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Shown here is an overview of Infineon’s portfolio of HYPERRAM™ devices. The first-generation products, HYPERRAM 1.0 were launched in 2017 and supported only the HYPERBUS™ interface with a maximum throughput of 333MBps. HYPERRAM 2.0 is the second generation of the family. The 64Mb and 128Mb products were launched in 2019 and the 256Mb and 512Mb densities were launched in 2021. These Generation 2 devices support both the HYPERBUS as well as the Octal xSPI interface and enable a higher throughput of 400MBps. They also have better power efficiency. These were followed by the third-generation products that were launched in 2022. These are based on 16-bit extended version of the HYPERBUS protocol which doubles the throughput to 800MBps. The table on the left shows the key features of the Gen 2.0 and Gen 3.0 HYPERRAM products. The products are available only in 1.8V option. Since the Generation 3 products support a x16 bus width, they are supported in a 49-BGA package. All HYPERRAM products support both industrial- and automotive-grade temperatures.
