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FPGA Cloud Connectivity Kit | Datasheet Preview
Terasic’s Intel® FPGA Cloud Connectivity kit makes it easy to collect, analyze, and manage data from IoT edge devices. The foundation of this FPGA cloud connectivity kit is the Terasic DE10-Nano with Intel Cyclone® V SoC.
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      FPGA Cloud Connectivity Kit | Datasheet Preview

      Terasic’s Intel® FPGA Cloud Connectivity kit makes it easy to collect, analyze, and manage data from IoT edge devices. The foundation of this FPGA cloud connectivity kit is the Terasic DE10-Nano with Intel Cyclone® V SoC. This is a Microsoft Azure IoT Plug and Play Certified device. A Terasic RFS daughtercard provides sensors and wireless communication. The sensors include 3-axis accelerometer, 3-axis gyroscope, and 3-axis magnetometer, plus ambient light, humidity, and temperature. Wireless connectivity can be accomplished via Wi-Fi with up to a 100 meter range or Bluetooth SPP with up to a 10 meter range. The Terasic FPGA Cloud Connectivity Kit enables users to put a flexible and reconfigurable FPGA at the heart of their next smart, wireless IoT edge design.

      1/18/2022 4:38:22 PM

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