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Learn essential skills for interpreting electronic component documentation. Explore pin configurations, operating conditions, truth tables, and timing diagrams.

This paper addresses engineers and developers, that are building a PCR test apparatus or any other device, that periodically performs temperature curves, with TEC Controllers.

This paper documents the use of the RS485 Interface of a Meerstetter TEC Controller. Additionally, the use of a Serial Server to connect over Ethernet is also described.

This paper describes how the rate of temperature change can be improved by increasing the parameter “Coarse Temp Ramp” when using the Meerstetter Engineering TEC Controllers.

Bergquist's SIL PAD TSP 3500 is a silicone elastomer formulated to maximize the dielectric and thermal performance.

Bergquist's GAP FILLER TGF 3600 is a two-component, liquid gap-filling material featuring ultra-high thermal performance.

Bergquist Company 是热管理材料开发与制造的领域的全球领导者，产品包括 Sil-Pad® 导热绝缘层和各种特种材料、Gap Pad® 间隙填充材料、Hi-Flow® 相变材料以及 Softface® 和 Bond-Ply®。

Rittal LLC is built on a strong tradition of innovation and takes pride in a progressive approach to engineering comprehensive and effective solutions that supports our customers in the pursuit of their goals..

随着电动汽车成为主要的交通工具，电池续航能力和更快的充电速度等因素将在全球经济中发挥关键作用。

DigiKey is an authorized reseller of StarTech.com products.

Parker Chomerics 的 THERM-A-GAP GEL 60HF 是一种非常适合大容量点胶应用的“高流量”凝胶。

Shiu Li Technology 提供 LiPOLY T 系列高导热间隙垫，旨在应用于 CPU/组件与散热器之间。

Shiu Li Technology 的 N 系列无硅胶导热间隙垫专为硬盘驱动器、光学设备、电动汽车等应用而设计。

Parker Chomerics 的 THERM-A-GAP PAD 80 是一款 8.3 W/m-K 高性能导热间隙填充垫。

具有离心风扇特性的紧凑型轴流风扇是热管理领域的一项创新。

Parker Chomerics 的 THERM-A-GAP GEL 75 设计为一种具有自动分配功能的单组分完全固化系统。

CUI Devices 的直流风扇和吹风机拥有最高可靠性和出色冷却能力，框架尺寸范围从 25 mm 至 172 mm，风量最大可达 382 CFM。

Parker Chomerics 的 THERM‐A‐GAP™ PAD 70TP 是一种高性能导热间隙填充垫，导热系数为 7.0 W/m‐K。

CUI Devices 的交流轴流风扇具有多种速度选项和额外的定制功能。