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Fred Pt Die Technology in eSMP Packages Slide 9

This slide shows the Fred Pt® component offering in the SMPC package. Despite being a similar size to the SMC, the SMPC package has the same thermal features as the D-Pak thanks to the large soldering pad. This package allows enables higher current density designs. The very small 1.1 mm height and 4.8 mm by 6.7 mm footprint saves space. Additionally, there are AECQ101 versions on the market.

PTM Published on: 2015-03-05