maxiFLOW™ with maxiGRIP™ Heatsinks

Advanced Thermal Solutions maxiFLOW design features a low-profile, spread-fin array that maximizes surface area for more effective convection (air) cooling. The maxiGRIP attachment applies steady, even pressure to the component and does not require holes in the PCB. These devices meet Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration, and MIL-STD-810 Shock and Unpackaged Drop Testing standards. They come preassembled with high performance, phase changing, thermal interface materials.