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Photocouplers and Photorelays |
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As a type of isolator favored by manufacturers, photocouplers now serve as noise protectors in many electronic devices. Toshiba’s photocouplers consist of either a GaAs or GaA As infrared LED(s) and a silicon photodetector(s) housed in a white mold package. GaA As LEDs are adopted in high-speed photo-IC types due to their highspeed and high-light output. Toshiba’s innovative white mold packaging also greatly contributes to high sensitivity, high CTR and superb reliability. Toshiba offers a wide variety of photocouplers in a small package to meet the space-saving requirement of increasingly smaller and thinner end products. Packaging options include mini-flat packages (MFSOPs) and half-pitch (1.27 mm) mini-flat SOP packages. Photocouplers with Reinforced Insulation in the New SO6 Package The TLP116A are housed in the SO6 package, which is pin-compatible with the conventional MFSOP6 package. However, the maximum PCB mounted height has been reduced from 2.8 mm to 2.3 mm. For reinforced insulation, the TLP116A offer clearance and creepage distances of 5 mm(min.) and an insulation thickness of 0.4 mm(min.). SO6 meets the customer needs for both a thin package and a high level of safety standard compliance. Dual-Channel High-Speed Photo-IC Couplers in a New Package Toshiba is extending its offerings of high-speed photo-IC couplers housed in the new SO8 package. The dual-channel photo-IC couplers in the SO8 package occupy approximately 40% less board space, which helps reduce product size and costs. New High-Speed Photo-IC Couplers The TLP105 and TLP108 are new additions to Toshiba’s high-speed photo-IC coupler offerings in a small, thin (MFSOP) package. These photo-IC couplers provide a typical data rate of 5 Mbps. You can select a photo-IC coupler bested suited for your application. The TLP105 has a buffer logic output, and the TLP108 has an inverter logic output. Toshiba will continue to extend the offerings of its photo-IC couplers.
Photo-IC Couplers in a New SDIP Package The photo-IC couplers housed in SDIP(shrink dual in-line package) meets the requirements for reinforced insulation. SDIP is small, so save board space by an approximately 50% compared to the 8-pin DIP. Various types of SDIP are lined up as shown at right table, so you can select from IPM driver to direct driver of medium-power IGBT and MOSFET.
Low-CR Photorelays for Semiconductor Testers and Measurement Instruments The TLP32xx photorelay series exhibits lower output pin capacitance (COFF) and on-state resistance (RON) than their predecessors. The TLP32xx feature CR values of 2.5 pF.Ω, 5 pF.Ω and 10 pF.Ω, which are approximately equivalent to those of reed relays. These photorelays have been developed to meet the requirements for high-speed operation, high reliability and small form factor being demanded for testers and measuring instruments for rapidly evolving semiconductor devices and mobile equipment. Besides, the TLP32xx Series is housed in the industry's smallest package, the 4-pin SSOP, and can achieve high-density board assembly of 50 devices/inch². The new TLP3203 features lower on-state resistance(RON) of 0.18 Ω(typ.).
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Toshiba Semiconductor & Storage
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