3 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment (7) Traffic signal equipment
(2) Aerospace equipment (7) Disaster prevention / crime prevention equipment
(3) Undersea equipment (9) Data-processing equipment
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
zig zag
label 340 max.
240 max.
51 max.
5W0. me E Solder Soldering
Spec No. JENF243F-0031C-01 P9/10
MURATA MFG.CO., LTD
Reference Only
14. Notice
14.1 Soldering
(1) Use rosin-based flux. Do not use strong acidic flux with halide content exceeding 0.2(wt)%
(chlorine conversion value).
Use Sn-3.0Ag-0.5Cu solder
(2) Standard flow soldering profile.
Solde
temperature
Soldering
time
250260 °C 46s
(3) Resistance to soldering iron goes in the following condition that tip temperature is 350 °C max. And
soldering time is 5 s max.
(4) Products and the leads should not be subjected to any mechanical stress during soldering process.
(and also while subjected to the equivalent high temperature.)
14.2 Cleaning
Products shall be cleaned on following conditions.
(1) Cleaning Temperature: 60 max.(40 max. for Isopropyl alcohol).
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power20W / l max.
Frequency28kHz 40kHz
Time 5 minutes max.
(3) Cleaning agent
1. alcohol cleaning agents.
Isopropyl alcohol (IPA)
2. Aqueous cleaning agent
Pine Alpha ST-100S
(4) Ensure that residual flux and residual cleaning agent is completely removed.
Products should be thoroughly dried after aqueous agent has been removed with de-ionized water.
(5) For other cleaning methods, please contact Murata engineering.
14.3 Operating Environment
(1) Do not use products in corrosive gases such as chlorine gas, acid or sulfide gas.
(2) Do not use products in the environment where water, oil or organic solvents may adhere to products.
(3) Do not adhere any resin to products, coat nor mold products with any resin (including adhesive)to prevent
mechanical and chemical stress on products.
14.4 Storage and handling requirements.
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
To prevent products quality deterioration, stored conditions should be controlled as follows ;
1. Temperature : -10 to 40 degrees centigrade
2. Humidity : 15 to 85% relative humidity
3. Products should be stored without sudden changes in temperature and humidity.
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid,
or it may cause oxidization of lead terminals resulting in poor solderability.
4. Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
5. Products should be stored in the warehouse without heat shock, vibration,direct sunlight and so on.
(3) Handling Conditions
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
1 minutes min. Soldering time
Solder temp.
250
200
150
100
50
Temperature (°C)
Pre- heating(in air) Soldering Gradual Cooling
(in air)
300
5W0. me E
Spec No. JENF243F-0031C-01 P10/10
MURATA MFG.CO., LTD
Reference Only
15.
!Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.