Contact Pucks

Molex's contact pucks offer excellent electrical contact and mechanical hardness ideal for docking applications

Image of Molex's Contact PucksMolex's industry-leading miniature contact pucks offer superb contact quality and reliable docking-based charging of wearable and mobile devices.

The major challenge for the design of electrical contacts is to ensure a predictable, reproducible, and satisfactory field performance. Many aspects and parameters need to be considered especially in the design and manufacture of miniature contacts to achieve reliable connectivity, and some of these include the quality and hardness of the mating contact surface. Leveraging a special production technique, Molex has been able to manufacture contact pucks with a highly even contact surface.

The use of CNC-machining to achieve the contact surface quality as even as that of the series 105402 contact puck has proved difficult. Spot-gold plating is applied on the mating contact surface to produce the mechanical hardness and electrical conductivity required for the most stringent application requirements.

The highly even mating surface of the Molex contact puck is vital for good metal-to-metal contact and high electrical conductivity during charging (on docking stations). The smoothness of the puck surface is not manufacturable with ordinary machining. By profiling the puck such that the original thickness of the material is maintained, Molex can achieve a surface quality and finish not achievable by machining or polishing techniques.

Features
  • Voltage (max.): 50 VDC
  • Current (max.): 0.5 A per contact
  • Contact resistance (max.): 10 milliohms
  • Housing (carrier or cap): LCP E130i
  • Operating temperature -20°C to +70°C
  • Contact (puck): phosphor bronze
  • PCB thickness (interposer): custom-specific
  • Plating
    • Contact area: 0.1 micron gold (Au) min. over full surface and 0.76 micron gold (Au) within 0.60 mm internal diameter
  • Solder area: 0.05 micron Gold (flash) within 1.0 mm internal diameter of PCB solder area
  • Underplating: full nickel (Ni) with 1.25 micron nickel within contact and solder areas
Applications  
  • Consumer (wearable devices)
    • Activity trackers
    • Electronic bracelets
    • Fitness gadgets
    • Smart watches
  • Smart phones and mobile devices
  • Medical
    • Telehealth applications

Contact Pucks

图片制造商零件编号描述触头表面处理厚度 - 柱(配接)颜色可供货数量价格查看详情
CONN HDR 1POS STACK SMD GOLD1054020022CONN HDR 1POS STACK SMD GOLD30.0µin(0.76µm)-0 - 立即发货See Page for Pricing查看详情
发布日期: 2018-08-16