Microchip Technology 的 MIC5207 规格书

‘ Mlcgcmp M |C5207
2017-2018 Microchip Technology Inc. DS20005719B-page 1
MIC5207
Features
• Output Voltage Range: 1.8V – 15V
• Ultra-Low-Noise Output
• High Output Voltage Accuracy
• Guaranteed 180 mA Output
• Low Quiescent Current
• Low Dropout Voltage
• Extremely Tight Load and Line Regulation
• Very Low Temperature Coefficient
• Current and Thermal Limiting
• Reversed-Battery Protection
• “Zero” Off-Mode Current
• Logic-Controlled Electronic Enable
Applications
• Cellular Telephones
• Laptop, Notebook, and Palmtop Computers
• Battery Powered Equipment
• PCMCIA VCC and VPP Regulation/Switching
• Consumer/Personal Electronics
• SMPS Post-Regulator and DC/DC Modules
• High-Efficiency Linear Power Supplies
General Description
The MIC5207 is an efficient linear voltage regulator
with ultra-low-noise output, very low dropout voltage
(typically 17 mV at light loads and 165 mV at 150 mA),
and very low ground current (720 µA at 100 mA
output). The MIC5207 offers better than 3% initial
accuracy.
Designed especially for hand-held, battery-powered
devices, the MIC5207 includes a CMOS or TTL
compatible enable/shutdown control input. When in
shutdown, power consumption drops nearly to zero.
Key MIC5207 features include a reference bypass pin
to improve its already low-noise performance,
reversed-battery protection, current limiting, and over
temperature shutdown.
The MIC5207 is available in fixed and adjustable output
voltage versions in a small SOT-23-5 package. Contact
Microchip for details.
For low-dropout regulators that are stable with ceramic
output capacitors, see the µCap MIC5245/6/7 family.
Package Types
MIC5207 (ADJ.)
SOT-23-5 (M5)
(Top View)
MIC5207 (FIXED)
SOT-23-5 (M5)
TSOT-23-5 (D5)
(Top View)
IN
OUTBYP
EN
LExx
13 2
GND
54
IN
OUTADJ
EN
LEAA
13
4
2
GND
PART
IDENTIFICATION
5
180 mA Low-Noise LDO Regulator
SUPPLY \NPUT (P‘N 1)
MIC5207
DS20005719B-page 2 2017-2018 Microchip Technology Inc.
Typical Application Circuit
Functional Diagrams
MIC5207
SOT-23-5
BATTERY-POWERED REGULATOR APPLICATION
15
34
2
COUT
ENABLE
SHUTDOWN
VOUT
MIC5207-x.xYM5
ENABLE (PIN 3) MAY BE
CONNECTED DIRECTLY TO
SUPPLY INPUT (PIN 1).
VIN
EN
ULTRA-LOW-NOISE
FIXED REGULATOR
ULTRA-LOW-NOISE
ADJUSTABLE REGULATOR
IN
EN
OUT
BYP
C
BYP
(OPTIONAL)
GND
V
REF
BANDGAP
REF.
CURRENT LIMIT
THERMAL SHUTDOWN
C
OUT
V
OUT
V
IN
MIC5207-X.XYM5
IN
EN
OUT
C
BYP
(OPTIONAL)
GND
V
REF
BANDGAP
REF.
CURRENT LIMIT
THERMAL SHUTDOWN
C
OUT
V
OUT
V
IN
R1
R2
MIC5207YM5
ADJ
2017-2018 Microchip Technology Inc. DS20005719B-page 3
MIC5207
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Input Voltage (VIN) .......................................................................................................................... –20V to +20V
Enable Input Voltage (VEN) ......................................................................................................................... –20V to +20V
Power Dissipation (PD) (Note 1) ............................................................................................................ Internally Limited
Operating Ratings ‡
Supply Input Voltage (VIN) ......................................................................................................................... +2.5V to +16V
Adjustable Output Voltage Range (VOUT) .................................................................................................. +1.8V to +15V
Enable Input Voltage (VEN) .................................................................................................................................0V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA.
Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regula-
tor will go into thermal shutdown. The θJA of the SOT-23-5 (M5) is 235°C/W soldered on a PC board (see
“Thermal Considerations” for further details).
MIC5207
DS20005719B-page 4 2017-2018 Microchip Technology Inc.
TABLE 1-1: ELECTRICAL CHARACTERISTICS (Note 1)
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; CL = 1.0 μF; VEN ≥ 2.0V; TJ = +25°C, bold values indicate
–40°C ≤ TJ ≤ +125°C except 0°C < TJ < +125°C for 1.8V; unless noted.
Parameter Symbol Min. Typ. Max. Units Conditions
Output Voltage Accuracy VO
–3 — 3 % Variation from nominal VOUT
–4 — 4
Output Voltage
Temperature Coefficient ΔVO/ΔT — 40 —ppm/°CNote 2
Line Regulation ΔVO/VO
— 0.005 0.05 %V
IN = VOUT + 1V to 16V
——0.10
Load Regulation ΔVO/VO
— 0.05 0.5 %I
L = 0.1 mA to 150 mA, Note 3
——0.7
Dropout Voltage, Note 4 VIN – VO
—1760
mV
IL = 100 µA
——80
— 115 175 IL = 50 mA
——250
—140280 IL = 100 mA
——325
—165300 IL = 150 mA
——400
Quiescent Current IGND
—0.01 1 µA VEN ≤ 0.4V (shutdown)
—— 5VEN ≤ 0.18V (shutdown)
Ground Pin Current
(Note 5)IGND
—80130
µA
VEN ≥ 2.0V, IL = 100 µA
——170
—350650 IL = 50 mA
——900
— 720 1100 IL = 100 mA
——2000
— 1800 2500 IL = 150 mA
——3000
Ripple Rejection PSRR — 75 — dB —
Current Limit ILIMIT —320500 mAV
OUT = 0V
Thermal Regulation ΔVO/ΔPD—0.05— %/WNote 6
Output Noise en—100— µV—
2017-2018 Microchip Technology Inc. DS20005719B-page 5
MIC5207
Enable Input
Enable Input Logic-Low
Voltage VIL
——0.4 V Regulator shutdown
——0.18
Enable Input Logic-High
Voltage VIH 2.0 — — V Regulator enable
Enable Input Current
IIL
—0.01–1
µA
VIL ≤ 0.4V
——–2 VIL ≤ 0.18V
IIH
—520 V
IH ≥ 2.0V
——25 VIH ≥ 2.0V
Note 1: Specification for packaged product only.
2: Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total
temperature range.
3: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 0.1 mA to 180 mA. Changes in output voltage due to heat-
ing effects are covered by the thermal regulation specification.
4: Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
5: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
6: Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipa-
tion is applied, excluding load or line regulation effects. Specifications are for a 180 mA load pulse at VIN =
16V for t = 10 ms.
TABLE 1-1: ELECTRICAL CHARACTERISTICS (Note 1) (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; CL = 1.0 μF; VEN ≥ 2.0V; TJ = +25°C, bold values indicate
–40°C ≤ TJ ≤ +125°C except 0°C < TJ < +125°C for 1.8V; unless noted.
Parameter Symbol Min. Typ. Max. Units Conditions
(2.5 s v0UT
MIC5207
DS20005719B-page 6 2017-2018 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Storage Temperature Range TS–65 — +150 °C —
Lead Temperature — — — +260 °C Soldering, 5 sec.
Junction Temperature
(2.5 ≤ VOUT ≤ 15V)
TJ–40 — +125 °C All, except 1.8V
Junction Temperature
(1.8V ≤ VOUT < 2.5V)
TJ0 — +125 °C 1.8V only
Package Thermal Resistance
Thermal Resistance SOT-23 θJA —235 —°C/W —
θJC —130 — —
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2017-2018 Microchip Technology Inc. DS20005719B-page 7
MIC5207
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: Power Supply Rejection
Ratio.
FIGURE 2-2: Power Supply Rejection
Ratio.
FIGURE 2-3: Power Supply Ripple
Rejection vs. Voltage Drop.
FIGURE 2-4: Power Supply Rejection
Ratio.
FIGURE 2-5: Power Supply Rejection
Ratio.
FIGURE 2-6: Power Supply Ripple
Rejection vs. Voltage Drop.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
-100
-80
-60
-40
-20
0
1E+11E+2 1E+3 1E+4 1E+5 1E+6 1E+7
)Bd( RRSP
FREQUENCY (Hz)
IOUT = 100μA
COUT = 1μF
VIN = 6V
VOUT = 5V
10 100 1k 10k 100k 1M 10M
-100
-80
-60
-40
-20
0
1E+11E+2 1E+3 1E+4 1E+5 1E+6 1E+7
)Bd( RRSP
FREQUENCY (Hz)
I
OUT
= 100μA
C
OUT
= 2.2μF
C
BYP
= 0.01μF
V
IN
= 6V
V
OUT
= 5V
10 100 1k 10k 100k 1M 10M
-100
-80
-60
-40
-20
0
1E+11E+2 1E+3 1E+4 1E+5 1E+6 1E+7
)Bd( RRSP
FREQUENCY (Hz)
IOUT = 1mA
COUT = 1μF
VIN = 6V
VOUT = 5V
10 100 1k 10k 100k 1M 10M
-100
-80
-60
-40
-20
0
1E+11E+2 1E+3 1E+4 1E+5 1E+6 1E+7
)Bd( RRSP
FREQUENCY (Hz)
I
OUT
= 1mA
C
OUT
= 2.2μF
C
BYP
= 0.01μF
V
IN
= 6V
V
OUT
= 5V
10 100 1k 10k 100k 1M 10M
0
10
20
30
40
50
60
70
80
90
100
0 0.1 0.2 0.3 0.4
)Bd( NOITCEJER ELPPIR
VOLTAGE DROP (V)
I
OUT
= 100mA
10mA
1mA
C
OUT
= 2.2μF
C
BYP
= 0.01μF
MIC5207
DS20005719B-page 8 2017-2018 Microchip Technology Inc.
FIGURE 2-7: Power Supply Rejection
Ratio.
FIGURE 2-8: Power Supply Rejection
Ratio.
FIGURE 2-9: Turn-On Time vs. Bypass
Capacitance.
FIGURE 2-10: Power Supply Rejection
Ratio.
FIGURE 2-11: Power Supply Rejection
Ratio.
FIGURE 2-12: Dropout Voltage vs. Output
Current.
-100
-80
-60
-40
-20
0
1E+11E+2 1E+3 1E+4 1E+5 1E+6 1E+7
)Bd( RRSP
FREQUENCY (Hz)
I
OUT
= 10mA
C
OUT
= 1μF
V
IN
= 6V
V
OUT
= 5V
10 100 1k 10k 100k 1M 10M
-100
-80
-60
-40
-20
0
1E+11E+2 1E+3 1E+4 1E+5 1E+6 1E+7
)Bd( RRSP
FREQUENCY (Hz)
IOUT = 10mA
COUT = 2.2μF
CBYP = 0.01μF
VIN = 6V
VOUT = 5V
10 100 1k 10k 100k 1M 10M
10
100
1000
10000
10 100 1000 10000
( EMITμ)s
CAPACITANCE (pF)
-100
-80
-60
-40
-20
0
1E+1 1E+2 1E+3 1E+41E+5 1E+6 1E+7
)Bd( RRSP
FREQUENCY (Hz)
IOUT = 100mA
COUT = 1μF
VIN = 6V
VOUT = 5V
10 100 1k 10k 100k 1M 10M
-100
-80
-60
-40
-20
0
1E+1 1E+2 1E+31E+4 1E+5 1E+6 1E+7
)Bd( RRSP
FREQUENCY (Hz)
IOUT = 100mA
COUT = 2.2μF
CBYP = 0.01μF
VIN = 6V
VOUT = 5V
10 100 1k 10k 100k 1M 10M
0
40
80
120
160
200
240
280
320
0 40 80 120 160
)Vm( EGATLOV TUOPORD
OUTPUT CURRENT (mA)
+125°C
+25°C
–40°C
2017-2018 Microchip Technology Inc. DS20005719B-page 9
MIC5207
FIGURE 2-13: Noise Performance.
FIGURE 2-14: Noise Performance.
FIGURE 2-15: Noise Performance.
FIGURE 2-16: Noise Performance.
FIGURE 2-17: Noise Performance.
FIGURE 2-18: Noise Performance.
0.0001
0.001
0.01
0.1
1
10
1E+1 1E+2 1E+3 1E+4 1E+51E+6 1E+7
( ESIONμ/V¥)zH
FREQUENCY (Hz)
10 100 1k 10k 100k 1M 10M
1mA
COUT = 1μF
CBYP = 10nF
10mA, COUT = 1μF
VOUT = 5V
0.0001
0.001
0.01
0.1
1
10
1E+1 1E+2 1E+3 1E+4 1E+5 1E+61E+7
( ESIONμ/V¥)zH
FREQUENCY (Hz)
10mA
1mA
100mA
10 100 1k 10k 100k 1M 10M
V
OUT
= 5V
C
OUT
= 10μF
electrolytic
0.0001
0.001
0.01
0.1
1
10
1E+1 1E+2 1E+3 1E+4 1E+5 1E+61E+7
( ESIONμ/V¥)zH
FREQUENCY (Hz)
10mA
1mA
100mA
10 100 1k 10k 100k 1M 10M
V
OUT
= 5V
C
OUT
= 22μF
tantalum
C
BYP
= 10nF
0.0001
0.001
0.01
0.1
1
10
1E+1 1E+2 1E+3 1E+4 1E+5 1E+61E+7
( ESIONμ/V¥)zH
FREQUENCY (Hz)
10mA
1mA
100mA
10 100 1k 10k 100k 1M 10M
VOUT = 5V
COUT = 10μF
electrolytic
CBYP = 100pF
0.0001
0.001
0.01
0.1
1
10
1E+1 1E+2 1E+3 1E+4 1E+5 1E+61E+7
( ESIONμ/V¥)zH
FREQUENCY (Hz)
10mA
1mA
100mA
10 100 1k 10k 100k 1M 10M
V
OUT
= 5V
C
OUT
= 10μF
electrolytic
C
BYP
= 1nF
0.0001
0.001
0.01
0.1
1
10
1E+1 1E+2 1E+3 1E+4 1E+5 1E+61E+7
( ESIONμ/V¥)zH
FREQUENCY (Hz)
10mA
1mA
100mA
10 1k100 10k 100k 1M 10M
V
OUT
= 5V
C
OUT
= 10μF
electrolytic
C
BYP
= 10nF
MIC5207
DS20005719B-page 10 2017-2018 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number Pin Name Description
1 IN Supply input.
2 GND Ground.
3 EN Enable/Shutdown (Input): CMOS-compatible input. Logic-high = enable, logic-low =
shutdown. Do not leave floating.
4 (Fixed) BYP Reference Bypass: Connect external 470 pF capacitor to GND to reduce output noise.
May be left open. For 1.8V or 2.5V operation, see Applications Information section.
4 (Adj.) ADJ Adjust (Input): Adjustable regulator feedback input. Connect to resistor voltage divider.
5 OUT Regulator output.
The aciuai power dissipation ofihe regulaior circuit can
2017-2018 Microchip Technology Inc. DS20005719B-page 11
MIC5207
4.0 APPLICATIONS INFORMATION
4.1 Enable/Shutdown
Forcing EN (enable/shutdown) high (> 2V) enables the
regulator. EN is compatible with CMOS logic gates.
If the enable/shutdown feature is not required, connect
EN (pin 3) to IN (supply input, pin 1). See Figure 4-1.
4.2 Input Capacitor
A 1 µF capacitor should be placed from IN to GND if
there is more than 10 inches of wire between the input
and the AC filter capacitor or if a battery is used as the
input.
4.3 Reference Bypass Capacitor
Reference bypass (BYP) is connected to the internal
voltage reference. A 470 pF capacitor (CBYP)
connected from BYP to GND quiets this reference,
providing a significant reduction in output noise. CBYP
reduces the regulator phase margin; when using CBYP,
output capacitors of 2.2 µF or greater are generally
required to maintain stability.
The start-up speed of the MIC5207 is inversely
proportional to the size of the reference bypass
capacitor. Applications requiring a slow ramp-up of
output voltage should consider larger values of CBYP.
Likewise, if rapid turn-on is necessary, consider
omitting CBYP.
If output noise is not a major concern, omit CBYP and
leave BYP open.
4.4 Output Capacitor
An output capacitor is required between OUT and GND
to prevent oscillation. The minimum size of the output
capacitor is dependent upon whether a reference
bypass capacitor is used. 1.0 µF minimum is
recommended when CBYP is not used (see Figure 4-2).
2.2 µF minimum is recommended when CBYP is 470 pF
(see Figure 4-1). Larger values improve the regulator’s
transient response. The output capacitor value may be
increased without limit.
The output capacitor should have an ESR (effective
series resistance) of about 5Ω or less and a resonant
frequency above 1 MHz. Ultra-low-ESR (ceramic)
capacitors can cause a low amplitude oscillation on the
output and/or under-damped transient response. Most
tantalum or aluminum electrolytic capacitors are
adequate; film types will work, but are more expensive.
Since many aluminum electrolytics have electrolytes
that freeze at about –30°C, solid tantalums are
recommended for operation below –25°C.
At lower values of output current, less output
capacitance is required for output stability. The
capacitor can be reduced to 0.47 µF for current below
10 mA or 0.33 µF for currents below 1 mA.
4.5 No-Load Stability
The MIC5207 will remain stable and in regulation with
no load (other than the internal voltage divider) unlike
many other voltage regulators. This is especially
important in CMOSRAM keep-alive applications.
4.6 Thermal Considerations
The MIC5207 is designed to provide 180 mA of
continuous current in a very small package. Maximum
power dissipation can be calculated based on the
output current and the voltage drop across the part. To
determine the maximum power dissipation of the
package, use the junction-to-ambient thermal
resistance of the device and the following basic
equation shown in Equation 4-1:
EQUATION 4-1:
TJ(MAX) is the maximum junction temperature of the
die, +125°C, and TA is the ambient operating
temperature. θJA is layout dependent; Tab le 4-1 shows
examples of junction-to-ambient thermal resistance for
the MIC5207.
The actual power dissipation of the regulator circuit can
be determined using Equation 4-2:
EQUATION 4-2:
Substituting PD(MAX) for P
D and solving for the
operating conditions that are critical to the application
will give the maximum operating conditions for the
regulator circuit. For example, when operating the
TABLE 4-1: SOT-23-5 THERMAL
RESISTANCE
θJA Rec.
Min. Footprint
θJA 1” Square
Copper Clad θJ/C
235°C/W 170°C/W 130°C/W
PDMAX
TJMAX
TA
–
JA
-------------------------------------=
PDVIN VOUT
–IOUT
VIN
+IGND
=
with Loerropoul Voilage Reguialors Designing WW fl
MIC5207
DS20005719B-page 12 2017-2018 Microchip Technology Inc.
MIC5207-3.3YM5 at room temperature with a minimum
footprint layout, the maximum input voltage for a set
output current can be determined with Equation 4-3:
EQUATION 4-3:
The junction-to-ambient thermal resistance for the
minimum footprint is 235°C/W, from Ta ble 4-1. The
maximum power dissipation must not be exceeded for
proper operation. Using the output voltage of 3.3V and
an output current of 150 mA, the maximum input
voltage can be determined. From Table 1-1, the
maximum ground current for 150 mA output current is
3000 µA or 3 mA.
EQUATION 4-4:
Where:
EQUATION 4-5:
Then:
EQUATION 4-6:
Resulting in:
EQUATION 4-7:
Therefore, a 3.3V application at 150 mA of output
current can accept a maximum input voltage of 6V in a
SOT-23-5 package. For a full discussion of heat sinking
and thermal effects on voltage regulators, refer to the
Regulator Thermals section of Microchip’s Designing
with Low-Dropout Voltage Regulators handbook.
4.7 Low-Voltage Operation
The MIC5207-1.8 and MIC5207-2.5 require special
consideration when used in voltage-sensitive systems.
They may momentarily overshoot their nominal output
voltages unless appropriate output and bypass
capacitor values are chosen.
During regulator power up, the pass transistor is fully
saturated for a short time, while the error amplifier and
voltage reference are being powered up more slowly
from the output (see Functional Diagrams). Selecting
larger output and bypass capacitors allows additional
time for the error amplifier and reference to turn on and
prevent overshoot.
To ensure that no overshoot is present when starting up
into a light load (100 µA), use a 4.7 µF output
capacitance and 470 pF bypass capacitance. This
slows the turn-on enough to allow the regulator to react
and keep the output voltage from exceeding its nominal
value. At heavier loads, use a 10 µF output
capacitance and 470 pF bypass capacitance. Lower
values of output and bypass capacitance can be used,
depending on the sensitivity of the system.
Applications that can withstand some overshoot on the
output of the regulator can reduce the output capacitor
and/or reduce or eliminate the bypass capacitor.
Applications that are not sensitive to overshoot due to
power-on reset delays can use normal output and
bypass capacitor configurations.
Please note the junction temperature range of the
regulator with an output less than 2.5V fixed and
adjustable is 0°C to +125°C.
4.8 Fixed Regulator Applications
FIGURE 4-1: Ultra-Low-Noise
Fixed-Voltage Application.
PDMAX
125oC25oC–
235oC/W
---------------------------------- 4 2 5 mW==
425mW VIN 3.3V–150mAVIN
+3mA=
425mW VIN 150mA 495mW VIN 3mA+–=
920mW VIN 153mA=
VIN MAX
6.01V=
15
2
34
2.2μF
VOUT
MIC5207-x.xYM5
VIN
470pF
2017-2018 Microchip Technology Inc. DS20005719B-page 13
MIC5207
Figure 4-1 includes a 470 pF capacitor for
ultra-low-noise operation and shows EN (pin 3)
connected to IN (pin 1) for an application where
enable/shutdown is not required. COUT = 2.2µF
minimum.
FIGURE 4-2: Low-Noise Fixed-Voltage
Application.
Figure 4-2 is an example of a basic low-noise
configuration. COUT = 1 µF minimum.
4.9 Adjustable Regulator Applications
The MIC5207YM5 can be adjusted to a specific output
voltage by using two external resistors (Figure 4-3).
The resistors set the output voltage based on
Equation 4-8:
EQUATION 4-8:
This equation is correct due to the configuration of the
bandgap reference. The bandgap voltage is relative to
the output, as seen in the Functional Diagrams.
Traditional regulators normally have the reference
voltage relative to ground; therefore, their equations
are different from the equation for the MIC5207YM5.
Resistor values are not critical because ADJ (adjust)
has a high input impedance, but for best results use
resistors of 470 kΩ or less. A capacitor from ADJ to
ground provides greatly improved noise performance.
FIGURE 4-3: Ultra-Low-Noise
Adjustable-Voltage Application.
Figure 4-3 includes the optional 470 pF noise bypass
capacitor from ADJ to GND to reduce output noise.
4.10 Dual-Supply Operation
When used in dual-supply systems where the regulator
load is returned to a negative supply, the output voltage
must be diode clamped to ground.
4.11 USB Application
Figure 4-4 shows the MIC5207-3.3YM5 in a USB
application. Because the VBUS supply may be greater
than 10 inches from the regulator, a 1 µF input
capacitor is included.
FIGURE 4-4: Single-Port Self-Powered
Hub.
15
2
34
1.0μF
VOUT
MIC5207-x.xYM5
VIN
EN
ENABLE
SHUTDOWN
VOUT VREF 1R2
R1
-------+


1.242V1R2
R1
-------+


==
15
2
34
2.2μF
VOUT
MIC5207YM5
VIN
470pF
R1
R2
D+
D–
GND
USB
PORT
DATA
EN OUT
FLG IN
ON/OFF
OVERCURRENT
MIC2525USB CONTROLLER
GND OUT
IN
V
CC
5.0V
0.1μF
10K
UPSTREAM
V
BUS
V
BUS
100mA MAX.
FERRITE
BEADS
150μF
D+
D–
GND
DATA
1μF 1μF
V
BUS
15
2
34
V
OUT
MIC5207-3.3YM5
V
IN
E5 namr ( D
MIC5207
DS20005719B-page 14 2017-2018 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
5-Pin SOT-23* Example
5-Pin TSOT*
XXXX
NNN
LE50
943
XXXX
NNN
Example
NA18
235
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
3
e
3
e
TITLE 5 LEAD SOT23 PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING u T SOT LD’FL’l UNIT T MM 2.90i0.l0 H095 TYF‘ 3 2 T a M z 7 7 mm 3 ii i ‘ i (am) T 3 o T u ‘ ge ‘ E 8 T 7 27774777777 2 a T T 32 53 T T 7 N + gamma 7 T 7 T is m i ' 25.2) T 32 0250 WM 10' WP D “UTE—5W (zpux) 3; TOP VTEW W STDE VTEW F 095 550 74‘ i 35 m m o M ‘ 7% a , 3‘s" T :1 2. T , c N T 2 m 0.0 o N mm o2 3' T um EE 3 3 r M RECOMMENDED LAND PATTERN NoTE: PACKAGE ouTuNE EXCLUSWE OF MOLD FLASH a: EURR PACKAGE ouTLTNE TNcLusTVE OF soLEP PLATTNG DTNENsToN AND TOLERANCE PER ANST mum 1952 FOOT LENGTH MEASUREMENT BASED ON GAUGE PLANE METHOD, DTE FACES uP FOR MOLD, AND FACES DOWN FOP TRTM/FOPM ALL DTNEMsToNs ARE TN MTLLTMETERS mmyguru‘
2017-2018 Microchip Technology Inc. DS20005719B-page 15
MIC5207
5-Lead SOT-23 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
TITLE 5 LEAD TSOT PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING I: | TSOT’SLDi PL’I UNIT | M n m m u um / 2 ac Esc A 2 an Esc m: Essa: 5:: mm w END VIEW m‘aAJ “rm: [2 phzs) ? § a s ' 2 § 3 mm mu g mum a Lima mp VIEW mm ‘ mum: ‘ ‘ . DETAIL 'A” 1 an Bsc :ims nsc s 3 NOTE *—}i g g 1. Dimensions and Kclzrunce: II: as Der ANSI N " m 5m, 1994 2 Die is racmg u m mold me is facing a dam for mm cm. 1: reverse tum/[crux a A Dimensions are Exclusive of mm um. and gate burr § A The foollenglh measunng is based on the gauge plane method "mm 5. Au spemncauon camply m Jedec Spec Moms lalue Q 5 AH ammmns are m milhmeters RECDMMENDED LAND PATTERN
MIC5207
DS20005719B-page 16 2017-2018 Microchip Technology Inc.
5-Lead TSOT Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017-2018 Microchip Technology Inc. DS20005719B-page 17
MIC5207
APPENDIX A: REVISION HISTORY
Revision A (February 2017)
• Converted Micrel document MIC5207 to Micro-
chip data sheet DS20005719A.
• Minor text changes throughout.
• Removed all reference to discontinued leaded
parts.
• Added θJC value for SOT-23 package in Tempera-
ture Specifications section.
Revision B (September 2018)
Updated to Revision 20005719B by revising
Equation 4-8 to improve productivity.
MIC5207
DS20005719B-page 18 2017-2018 Microchip Technology Inc.
NOTES:
PART NO. v X.X T 41x 41x 4K
2017-2018 Microchip Technology Inc. DS20005719B-page 19
MIC5207
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MIC5207-1.8YD5-TR: 180 mA Low-Noise LDO
Regulator, 1.8V Voltage, 5-Lead
TSOT, –40°C to +125°C
Temperature Range,
3,000/Reel
b) MIC5207-2.5YM5-TR: 180 mA Low-Noise LDO
Regulator, 2.5V Voltage, 5-Lead
SOT-23, –40°C to +125°C
Temperature Range,
3,000/Reel
c) MIC5207-2.5YM5-TX: 180 mA Low-Noise LDO
Regulator, 2.5V Voltage, 5-Lead
SOT-23, –40°C to +125°C
Temperature Range,
3,000/Reel (Reverse Pin 1)
d) MIC5207YM5-TR: 180 mA Low-Noise LDO
Regulator, Adj. Voltage, 5-Lead
SOT-23, –40°C to +125°C
Temperature Range,
3,000/Reel
e) MIC5207-2.9YM5-TR: 180 mA Low-Noise LDO
Regulator, 2.9V Voltage, 5-Lead
SOT-23, –40°C to +125°C
Temperature Range,
3,000/Reel
f) MIC5207-3.1YM5-TR: 180 mA Low-Noise LDO
Regulator, 3.1V Voltage, 5-Lead
SOT-23, –40°C to +125°C
Temperature Range,
3,000/Reel
g) MIC5207-5.0YM5-TR: 180 mA Low-Noise LDO
Regulator, 5.0V Voltage, 5-Lead
SOT-23, –40°C to +125°C
Temperature Range,
3,000/Reel
h) MIC5207-3.3YM5-TX: 180 mA Low-Noise LDO
Regulator, 3.3V Voltage, 5-Lead
SOT-23, –40°C to +125°C
Temperature Range,
3,000/Reel (Reverse Pin 1)
PART NO. X
Package
Device
Device: MIC5207: 180 mA Low Noise LDO Regulator
Voltage: (blank) = Adjustable
1.8 = 1.8V
2.5 = 2.5V
2.8 = 2.8V
2.9 = 2.9V
3.0 = 3.0V
3.1 = 3.1V
3.2 = 3.2V
3.3 = 3.3V
4.0 = 4.0V
5.0 = 5.0V
Temperature: Y = –40°C to +125°C
Package: D5 = 5-Lead TSOT
M5 = 5-Lead SOT-23
Media Type: TR = 3,000/Reel
TX = 3,000/Reel (Reverse Pin 1 Orientation)
X
Temperature
XX
–
Media Type
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
–
X.X
Voltage
MIC5207
DS20005719B-page 20 2017-2018 Microchip Technology Inc.
NOTES:
YSTEM
2017-2018 Microchip Technology Inc. DS20005719B-page 21
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2017-2018, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-3498-6
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
6‘ ‘MICRDCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
DS20005719B-page 22 2017-2018 Microchip Technology Inc.
AMERICAS
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10/25/17