Knowles Syfer 的 MLCC High Reliability 规格书

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MLCC IECQ-CECC MLCC Capacitors

High Reliability IECQ-CECC Ranges

A range of specialist high reliability MLCCs for use in

critical or high reliability environments. All fully

tested/approved and available with a range of suitable

termination options, including tin/lead plating and Syfer

FlexiCap™.

Electrical Details

Capacitance Range 0.47pF to 6.8µF

Temperature Coefficient of

Capacitance (TCC)

C0G/NP0 0 ± 30ppm/˚C

X7R ±15% from -55˚C to +125˚C

Dissipation Factor

C0G/NP0

Cr > 50pF ≤0.0015

Cr ≤ 50pF = 0.0015(15÷Cr+0.7)

X7R ≤ 0.025

Insulation Resistance (IR) 100G or 1000secs (whichever is the less)

Dielectric Withstand Voltage (DWV) Voltage applied for 5 ±1 seconds, 50mA

charging current maximum

Ageing Rate

C0G/NP0 Zero

X7R <2% per time decade

IECQ-CECC – maximum capacitance values

0603 0805 1206 1210 1808 1812 2220 2225

16V C0G/NP0 1.5nF 6.8nF 22nF 33nF 33nF 100nF 150nF 220nF

X7R 100nF 330nF 1.0μF 1.5μF 1.5μF 3.3μF 5.6μF 6.8μF

25V C0G/NP0 1.0nF 4.7nF 15nF 22nF 27nF 68nF 100nF 150nF

X7R 56nF 220nF 820nF 1.2μF 1.2μF 2.2μF 4.7μF 5.6μF

50/63V C0G/NP0 470pF 2.7nF 10nF 18nF 18nF 33nF 68nF 100nF

X7R 47nF 220nF 470nF 1.0μF 680nF 1.5μF 2.2μF 3.3μF

100V C0G/NP0 330pF 1.8nF 6.8nF 12nF 12nF 27nF 47nF 68nF

X7R 10nF 47nF 150nF 470nF 330nF 1.0μF 1.5μF 1.5μF

200/250V C0G/NP0 100pF 680pF 2.2nF 4.7nF 4.7nF 12nF 22nF 27nF

X7R 5.6nF 27nF 100nF 220nF 180nF 470nF 1.0μF 1.0μF

500V C0G/NP0 n/a 330pF 1.5nF 3.3nF 3.3nF 10nF 15nF 22nF

X7R n/a 8.2nF 33nF 100nF 100nF 270nF 560nF 820nF

1kV C0G/NP0 n/a n/a 470pF 1.0nF 1.2nF 3.3nF 8.2nF 10nF

X7R n/a n/a 4.7nF 15nF 18nF 56nF 120nF 150nF

Ordering Information – IECQ-CECC Range

1210 Y 100 0103 J D T _ _ _

Chip Size Termination Rated Voltage Capacitance in Pico

farads (pF) Capacitance

Tolerance Dielectric

Codes Packaging Suffix code

0603

0805

1206

1210

1808

1812

2220

2225

Y = FlexiCap™

termination base with

nickel barrier (100%

matte tin plating).

RoHS compliant.

H = FlexiCap™

termination base with

nickel barrier (Tin/

lead plating with min.

10% lead). Not RoHS

compliant.

F = Silver Palladium.

RoHS compliant.

J = Silver base with

nickel barrier (100%

matte tin plating).

RoHS compliant.

A = Silver base with

nickel barrier (Tin/lead

plating with min. 10%

lead). Not RoHS

compliant.

016 = 16V

025 = 25V

050 = 50V

063 = 63V

100 = 100V

200 = 200V

250 = 250V

500 = 500V

1K0 = 1kV

First digit is 0.

Second and third digits are

significant figures of

capacitance code. The fourth

digit is number of zeros

following. Example:

0103 = 10nF

<10pF

B = ±0.1pF

C = ±0.25pF

D = ±0.5pF

≥ 10pF

F = ±1%

G = ±2%

J = ±5%

K = ±10%

M = ±20%

D = X7R (2R1) with

IECQCECC release

F = C0G/NP0

(1B/NP0) with

IECQCECC release

B = 2X1/BX

released in

accordance with

IECQ-CECC

R = 2C1/BZ

released in

accordance with

IECQ-CECC

For B and R codes

please refer to

TCC/VCC range for

full capacitance

values

T = 178mm

(7”) reel

R = 330mm

(13”) reel

B = Bulk pack

- tubs or trays

Used for specific

customer

requirements

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Soldering Information

Syfer MLCCs are compatible with all recognised

soldering/mounting methods for chip capacitors. A detailed

application note is available at syfer.com

Reflow Soldering

Syfer recommend reflow soldering as the preferred method for

mounting MLCCs. Syfer MLCCs can be reflow soldered using a

reflow profile generally defined in IPC/FEDEC J-STD-020. Sn

plated termination chip capacitors are compatible with both

conventional and lead free soldering with peak temperatures of

260 to 270˚C acceptable.

The heating ramp rate should be such that components see a

temperature rise of 1.5 to 4˚C per second to maintain

temperature uniformity through the MLCC.

The time for which the solder is molten should be maintained

at a minimum, so as to prevent solder leaching. Extended

times above 230˚C can cause problems with oxidation of Sn

plating. Use of an inert atmosphere can help if this problem is

encountered. Palladium/Silver (Pd/Ag) terminations can be

particularly susceptible to leaching with free lead, tin rich

solders and trials are recommended for this combination.

Cooling to ambient temperature should be allowed to occur

naturally, particularly if larger chip sizes are being soldered.

Natural cooling allows a gradual relaxation of thermal

mismatch stresses in the solder joints. Forced cooling should

be avoided as this can induce thermal breakage.

Wave Soldering

Wave soldering is generally acceptable, but the thermal

stresses caused by the wave have been shown to lead to

potential problems with larger or thicker chips. Particular care

should be taken when soldering SM chips larger than size 1210

and with a thickness greater than 1.0mm for this reason.

Maximum permissible wave temperature is 270˚C for SM

chips.

The total immersion time in solder should be kept to a

minimum. It is strongly recommended that Sn/Ni plated

terminations are specified for wave soldering applications.

Solder Leaching

Leaching is the term for the dissolution of silver into the solder

causing a failure of the termination system which causes

increased ESR, tan δ and open circuit faults, including

ultimately the possibility of the chip becoming detached.

Leaching occurs more readily with higher temperature solders

and solders with a high tin content. Pb free solders can be very

prone to leaching certain termination systems. To prevent

leaching, exercise care when choosing solder allows and

minimize both maximum temperature and dwell time with the

molten solder.

Plated terminations with nickel or copper anti-leaching barrier

layers are available in a range of top coat finishes to prevent

leaching occurring. These finishes also include Syfer FlexiCapTM

for improved stress resistance post soldering.

Multilayer ceramic chip with nickel or copper barrier

termi

natio

Rework of Chip Capacitors

Syfer recommend hot air/gas as the preferred method of

applying heat for rework. Apply even heat surrounding the

component to minimise internal thermal gradients. Soldering

irons or other techniques that apply direct heat to the chip or

surrounding area should not be used as these can result in

micro cracks being generated.

Minimise the rework heat duration and allow components to

cool naturally after soldering.

Use of Silver Loaded Epoxy Adhesives

Chip capacitors can be mounted to circuit boards using silver

loaded adhesive provided the termination material of the

capacitor is selected to be compatible with the adhesive. This

is normally PdAg. Standard tin finishes are often not

recommended for use with silver loaded epoxies as there can

be electrical and mechanical issues with the joint integrity due

to material mismatch.

Handling & Storage

Components should never be handled with fingers;

perspiration and skin oils can inhibit solderability and will

aggravate cleaning.

Chip capacitors should never be handled with metallic

instruments. Metal tweezers should never be used as these

can chip the product and leave abraded metal tracks on the

product surface. Plastic or plastic coated metal types are

readily available and recommended – these should be used

with an absolute minimum of applied pressure.

Incorrect storage can lead to problems for the user. Rapid

tarnishing of the terminations, with an associated degradation

of solderability, will occur if the product comes into contact

with industrial gases such as sulphur dioxide and chlorine.

Storage in free air, particularly moist or polluted air, can result

in termination oxidation.

Packaging should not be opened until the MLCs are required

for use. If opened, the pack should be re-sealed as soon as

practicable. Alternatively, the contents could be kept in a

sealed container with an environmental control agent.

Long term storage conditions, ideally, should be temperature

controlled between -5 and +40˚C and humidity controlled

between 40% and 60% R.H.

Taped product should be stored out of direct sunlight, which

might promote deterioration in tape or adhesive performance.

Product, stored under the conditions recommended above, in

its “as received” packaging, has a minimum shelf life of 2

years.

SM Pad Design

Syfer conventional 2-terminal chip capacitors can generally be

mounted using pad designs in accordance with IPC-7351,

Generic Requirements for Surface Mount Design and Land

Pattern Standards, but there are some other factors that have

been shown to reduce mechanical stress, such as reducing the

pad width to less than the chip width. In addition, the position

of the chip on the board should also be considered.

3-terminal components are not specifically covered by IPC-

7351, but recommended pad dimensions are included in the

Syfer catalogue/website for these components.

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FlexiCapTM Termination

FlexiCapTM has been developed as a result of listening to

customer’s experiences of stress damage to MLCCs from many

manufacturers, often caused by variations in production

processes.

Our answer is a proprietary flexible epoxy polymer termination

material that is applied to the device under the usual nickel

barrier finish. FlexiCapTM will accommodate a greater degree of

board bending than conventional capacitors.

Ranges are available with FlexiCapTM termination material

offering increased reliability and superior mechanical

performance (board flex and temperature cycling) when

compared with standard termination materials. Refer to Syfer

application note reference AN0001. FlexiCapTM capacitors

enable the board to be bent almost twice as much as before

mechanical cracking occurs. Refer to application note AN0002.

FlexiCapTM is also suitable for space applications having passed

thermal vacuum outgassing tests. Refer to Syfer application

note reference AN0026.

Syfer has delivered millions of FlexiCapTM components and

during that time has collected substantial test and reliability

data, working in partnership with customers world wide, to

eliminate mechanical cracking.

An additional benefit of FlexiCapTM is that MLCCs can withstand

temperature cycling from -55 to 125˚C in excess of 1,000

times without cracking.

FlexiCapTM termination has no adverse effect on any electrical

parameters, nor affects the operation of the MLCC in any way.

Application Notes

FlexiCapTM may be handled, stored and transported in the

same manner as standard terminated capacitors. The

requirements for mounting and soldering FlexiCapTM are the

same as for standard SMD capacitors.

For customers currently using standard terminated capacitors

there should be requirement to change the assembly process

when converting to FlexiCapTM.

Based upon the board bend tests in accordance with IEC

60384-1 the amount of board bending required to

mechanically crack a FlexiCapTM terminated capacitor is

significantly increased compared with standard terminated

capacitors.

Product: X7R Typical bend performance under

AEC-Q200 test conditions

Standard

Termination 2mm to 3mm

FlexiCapTM Typically 8mm to 10mm

REACH (Registration, Evaluation, Authorisation and

restriction of Chemicals) Statement

The main purpose of REACH is to improve the protection of

human health and the environment from the risks arising from

the use of chemicals.

Syfer Technology Ltd maintains both ISO 14001,

Environmental Management System and OHSAS 18001 Health

& Safety Management System approvals that require and

ensure compliance with corresponding legislation such as

REACH.

For further information, please contact the sales office at

SyferSales@knowles.com

RoHS Compliance

Syfer routinely monitors world wide material restrictions (e.g.,

EU/China and Korea RoHS mandates) and is actively involved

in shaping future legislation.

All standard C0G/NPO, X7R, X5R and High Q Syfer MLCC

products are compliant with the EU RoHS directive (see below

for special exemptions) and those with plated terminations are

suitable for soldering common lead free solder alloys (refer to

‘Soldering Information’ for more details on soldering

limitations). Compliance with EU RoHS directive automatically

signifies compliance with some other legislation (e.g., Korea

RoHS). Please refer to the Sales Office for details of

compliance with other materials legislation.

Breakdown of material content, SGS analysis reports and tin

whisker test results are available on request.

Most Syfer MLCC components are available with non-RoHS

compliant tin/lead (SnPb) Solderable termination finish for

exempt applications and where pure tin is not acceptable.

Other tin free termination finishes may also be available –

please refer to the Sales Office for further details.

X8R ranges <250Vdc are not RoHS 2011/65/EU compliant.

Check the website, www.knowlescapacitors.com/syfer for

latest RoHS update.

Export Controls and Dual-use Regulations

Certain Syfer catalogue components are defined as ‘dual-use’

items under international export controls – those that can be

used for civil and military purposes which meet certain

specified technical standards.

The defining criteria for a dual-use component with respect to

Syfer products is one with a voltage rating of >750V and a

capacitance value >250nF and a series inductance <10nH.

Components defined as ‘dual-use’ under the above criteria

automatically require a licence for export outside the EU, and

may require a licence for export with the EU.

The application for a licence is routine, but customers for these

products will be asked to supply further information.

Please refer to the sales office if you require any further

information on export restrictions.

Other special components may additionally need to comply

with export regulations.

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Ageing of Ceramic Capacitors

Capacitor ageing is a term used to describe the negative,

logarithmic capacitance change which takes place in ceramic

capacitors with time. The crystalline structure for barium

titanate based ceramics changes on passing through its Curie

temperature (known as the Curie Point) at about 125ºC. The

domain structure relaxes with time and in doing so, the

dielectric constant reduces logarithmically; this is known as the

ageing mechanism of the dielectric constant. The more stable

dielectrics have the lowest ageing rates.

The ageing process is reversible and repeatable. Whenever the

capacitor is heated to a temperature above the Curie Point the

ageing process starts again from zero.

The ageing constant, or ageing rate, is defined as the

percentage loss of capacitance due to the ageing process of

the dielectric which occurs during a decade of time (a tenfold

increase in age) and is expressed as percent per logarithmic

decade of hours. As the law of decrease of capacitance is

logarithmic, this means that for a capacitor with an ageing rate

of 1% per decade of time, the capacitance will decrease at a

rate of:

a) 1% between 1 and 10 hours

b) An additional 1% between the following 10 and 100

hours

c) An additional 1% between the following 100 and 1000

hours

d) An additional 1% between the following 1000 and

10000 hours

e) The ageing rate continues in this manner throughout

the capacitor’s life.

Typical values of the ageing constant for our MLCCs are

Dielectric Class Typical Values

Ultra Stable C0G/NP0 Negligible capacitance loss

through ageing

Stable X7R <2% per decade of time

Capacitance Measurements

Because of ageing it is necessary to specify an age for

reference measurements at which the capacitance shall be

within the prescribed tolerance. This is fixed at 1000 hours,

since for all practical purposes there is not much further loss of

capacitance after this time.

All capacitors shipped are within their specified tolerance at the

standard reference age of 1000 hours after having cooled

through their Curie temperature.

The ageing curve for any ceramic dielectric is a straight line

when plotted on semi-log paper.

Capacitance vs. Time

(Ageing X7R @ 1% per decade)

Tight Tolerance

One of the advantages of Syfer’s unique ‘wet process’ of

manufacture is the ability to offer capacitors with exceptionally

tight capacitance tolerances.

The accuracy of the printing screens used in the fully

automated, computer controlled manufacturing process allows

for tolerance as close as ± 1% on C0G/NP0 parts greater than

or equal to 10pF. For capacitance value less than 4.7pF

tolerances can be as tight as ± 0.05pF.

Periodic Tests Conducted and Reliability Data

For standard surface mount capacitors components are

randomly selected on a sample basis and the following routine

tests conducted:

 Load Test. 1,000 hours @ 125˚C (150˚C for X8R).

Applied voltage depends on components tested

 Humidity Test. 168 hours @ 85˚C/85%RH

 Board Deflection (bend test)

Test results are available on request.

Conversion Factors

From To Operation

FITs MTBF (hours) 109 ÷ FITs

FITs MTBF (years) 109 ÷ (FITs × 8760)

FIT = Failures In Time. 1 FIT = 1 failure in 109 hours

MTBF = Mean Time Between Failure

Example of FIT Data Available

Component type: 0805 (C0G/NP0 and X7R)

Testing Location: Syfer reliability test department

Results based on: 16,622,000 component test hours

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Packaging Information

Tape and reel packing of surface mounting chip capacitors for

automatic placement are in accordance with IEC60286-3.

Peel Force

The peel force of the top sealing tape is between 0.2 and 1.0

Newton at 180˚. The breaking force of the carrier and sealing

tape in the direction of unreeling is greater than 10 Newton.

Reel Dimensions

Symbol

Description 178mm

Reel 330mm

Reel

A Reel diameter 178

(7)

330

(13)

G Reel inside width 8.4

(0.33)

12.4

(0.49)

T Reel outside width 14.4

(0.56) max

18.4

(0.72) max

Tape Dimensions

Dimensions mm (inches)

Symbol Description 8mm Tape 12mm Tape

Width of cavity

Length of cavity

Depth of cavity

Dependent on chip size to minimize rotation

W Width of tape 8.0 (0.315) 12.0 (0.472)

F Distance between drive hole centres and cavity centres 3.5 (0.138) 5.5 (0.213)

E Distance between drive hole centres and tape edge 1.75 (0.069)

P1 Distance between cavity centres 4.0 (0.156) 8.0 (0.315)

P2 Axial distance between drive hole centres and cavity centres 2.0 (0.079)

P0 Axial distance between drive hole centres 4.0 (0.156)

D0 Drive hole diameter 1.5 (0.059)

D1 Diameter of cavity piercing 1.0 (0.039) 1.5 (0.059)

T Carrier tape thickness 0.3 (0.012) ±0.1 (0.04) 0.4 (0.016) ±0.1 (0.04)

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t1 Top tape thickness 0.1 (0.004) max

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Packing Information

Missing Components

The number of missing components in the tape may not

exceed 0.25% of the total quantity with not more than three

consecutive components missing. This must be followed by at

least six properly placed components

Identification

Each reel is labelled with the following information:

manufacturer, chip size, capacitance, tolerance, rated voltage,

dielectric type, batch number, date code and quantity of

components.

Leader Trailer

Component Orientation

Tape and reeling is in accordance with IEC 60286 part 3, which

defines the packaging specifications for leadless components

on continuous tapes.

Notes: 1) IEC60286-3 states A0 <B0

2) Regarding the orientation of 1825 and 2225

components, the termination bands are right to

left, NOT front to back. Please see diagram.

Outer Packaging

Outer carton dimensions mm (inches) max

Reel Size No. of Reels L W T

178

(7) 1 185

(7.28)

185

(7.28)

(0.98)

178

(7) 4 190

(7.48)

195

(7.76)

(2.95)

330

(13) 1 335

(13.19)

335

(13.19)

(0.98)

Reel Quantities

Chip Size 0402 0505 0603 0805 1111

1206

1210

1410

1808

1812

1825 2211 2215

2220

2225

Max. Chip Thickness 0.5mm 1.3mm 0.8mm 1.3mm 2.0mm

1.6mm

2.0mm

2.5mm

2.5mm 2.5mm 2.5mm

2.5mm

0.02” 0.05” 0.03” 0.05” 0.08” 0.06” 0.08” 0.08” 0.08” 0.1” 0.1” 0.1” 0.1” 0.1” 0.1”

Reel

Quantities

178mm

(7”) 5000 2500 4000 3000 1000 2500 2000 2000 1500 500/

1000 500 750 500 500/

1000

500/

1000

330mm

(13”) - - 16000 12000 - 10000 8000 8000 6000 2000/

4000 2000 - 4000 2000/

4000

2000/

4000

Notes:

1) The above quantities per reel are for the maximum manufactured chip thickness. Thinner chips can be taped in larger

quantities per reel.

2) Where two different quantities are shown for the same case size, please contact the sales office to determine the exact

quantity for any specific part number.

Bulk Packing – Tubs

Chips are supplied in rigid re-sealable plastic tubs together

with impact cushioning wadding. Tubs are labelled with the

details: chip size, capacitance, tolerance, rated voltage,

dielectric type, batch number, date code and quantity of

components.

Dimensions mm (inches)

H 60mm (2.36”)

D 50mm (1.97”)

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