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Samtec Inc.

是 P.C. 板级互连器件领域的世界级制造商。 Samtec 是一家全球化制造商,提供十分广泛的电子互连器件解决方案,包括微间距板对板系统(间距为 0.100"、2 mm、0.050"、1 mm、0.8 mm、0.635 mm、0.5 mm 和 0.4 mm)、 高速夹层系统、高密度阵列、IC 至板、前瞻性/有源光纤、稳固的电源系统和电缆组件(IDC、分立线、密封/圆形和高速度)。

为了迎接未来的互连器件挑战,Samtec 建立了专门的“技术中心”,用于开发和推进各种性能和成本优势兼具的技术、产品,以确保从裸芯片到 100 米以外的接口以及这两者之间所有互连点的全面系统优化。

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The Samtec Story

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Samtec offers a broad line of electronic interconnect solution blocks, including IC-to-Board/Ultra Micro, High Speed Board-to-Board, High Speed Cables, Future-Proof/Active Optics, Flexible Stacking, and Micro/Rugged components and cables. Learn More

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Newest Products 查看全部 (13)

MEC5 微型边缘卡连接器

Samtec 的 MEC5 边缘卡连接器是一种灵活的解决方案,具有多个引脚数和方向选项。 了解详情

UMPx Series 2.00 mm Ultra Micro Power Interconnect System

Samtec’s mPOWER™ connector is a high-power/small form factor power interconnect with up to 21 A per blade. 了解详情

EdgeRate® 高速端子系统

Samtec Edge Rate® 端子系统采用 ERM8 和 ERF8 系列,专为高达 56 Gbps PAM4 的高速运行以及高循环应用而设计。 了解详情

Tiger Eye™ 互连系统

Samtec 的 Tiger Eye™ 互连系统有三种点距,专为微型坚固、高可靠性、高循环应用而设计。 了解详情

SSM/TSM 系列板卡堆叠解决方案

Samtec 的板卡堆叠互连产品具有各种设计、点距和柱高选项、方向和主体位置。 了解详情

SEARAY™ 高密度开放式引脚区域阵列

Samtec 的 SEARAY™ 开放式引脚区域阵列采用0.050"x 0.050" (1.27 mm x 1.27 mm) 间距网格,可实现最大的接地和布线灵活性。 了解详情

Recent PTMs 查看全部 (2)

Rugged/Power Connectors 发布日期:2011-11-16

Samtec’s micro rugged connectors features include rugged Tiger Eye and Edge Rate contacts, IP68 waterproofed cables, and high speed, signal integrity Q series.

Duration: 10 minutes
Board-to-Board Connectors 发布日期:2011-11-16

Summary of Samtec's board-to-board interconnect solutions, discussion of the various types of contact systems available and their features and benefits.

Duration: 5 minutes

Featured Videos 查看全部 (13)

Micro Rugged & Power Interconnects - Samtec

High cycle, high speed, high power, and harsh environment solutions that maximize space within a system. This includes IP68 & IP67 Sealed, Flexible Power, Rugged Signal Integrity, and Rugged Contact System designs.

Samtec Product Overview

From standard products to unique high-performance designs, Samtec’s offering is designed to support any interconnectivity need, regardless of application, performance requirements or environment.

XCede® HD - Samtec’s High-Density Backplane System

XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. Visit samtec.com/XCedeHD for more information.

ExaMAX

This brief video showcases our emerging backplane technology in our new ExaMax system capable of 28+ Gbps while providing reliable contacts and low mating force. Visit samtec.com/ExaMax for more information.

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