Panasonic Electronic Components 的 EYG-S Series, Soft-PGS Prod Intro 规格书

Panasonic 0
Relays & Connectors • Capacitors • Circuit Protection • Electromechanical • Sensors • Industrial Automation • Resistors & Inductors • Semiconductors • Wireless Connectivity
Two Riverfront Plaza, 7th Floor, Newark, NJ 07102-5490 | na.industrial.panasonic.com | industrial@us.panasonic.com | 1-800-344-2112
Panasonic’s new Thermal Management material, “Soft PGS”, is an ideal
Thermal Interface Material (TIM) solution designed with high compress-
ibility characteristics to reduce contact thermal resistance between
rough surfaces in extremely thin spaces. Custom cut to IGBT Module
footprints, Soft PGS contributes to long life and increased performance
of power modules by providing high thermostability and reliability in
thermally sensitive areas. Soft PGS is easy to install with a one-to-two-
step process that requires much lower labor and installation costs than
thermal grease.
Soft PGS is a Graphite Sheet that is dedicated for use as a Thermal
Interface Material. Soft PGS has very high compressibility compared
to standard PGS, which reduces thermal resistance by following gap,
warpage and distortion of targets/substrates. Excellent heat resistance
and reliability of Soft PGS allows longer service life and higher
performance of various components, such as Semiconductors.
Soft PGS is cost-saving, because it allows the reduction of existing
Thermal Management processes. Unlike grease, Soft PGS eliminates
the need for the printing process, since it is a sheet-type product.
* Please contact Panasonic for custom-made Soft PGS products as well.
Soft PGS Features:
• Low Thermal Resistance: 0.2°C•cm2/W (600 kpa)
• Compressibility: 40% (600 kpa)
• Operating Temperature Range: -55°C to 400°C
• High Thermostability Up To 400°C And High Reliability Against
Intense Heat Cycles (-55°C~150°C)
• RoHS Compliant
Soft PGS Benefits:
• Custom Cut Footprints For IGBT Modules From Major
IGBT Manufacturers
• Available In Standard Sized Sheets
• Increased Heat Transfer Due To Better Fitting On Uneven Surfaces
• Simple and Low Cost Procedure For Installation
• Low Maintenance
• Increases The Lifetime and Reliability Of The IGBT Module
CIRCUIT PROTECTION
New “Soft PGS” Compressible
Type From Panasonic
A New PGS Graphite Sheet Thermal Interface
Material Solution Designed Specifically For Use
With IGBT Modules!
Typical Characteristics
Items Test Method
Condition
Data
Thickness (m) TIM Tester 200
Thermal Resistance (°C•cm/W) TIM Tester 600 kPa 0.2
Compressibility (%) TIM Tester 600 kPa 40
Thermal Conductivity (W/m•K) Laser PIT X-Y 400 (300 to 600)
Z (30)
Operating Temperature Range (°C) -55 to 400
Table 1: Soft PGS Characteristics
Soft PGS White Paper_v2.indd 1 12/9/16 1:33 PM
Relays & Connectors • Capacitors • Circuit Protection • Electromechanical • Sensors • Industrial Automation • Resistors & Inductors • Semiconductors • Wireless Connectivity
Two Riverfront Plaza, 7th Floor, Newark, NJ 07102-5490 | na.industrial.panasonic.com | industrial@us.panasonic.com | 1-800-344-2112
2
CIRCUIT PROTECTION
To Minimize The Thermal Resistance Between The Baseplate And The Heat
Sink, Engineers Traditionally Apply A Thermal Interface Material (TIM).
IGBT Module Cross Section
IGBT TIM (Thermal Interface Material
Thermal Grease or PCM)
Base Plate
Heat Sink
Figure 2: What Is “Soft PGS”?
Soft PGS Is A Thicker, Less Dense And More Soft Version Of Panasonic’s Standard PGS Material That Replaces Traditional Thermal Interface
Materials Such As Thermal Grease In IGBT Applications
IGBT Module
Soft PGS
Heat Sink
Heat Sink
IGBT
Base Plate
Heat Sink
No air gaps
Soft PGS
Soft PGS for the IGBT Module
Figure 1:Soft PGS Replaces Traditional Thermal Management For IGBT Modules
An IGBT Module Is Typically Mounted To A Heat Sink To Maintain
Relatively Low Operating Temperatures For Optimal Performance
Soft PGS White Paper_v2.indd 2 12/9/16 1:33 PM
~ L 31 Resistance Depending 0n Pressure
Relays & Connectors • Capacitors • Circuit Protection • Electromechanical • Sensors • Industrial Automation • Resistors & Inductors • Semiconductors • Wireless Connectivity
Two Riverfront Plaza, 7th Floor, Newark, NJ 07102-5490 | na.industrial.panasonic.com | industrial@us.panasonic.com | 1-800-344-2112
Figure 3: Soft PGS Structure - A High Sintering Process
Creates The Large Layer Void In The Soft PGS That Makes
Higher Compressibility Possible
Figure 4: Comparison With Grease (Ref.)
3
CIRCUIT PROTECTION
Regular PGS Small Layer Void
Void
Large Layer Void
Soft PGS
Figure 6: Compressibility Depending On Pressure
Figure 5: Thermal Resistance Depending On Pressure
Thermal Resistance
(°C•cm2/w)
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0 100 200 300 400 500 600
Pressure (kPa)
Compression Rate (%)
60%
50%
40%
30%
20%
10%
0%
0 100 200 300 400 500 600 700
Pressure (kPa)
Material Initial 120 Times Deterioration
(Thermal Resistance)
Grease Significantly Deteriorated
Soft-PGS Slightly Deteriorated
Pump-Out Test Heat Cycle (-40 – 100°C)
Soft PGS White Paper_v2.indd 3 12/9/16 1:33 PM