Microchip Technology 的 2N2906A-07A 规格书

TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
PNP SMALL SIGNAL SILICON TRANSISTOR
Qualified per MIL-PRF-19500/291
T4-LDS-0059 Rev. 2 (100247) Page 1 of 6
DEVICES LEVELS
2N2906A 2N2907A JAN
2N2906AL 2N2907AL JANTX
2N2906AUA 2N2907AUA JANTXV
2N2906AUB 2N2907AUB JANS
2N2906AUBC * 2N2907AUBC *
* Available to JANS quality level only.
ABSOLUTE MAXIMUM RATINGS (TC = +25°C unless otherwise noted)
Parameters / Test Conditions Symbol Value Unit
Collector-Emitter Voltage VCEO 60 Vdc
Collector-Base Voltage VCBO 60 Vdc
Emitter-Base Voltage VEBO 5.0 Vdc
Collector Current IC 600 mAdc
Total Power Dissipation @ TA = +25°C PT 0.5 W
Operating & Storage Junction Temperature Range Top, Tstg -65 to +200 °C
Note: Consult 19500/291 for Thermal Performance Curves.
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted)
Parameters / Test Conditions Symbol Min. Max. Unit
OFF CHARACTERTICS
Collector-Emitter Breakdown Voltage
IC = 10mAdc V(BR)CEO 60 Vdc
Collector-Base Cutoff Current
VCB = 60Vdc
VCB = 50Vdc ICBO
10
10
μAdc
ηAdc
Emitter-Base Cutoff Current
VEB = 4.0Vdc
VEB = 5.0Vdc IEBO
50
10
ηAdc
μAdc
Collector-Emitter Cutoff Current
VCE = 50Vdc ICES 50 ηAdc
TO-18 (TO-206AA)
2N2906A, 2N2907A
4 PIN
2N2906AUA, 2N2907AUA
3 PIN
2N2906AUB, 2N2907AUB
2N2906AUBC, 2N2907AUBC
(UBC = Ceramic Lid Version)
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0059 Rev. 2 (100247) Page 2 of 6
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted)
Parameters / Test Conditions Symbol Min. Max. Unit
ON CHARACTERISTICS (4)
Forward-Current Transfer Ratio
IC = 0.1mAdc, VCE = 10Vdc 2N2906A, L, UA, UB, UBC
2N2907A, L, UA, UB, UBC 40
75
IC = 1.0mAdc, VCE = 10Vdc 2N2906A, L, UA, UB, UBC
2N2907A, L, UA, UB, UBC 40
100 175
450
IC = 10mAdc, VCE = 10Vdc 2N2906A, L, UA, UB, UBC
2N2907A, L, UA, UB, UBC 40
100
IC = 150mAdc, VCE = 10Vdc 2N2906A, L, UA, UB, UBC
2N2907A, L, UA, UB, UBC 40
100 120
300
IC = 500mAdc, VCE = 10Vdc 2N2906A, L, UA, UB, UBC
2N2907A, L, UA, UB, UBC
hFE
40
50
Collector-Emitter Saturation Voltage
IC = 150mAdc, IB = 15mAdc
IC = 500mAdc, IB = 50mAdc VCE(sat) 0.4
1.6
Vdc
Base-Emitter Saturation Voltage
IC = 150mAdc, IB = 15mAdc
IC = 500mAdc, IB = 50mAdc VBE(sat) 0.6
1.3
2.6
Vdc
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions Symbol Min. Max. Unit
Forward Current Transfer Ratio
IC = 1.0mAdc, VCE = 10Vdc, f = 1.0kHz 2N2906A, L, UA, UB, UBC
2N2907A, L, UA, UB, UBC
hfe 40
100
Magnitude of Small–Signal Forward Current Transfer Ratio
IC = 20mAdc, VCE = 20Vdc, f = 100MHz |hfe| 2.0
Output Capacitance
VCB = 10Vdc, IE = 0, 100kHz f 1.0MHz Cobo 8.0 pF
Input Capacitance
VEB = 2.0Vdc, IC = 0, 100kHz f 1.0MHz Cibo 30 pF
SWITCHING CHARACTERISTICS
Parameters / Test Conditions Symbol Min. Max. Unit
Turn-On Time
VCC = 30Vdc; IC = 150mAdc; IB1 = 50mAdc t
on 45
ηs
Turn-Off Time
VCC = 30Vdc; IC = 150mAdc; IB1 = -IB2 = 50mAdc
toff 300
ηs
(4) Pulse Test: Pulse Width = 300μs, Duty Cycle 2.0%.
4|: SEATING 'Llll lesical dimensions similar to T0-18
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0059 Rev. 2 (100247) Page 3 of 6
PACKAGE DIMENSIONS
NOTES: Dimensions
1. Dimensions are in inches. Symbol Inches Millimeters Note
2. Millimeters are given for general information only. Min Max Min Max
3. Beyond r (radius) maximum, TW shall be held for a minimum length CD .178 .195 4.52 4.95
of .011 inch (0.28 mm). CH .170 .210 4.32 5.33
4. Dimension TL measured from maximum HD. HD .209 .230 5.31 5.84
5. Body contour optional within zone defined by HD, CD, and Q. LC .100 TP 2.54 TP 6
6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) LD .016 .021 0.41 0.53 7,8
below seating plane shall be within .007 inch (0.18 mm) radius of LL .500 .750 12.70 19.05 7,8,13
true position (TP) at maximum material condition (MMC) relative to LU .016 .019 0.41 0.48 7,8
tab at MMC. L1 .050 1.27 7,8
7. Dimension LU applies between L1 and L2. Dimension LD applies L2 .250 6.35 7,8
between L2 and LL minimum. Diameter is uncontrolled in L1 and P .100 2.54
beyond LL minimum. Q .030 0.76 5
8. All three leads. TL .028 .048 0.71 1.22 3,4
9. The collector shall be internally connected to the case. TW .036 .046 0.91 1.17 3
10. Dimension r (radius) applies to both inside corners of tab. r .010 0.25 10
11. In accordance with ASME Y14.5M, diameters are equivalent to φx α 45° TP 45° TP 6
symbology.
12. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
13. For L suffix devices, dimension LL = 1.5 inches (38.10 mm) min.
and 1.75 inches (44.45 mm) max.
FIGURE 1. Physical dimensions (similar to TO-18)
o Microsemi EL >1 u—frI‘ l \\ m. UA :‘2 I tn._L['JwO— —Or-1lnm I 1 x L .7 \ A. firm; KANE / ‘7 334 — H *0 mar -m1:mvl:~x-n dimensions surface mount (UA version
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0059 Rev. 2 (100247) Page 4 of 6
NOTES: Dimensions
1. Dimensions are in inches. Symbol Inches Millimeters
Note
2. Millimeters are given for general information only. Min Max Min Max
3. Dimension “CH” controls the overall package thickness. When a BL .215 .225 5.46 5.71
window lid is used, dimension “CH” must increase by a minimum of BL2 .225 5.71
.010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm). BW .145 .155 3.68 3.93
4. The corner shape (square, notch, radius) may vary at the BW2 .155 3.93
manufacturer's option, from that shown on the drawing. CH .061 .075 1.55 1.90 3
5. Dimensions “LW2” minimum and “L3” minimum and the appropriate L3 .003 .007 0.08 0.18 5
castellation length define an unobstructed three-dimensional space LH .029 .042 0.74 1.07
traversing all of the ceramic layers in which a castellation was LL1 .032 .048 0.81 1.22
designed. (Castellations are required on the bottom two layers, LL2 .072 .088 1.83 2.23
optional on the top ceramic layer.) Dimension “LW2” maximum and LS .045 .055 1.14 1.39
“L3” maximum define the maximum width and depth of the LW .022 .028 0.56 0.71
castellation at any point on its surface. Measurement of these LW2 .006 .022 0.15 0.56 5
dimensions may be made prior to solder dipping.
6. The co-planarity deviation of all terminal contact points, as defined
by the device seating plane, shall not exceed .006 inch (0.15mm) for Pin no. 1 2 3 4
solder dipped leadless chip carriers. Transistor Collector Emitter Base N/C
7. In accordance with ASME Y14.5M, diameters are equivalent to φx
symbology.
FIGURE 2. Physical dimensions, surface mount (UA version)
I V g ,M / / / 7, O t I 9/ mi ' / / i 1 - - / a M ‘ V Symbol EH BL BW CL CW LL] LLZ NOTES: 1. Dimensinm 2. Millimctcrs a 3. Pad 1 = Base
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0059 Rev. 2 (100247) Page 5 of 6
Dimensions Dimensions
Symbol Inches Millimeters Note Symbol Inches Millimeters
Note
Min Max Min Max Min Max Min Max
BH .046 .056 1.17 1.42 LS1 .036 .040 0.91 1.02
BL .115 .128 2.92 3.25 LS2 .071 .079 1.81 2.01
BW .085 .108 2.16 2.74 LW .016 .024 0.41 0.61
CL .128 3.25
r .008 .203
CW .108 2.74
r1 .012 .305
LL1 .022 .038 0.56 0.96 r2 .022 .559
LL2 .017 .035 0.43 0.89
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid.
4. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
FIGURE 3. Physical dimensions, surface mount (UB version)
UB
V , / / 7, / L / i ' / / i 1 - - / a M ‘ V lesical dimensions surface mount (UBC version (cram
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0059 Rev. 2 (100247) Page 6 of 6
Dimensions Dimensions
Symbol Inches Millimeters Note Symbol Inches Millimeters
Note
Min Max Min Max Min Max Min Max
BH .046 .071 1.17 1.80 LS1 .036 .040 0.91 1.02
BL .115 .128 2.92 3.25 LS2 .071 .079 1.81 2.01
BW .085 .108 2.16 2.74 LW .016 .024 0.41 0.61
CL .128 3.25
r .008 .203
CW .108 2.74
r1 .012 .305
LL1 .022 .038 0.56 0.96 r2 .022 .559
LL2 .017 .035 0.43 0.89
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Hatched areas on package denote metalized areas.
4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Connected to the lid braze ring.
5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
FIGURE 4. Physical dimensions, surface mount (UBC version, ceramic lid)
UBC