Panasonic Electronic Components 的 EYG-T Series Product Information 规格书

New Product Introduction
Introducing The New EYG-T Series “Graphite-
PAD” Thermal Interface Material From Panasonic
High Thermal Conductivity In The Z-Direction With Superior
Flexibility
Panasonic, a worldwide leader in Thermal Management Products, is
pleased to introduce NEW EYG-T Series “Graphite-PAD”. This new
addition to Panasonic’s line of Thermal Management solutions is a thermal
interface material that compatibly obtains excellent thermal conductivity in
Z-axis thickness direction along with providing superior flexibility. The new
Graphite-PAD product provides properties that are greater than that of
most existing thermal interface materials.
Graphite-PADs are composed of silicone resin and Pyrolytic Graphite
Sheets (PGS) as filler. This combination of materials offers high Thermal
Management reliability by enabling designs with high heat dissipation. The
PGS inside the resin is oriented in a vertical direction as shown in Figure 1.
This oriented structure provides excellent thermal conductivity in thickness
direction. The component is very flexible (deformable) since it is mainly
composed of silicone resin. Being deformable with a low load facilitates
installation.
Features
• Low Thermal Conductivity In Thickness Direction
• Thermal Conductivity Of The Material: 13 W/m・K
• Excellent Flexibility
• Thickness Range: 0.5 to 3.0 mm
• Hardness: TYPE E 25
• Excellent Compressibility: 50% (t=2 mm, Pressure 300 kPa)
• Tackiness: Material Holds Onto Surface Or Component
• High Reliability: Corresponds To -40oC to 150oC and Maintains
Long-Term Reliability
• RoHS Compliant
Benefits
• Can Be Bent And Used On Curved Surfaces
• Compressibility Up To Almost 60%
• Tackiness On Both Sides Of The Pad Due To The Silicone Resin
Holds The Material Onto A Surface Or Component
• Improved Thermal Conductivity In Thickness Direction Is Obtained By
Having PGS Graphite Sheet® Oriented In Vertical Direction Filled
Into Silicon Resin
• Provides Efficient Heat Conduction Thanks To Its High Adhesion
Performance Generated From Flexibility. Flexibility Also Provides
Degree Of Freedom In Design Because The Component Can Be Set
Onto Heat Sources With A Low Load
Industries
Power
Audio / Visual
Communications
Applications
Micro Inverters, IGBT Modules, FETS
Radio Devices
Touch Panels
Cameras
Optical Transceivers